5842 results about "Cooling channel" patented technology

Devices and methods for cooling microwave antennas are disclosed herein. The cooling systems can be used with various types of microwave antennas. One variation generally comprises a handle portion with an elongate outer jacket extending from the handle portion. A microwave antenna is positioned within the handle and outer jacket such that cooling fluid pumped into the handle comes into contact directly along a portion of the length, or a majority of the length, or the entire length of the antenna to allow for direct convective cooling. Other variations include cooling sheaths which form defined cooling channels around a portion of the antenna. Yet another variation includes passively-cooled systems which utilize expandable balloons to urge tissue away from the surface of the microwave antenna as well as cooling sheaths which are cooled through endothermic chemical reactions. Furthermore, the microwave antennas themselves can have cooling lumens integrated directly therethrough.

A control channel configuration method and apparatus is provided for supporting Inter-Cell Interference Coordination (ICIC) in an OFDM-based communication system. The control channel configuration method includes determining a Resource Block (RB) to be used for configuring control channels; configuring the control channels by mapping the control channels in a data channel region within the RB; and transmitting the configured control channels, wherein configuring the control channels includes mapping the control channels in units of Resource Element Groups (REGs) formed by binding one or more Resource Elements (REs) in a time domain-preferred allocation manner within the same RB.

Apparatus and method are provided for facilitating cooling of an electronics rack employing a heat exchange assembly mounted to an outlet door cover hingedly affixed to an air outlet side of the rack. The heat exchange assembly includes a support frame, an air-to-liquid heat exchanger, and first and second perforated planar surfaces covering first and second main sides, respectively, of the air-to-liquid heat exchanger. The heat exchanger is supported by the support frame and includes inlet and outlet plenums disposed adjacent to the edge of the outlet door cover hingedly mounted to the rack. Each plenum is in fluid communication with a respective connect coupling, and the heat exchanger further includes multiple horizontally-oriented heat exchange tube sections each having serpentine cooling channel with an inlet and an outlet coupled to the inlet plenum and outlet plenum, respectively. Fins extend from the heat exchange tube sections.

A gas chamber contains upper and lower chamber bodies forming a cavity, a heating chuck for a wafer, a remote gas source, and an exhaust unit. Gas is injected into the cavity through channels in an injector. Each channel has sections that are bent with respect to each other at a sufficient angle to substantially eliminate entering light rays entering the channel from exiting the channel without reflection. The channels have funnel-shaped nozzles at end points proximate to the chuck. The injector also has thermal expansion relief slots and small gaps between the injector and mating surfaces of the chamber and gas source. The temperature of the injector is controlled by a cooling liquid in cooling channels and electrical heaters in receptacles of the injector. The upper chamber body is funnel-shaped and curves downward at an end of the upper chamber body proximate to the chuck.

A process chamber and a method for controlling the temperature of a substrate positioned on a substrate support assembly within the process chamber are provided. The substrate support assembly includes a thermally conductive body, a substrate support surface on the surface of the thermally conductive body and adapted to support a large area substrate thereon, one or more heating elements embedded within the thermally conductive body, and two or more cooling channels embedded within the thermally conductive body to be coplanar with the one or more heating elements. The cooling channels may be branched into two or more equal-length cooling passages being extended from a single point inlet and into a single point outlet to provide equal resistance cooling.

A substrate support assembly and method for controlling the temperature of a substrate within a process chamber with a temperature uniformity of + / −5° C. are provided. A substrate support assembly includes a thermally conductive body comprising an aluminum material, a substrate support surface on the surface of the thermally conductive body and adapted to support the large area glass substrate thereon, one or more heating elements embedded within the thermally conductive body, and one or more cooling channels embedded within the thermally conductive body and positioned around the one or more heating elements. A process chamber comprising the substrate support assembly of the invention is also provided.

