Patents
Literature
Hiro is an intelligent assistant for R&D personnel, combined with Patent DNA, to facilitate innovative research.
Hiro

89results about How to "Maximize flow" patented technology

Thermoelectric devices and methods for making the same

Thermoelectric devices having enhanced thermal characteristics are fabricated using multilayer ceramic (MLC) technology methods. Aluminum nitride faceplates with embedded electrical connections provide the electrical series configuration for alternating dissimilar semiconducting materials. Embedded electrical connections are formed by vias and lines in the faceplate. Methods are employed for forming tunnels through lamination and etching. A portion of the dissimilar materials are then melted within the tunnels to form a bond. Thermal conductivity of the faceplate is enhanced by adding electrically isolated vias to one surface, filled with high thermal conductivity metal paste. A low thermal conductivity material is also introduced between the two high thermal conductivity material faceplates. Alternating semiconducting materials are introduced within the varying thermal conductivity layers by punching vias within greensheets of predetermined thermal conductivity and filling with n-type and p-type paste. Alternating semiconducting materials may also be patterned in linear or radial fanout patterns through screening techniques and lamination of wire structures. A liquid channel within the faceplate is used to enhance thermal energy transfer. Thermoelectric devices are physically incorporated within the IC package using MLC technology.
Owner:IBM CORP

Thermoelectric devices and methods for making the same

Thermoelectric devices having enhanced thermal characteristics are fabricated using multilayer ceramic (MLC) technology methods. Aluminum nitride faceplates with embedded electrical connections provide the electrical series configuration for alternating dissimilar semiconducting materials. Embedded electrical connections are formed by vias and lines in the faceplate. Methods for forming tunnels through lamination and etching are employed. A portion of the dissimilar materials are then melted within the tunnels to form a bond. Thermal conductivity of the faceplate is enhanced by adding electrically isolated vias to one surface, filled with high thermal conductivity metal paste. A low thermal conductivity material is also introduced between the two high thermal conductivity material faceplates.Alternating semiconducting materials are introduced within the varying thermal conductivity layers by punching vias within greensheets of predetermined thermal conductivity and filling with n-type and p-type paste. Alternating semiconducting materials may also be patterned in linear or radial fanout patterns through screening techniques and lamination of wire structures. A liquid channel within the faceplate is used to enhance thermal energy transfer.Thermoelectric devices are physically incorporated within the IC package using MLC technology.
Owner:INT BUSINESS MASCH CORP

OLED display encapsulation with the optical property

InactiveUS20090081360A1Maximize flowGas residence time be minimizeSolid-state devicesPolarising elementsParallel channelChemistry
A process of making an optical film or optical array comprises: a) simultaneously directing a series of gas flows along elongated substantially parallel channels to form a first thin film on a substrate; wherein the series of gas flows comprises, in order, at least a first reactive gaseous material, an inert purge gas, and a second reactive gaseous material; wherein the first reactive gaseous material is capable of reacting with a substrate surface treated with the second reactive gaseous material to form the first thin film; b) repeating step a) a plurality of times to produce a first thickness of a first film layer with a first optical property; wherein the process is carried out at or above atmospheric pressure; c) repeating steps a) and b) to produce a second film layer; and wherein the process is carried out substantially at or above atmospheric pressure.
Owner:EASTMAN KODAK CO

Cover and Sump Assembly For Preventing Suction Entrapment

InactiveUS20100050335A1Reduce water flow velocityReduce likelihoodWash-standsGymnasiumEngineeringSuction force
The invention relates to a cover and sump assembly for a main drain of a pool or spa that prevents suction entrapment, and specifically, to an assembly having a frame with openings, plates with openings positioned on the frame, and a sump for collecting water and receiving the frame. The assembly reduces the velocity of water flowing there through, uniformly distributes a suction force created by water flowing into the sump, prevents a vortex of flowing water above the assembly, and provides anti-entanglement features to minimize the likelihood of an individual becoming entrapped on the assembly by a suction force produced by a pump in the pool or spa filtering system. The assembly includes a conduit defining an opening along a lower portion thereof that reduces the velocity of flowing water at the suction opening in the sump by reorienting the suction port from a vertical to a horizontal orientation.
Owner:BAKER DONALD C
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products