An electric drive unit includes an electronic control and monitoring module integrally connected to an electric motor. The housing of the electric motor has a double-walled construction to form a water jacket with cooling water passages therein. The electronic module includes at least one high power component that requires cooling. This component is mounted directly on a cooling insert that extends through a recess in the electronic module housing and is inserted in an opening provided in the outer wall of the motor housing. In this manner, the cooling insert is integrated into the water jacket of the motor housing and is directly cooled by the cooling water flowing in the cooling passages. A very compact and reliable construction is achieved, in which the electric motor and the electronic module share a common water cooling circuit. External water hoses and external electrical connections between the electric motor and the electronic module are avoided.

Apparatus and method are provided for facilitating cooling of an electronics rack employing a heat exchange assembly mounted to an outlet door cover hingedly affixed to an air outlet side of the rack. The heat exchange assembly includes a support frame, an air-to-liquid heat exchanger, and first and second perforated planar surfaces covering first and second main sides, respectively, of the air-to-liquid heat exchanger. The heat exchanger is supported by the support frame and includes inlet and outlet plenums disposed adjacent to the edge of the outlet door cover hingedly mounted to the rack. Each plenum is in fluid communication with a respective connect coupling, and the heat exchanger further includes multiple horizontally-oriented heat exchange tube sections each having serpentine cooling channel with an inlet and an outlet coupled to the inlet plenum and outlet plenum, respectively. Fins extend from the heat exchange tube sections.

In a method of transmitting control signals for uplink transmission of packet data in a communication network, control signal data related to scheduling a user for uplink transmission of packet data is transmitted over a single control channel. The single control channel may be configured based on the transmission mode the user is in for scheduling an uplink transmission from the user to the network, so that only one control channel is used, regardless of the transmission mode the user is in for scheduling the user for the uplink transmission. The control channel may be embodied as a sub-frame adapted to carry control information that is dependent based on the transmission mode the user is in for scheduling an uplink transmission from the user to the network.

A surgical instrument extends through a guide tube in a minimally invasive surgical system. The instrument may be an operative instrument or a camera instrument. One or more illumination devices, such as LEDs, are place on a side of the instrument. A cooling channel in the instrument cools the illumination device(s).

A heat sink or cooling case has a cooling channel and at least one opening formed to face part of the channel. A first seal is provided outside the at least one opening. A cooling case has a groove located outside the first seal. Holes are discretely formed in the groove and leads from the groove to an exterior of the cooling case. A second seal is provided outside the groove. A radiating plate constituting a circuit case is mounted on the heat sink by using a clamping device inn or outside the second seal.

A metal vane core or strut (64) is formed integrally with an outer backing plate (40). An inner backing plate (38) is formed separately. A spring (74) with holes (75) is installed in a peripheral spring chamber (76) on the strut. Inner and outer CMC shroud covers (46, 48) are formed, cured, then attached to facing surfaces of the inner and outer backing plates (38, 40). A CMC vane airfoil (22) is formed, cured, and slid over the strut (64). The spring (74) urges continuous contact between the strut (64) and airfoil (66), eliminating vibrations while allowing differential expansion. The inner end (88) of the strut is fastened to the inner backing plate (38). A cooling channel (68) in the strut is connected by holes (69) along the leading edge of the strut to peripheral cooling paths (70, 71) around the strut. Coolant flows through and around the strut, including through the spring holes.

A showerhead that injects two process gases into the processing chamber via separate sets of holes. The showerhead is constructed of upper plate and lower plate. Upper plate has a first set of holes. The lower plate has two sets of holes: one set is aligned with the holes in the upper plate, while the second set has no corresponding holes in the upper plate. Both sets of holes in the lower plate are made to have two different diameters: a larger diameter extending from the top surface of the lower plate, while a smaller diameter extends from the bottom surface and meets with the larger diameter. A set of pipes are inserted through the holes in the upper plate and the corresponding holes in the lower plate, and are sealingly brazed to both plates. Cooling channels may be provided in the lower plate.

Devices and methods for cooling microwave antennas are disclosed herein. The cooling systems can be used with various types of microwave antennas. One variation generally comprises a handle portion with an elongate outer jacket extending from the handle portion. A microwave antenna is positioned within the handle and outer jacket such that cooling fluid pumped into the handle comes into contact directly along a portion of the length, or a majority of the length, or the entire length of the antenna to allow for direct convective cooling. Other variations include cooling sheaths which form defined cooling channels around a portion of the antenna. Yet another variation includes passively-cooled systems which utilize expandable balloons to urge tissue away from the surface of the microwave antenna as well as cooling sheaths which are cooled through endothermic chemical reactions. Furthermore, the microwave antennas themselves can have cooling lumens integrated directly therethrough.

A method for monitoring a control channel in a wireless communication system is provided. The method includes: dividing a control region of a subframe into a common search space having a variable size and monitored by every user equipment (UE) within a cell and a dedicated search space having a variable size and including at least one UE-specific search space to be monitored by at least one UE within the cell, and monitoring a control channel within the common search space; and monitoring a control channel within the UE-specific search space included in the dedicated search space. The performance of an overall system can be improved by effectively monitoring a downlink control channel.

Paging group identifiers are associated with groups of user equipment (UEs) in a hierarchical manner. A controller, such as a scheduler in an enhanced Node B, may address the groups of UEs using group identifiers over control channels. The controller may select a group identifier for a group of UEs from higher or lower levels of the hierarchy, depending upon the number of UEs to be paged and / or the number of available control channels over which paging resources are dynamically allocated to the UEs. UEs within the addressed groups monitor the corresponding paging channels for paging messages.

In a structure for mounting a battery pack on a vehicle, since a recess portion, into which a cross member is fitted, is formed on an upper face of a battery case so as to extend in a vehicle width direction, it is possible to mount the battery pack on a vehicle body without interfering with the cross member, and it is unnecessary to raise the position of the cross member or form a cutout in the cross member, thereby enabling a balance to be achieved between the capacity of a vehicle compartment and the strength of the cross member while ensuring a sufficient minimum ground clearance for the battery pack and preventing a battery from becoming wet. Furthermore, since the recess portion is formed on the upper face of the battery case, a cooling passage disposed beneath the battery is not narrowed, thus ensuring the battery cooling performance.

Uniform cooling of complex surface shapes in injection mold tooling can be accomplished with cooling channels that conform to the shapes of the mold cavity or mold cone. By conventional methods this can be very difficult to accomplish. By applying methods of material deposition or material sintering, which include but are not limited to, laser metal deposition, where material is deposited on a layer by layer basis, certain cooling or heating passages could be integrated into the manufactured component that follow the contours and profiles of the mold's complex surfaces. These passages would act as internal heat sinks with a much higher surface area for heat transfer than traditional drilled and plugged straight passages. These geometries could also be incorporated into complex geometries such as, but not limited to, turbine blades where the cooling passages can follow the contour of the outer shape, provide a more uniform or controlled heat transfer from the component. Multiple loops of cooling or heating channels could be designed and manufactured into solid objects for small-scale heat exchanger technologies.

A power electronics device for controlling an electric machine including a power section arranged within a housing which can be closed via a cover element. The power section has a plurality of capacitors and a plurality of power semiconductors which are connected to a power bus bar. In addition, a control device is provided for controlling the power electronics device. The capacitors, power semiconductors, and control device are cooled via a cooling device which is formed as a profile having an essentially U-shaped cross section. The cooling device has two lateral limbs and a base region through which cooling ducts are arranged. A suitable cooling medium flows through the cooling ducts and the ends of the cooling ducts opposite the housing cover are closed by a covering element. The capacitors, the power semiconductors and the control device are connected to the cooling device such that thermal exchange occurs between these components and the cooling device.

In a turbine bucket having an airfoil portion and a root portion with a platform at an interface between the airfoil portion and the root portion, a platform cooling arrangement including: a cooling passage defined in the platform to extend along at least a portion of a concave, pressure side of the airfoil portion, at least one cooling medium inlet to said cooling passage extending from an airfoil cooling medium cavity in a vicinity of an axial center of the airfoil portion, and at least one outlet opening for expelling cooling medium from said cooling passage.

A gas turbine vane to improve vane performance by addressing known failure mechanisms. A cooling circuit to the trailing edge of a vane airfoil is fed from the outer diameter platform, which prevents failure due to an oxidized and eroded airfoil trailing edge. The gas turbine includes an outer diameter platform, a hollow airfoil and an inner diameter platform with a plurality of cooling tubes extending radially through the airfoil. The cooling tubes are open at the outer diameter end and closed with covers at the inner diameter end. The inner diameter platform is also cooled and includes a meterplate for a portion of the cooling passageway and includes an undercut to improve thermal deflections of the inner diameter platform.

A cutting insert for chipforming machine has a tip face with a cutting edge. Grooves are formed in the top face and extend toward the cutting edge. Chip-deflecting projections extend upwardly from the top face and are situated in spaces formed between adjacent grooves. A jet of cooling fluid is directed toward inner ends of the grooves and travels between the projections and within the grooves toward the cutting edge.

A turbine element airfoil has a cooling passageway network with a slot extending from a trailing passageway toward the trailing edge. A number of discrete posts span the slot between pressure and suction sidewall portions.

Embodiments of the invention relate to a robust turbine vane made of stacked airfoil-shaped CMC laminates. Each laminate has an in-plane direction and a through thickness direction substantially normal to the in-plane direction. The laminates have anisotropic strength characteristics in which the in-plane tensile strength is substantially greater than the through thickness tensile strength. Thus, the laminates can provide strength in the direction of high thermal gradients and, thus, withstand the associated high thermal stresses. The laminates are relatively weak in through thickness (interlaminar) tension, but, in operation, relatively low through thickness tensile stresses can be expected. The laminates can be strong in through thickness compression; accordingly, the laminate stack can be held in through thickness compression by one or more fasteners. The CMC material can permit the inclusion of additional features such as cooling passages, ribs, spars, and thermal coatings, without compromising the strength characteristics of the material.

The present invention provides arrangements for electroluminescent displays 10 comprising a packaged semiconductor light emitting element 12 that has a light emitting display side 16. A heat sink 22 is disposed in the region of a rear side of the light-emitting element 12 opposite to the display side. Electrical connections 28 from the light emitting element 12 pass through said heat sink 22. Drive circuitry 30 for the light emitting element 12 is connected thereto by the electrical connections 28 and spaced apart from the heat sink 22 in such a manner that at least one cooling channel 34 is defined between the heat sink 22 and the drive circuitry 30 for the passage in use of a cooling fluid.

A high speed downlink packet access base station (HSPDA Node B) and a method therefore working in acknowledged mode (AM), the base station being adapted for unicast transmission on a physical downlink shared channel (HS-DSCH), by preceding announcement on a shared control channel (HS-SCCH) which shared control channel may be decoded by a given user entity using its own identity (UE-ID), each user entity (UE) being adapted for transmitting an acknowledge (ACK) or non-acknowledge (NACK) message pertaining to the reception of the given transmission on an uplink dedicated physical control channel (HS-DPCCH) pertaining to a given HARQ process of a given individual user entity. The base station is performing multicast transmissions (11, 401) on the physical downlink shared channel (HS-DSCH) by preceding announcement on the shared control channel (HS-SCCH) coded with a multicast identity (MU-ID) of a reserved address space, which downlink shared channel (HS-SCCH) may be decoded simultaneously by a plurality of user entities, wherein each user entity is using the multicast identity (MU-ID) instead of the user entity's respective user identity. A user entity and a method therefore have moreover been provided.

A method for forming a channel within a coated, metal-based substrate is described. In one technique, a channel-forming material is first deposited on the substrate, followed by the deposition of a bonding agent, such as a braze. One or more coatings can then be applied over the substrate. In one embodiment, the channel is formed when the channel-forming material is subsequently removed. In another embodiment, the channel is formed due to the lack of adhesion between particular channel-forming materials and the overlying bonding agent. Related articles are also described, e.g., gas turbine components which include protective coatings and a pattern of cooling channels.