35results about How to "Assist in heat dissipation" patented technology

An LED lighting device comprises: a thermally conducting body having an at least one opening that connects with a cavity within the body and a plurality of LEDs mounted in thermal communication with a face of the body and positioned around the opening. One or more passages pass through the body from the cavity to an outer surface of the body and are configured such that in operation air moves through the cavity by thermal convection thereby to provide cooling of the body. Each passage is configured in a direction that extends in a direction at an angle of about 45° to a line that is parallel with the axis of the body toward the outer surface of the body away from the face. The body can be configured such that its outer surface has a form factor resembling an incandescent light bulb or halogen reflector lamp.

A lamp comprises: a thermally conductive body; a plurality of LEDs configured as an array and mounted in thermal communication with the body and a light reflective hood located in front of the plane of light emitting diodes. The hood has at least two frustoconical light reflective surfaces that surround the array of LEDs and are configured such that in operation light emitted by the lamp is within a selected emission angle (beam spread). The hood is configured such that in operation a variation in illuminance (luminous flux per unit area incident on a surface) is 10% or less over approximately a third to one half of the selected emission angle.

An endshield assembly for an electronically commutated motor includes an endshield, a control assembly, and a power assembly. The endshield includes a plurality of recessed fins on an outer surface, and a substantially flat raised portion on an internal surface. The raised portion is in contact with a thermal pad. The control assembly includes the thermal pad and a control board on which is located a plurality of power transistors. The thermal pad provides thermal contact between the transistors and the endshield to enable the endshield to dissipate heat from the transistors. The transistors include a plurality of leads that extend substantially parallel to the control board which enable the leads to be coated for protection against harsh external environments. The power assembly includes a power board having an insulator positioned between the power board and the control board.

Various embodiments disclose a shielded or isolated heat dissipating system comprising a case, a heat sink base, and a circuit board comprising at least one electronic device for which heat dissipation is desired. The heat sink base is attached to the case and together with the shielding case defines an enclosed space within which electromagnetic interference is reduced. Both heat-dissipation function and electromagnetic shielding function may be achieved by the combination of the heatsink base and the case while maintain electrical isolation with one or more specially treated components. The space required for mounting the system may also be reduced without adversely affecting normal and stable operation of the electronic device.

An optical device for transforming an input light distribution from an LED light source to provide an omni-directional output light distribution for solid-state lighting is disclosed. The optical device has a conical form, comprising first and second coaxial cones of different refractive index, defined by coaxial inner and outer cone surfaces, which converge from a cone base to a rounded tip at the apex. Preferably, each of the inner and outer cone surfaces comprises a plurality of conical facets defining a grating structure. The inner cone, i.e. air cavity, is directly coupled to an LED emitter area. Cone angles and spacings of conical facets, defining inner and outer gratings, are tailored to reshape a predetermined input light distribution. Apertures assist in heat dissipation. A lightweight, compact device with high transmission efficiency can be manufactured at low cost by one-step injection molding from an optical-grade polymer, such as PMMA.

By filling an air gap between tiers of a stacked IC device with a thermally conductive material, heat generated at one or more locations within one of the tiers can be laterally displaced. The lateral displacement of the heat can be along the full length of the tier and the thermal material can be electrically insulating. Through silicon-vias (TSVs) can be constructed at certain locations to assist in heat dissipation away from thermally troubled locations.

An indefectible cable comprises a cable jacket with cable cores arranged in an inner cavity thereof and a metal ring sleeved on an outer wall thereof. Both ends of the cable jacket are fixedly connected with an anti-extrusion device respectively, through which the cable cores are led out from through-holes. The anti-extrusion device has a metal housing with plastic lining. With the arrangement of a buffer device, the externally applied pressure on the cable is relieved to reduce the damage thereof.

An electronic device includes a circuit board and a heat insulating structure. The heat insulating structure includes a heat source, an enclosure for covering the heat source, and a heat insulating plate disposed on a side of the enclosure facing to the heat source for preventing heat generated by the heat source from directly transmitting toward the enclosure, and a space being formed between the heat insulating plate and the enclosure. The heat insulating structure further includes a thermal conductive layer disposed on a side of the heat insulating plate facing to the heat source. The heat insulating structure further includes the thermal conductive layer disposed on a side of the heat insulating plate facing to the enclosure. Therefore, the heat insulating plate can be for altering heat current generated by the heat source so as to dissipate the heat current via holes on the enclosure uniformly.

The invention is concerned with the light-emitting diode module group, includes the metal circuit board and the complex number of light-emitting diode grain. The metal circuit board includes the metal plate, the first dielectric layer and the circuitry layer orderly; the first dielectric layer is with the complex number of hatch; where the light - emitting diode grain set on and they connects with the circuitry layer by electricity. The invention resolves the problem of thermolysis prolongs the light-emitting diode module group life-cycle and ensures the quality of the production by reinsuring the heat energy generated by the light-emitting diode grain can be transmitted to the metal plate through the base board directly, which can reduce the temperature of the light-emitting diode component.The complex number of hatch can use as the enveloping outskirts of the packaging process and the setting up of the light-emitting is just simple set on the metal basal board, both can reduce the making step of the packaging process and the module forming and their time consuming.

A chip scale package (CSP) structure and the packaging process thereof are described. By using a matrix of interlinked heat sink units compatible with the block substrate, the packaging process can be simplified and a plurality of packages units or chip scale packages with enhanced thermal performance can be obtained after singulation.

The invention is concerned with the light-emitting diode module group, includes the metal circuit board and the complex number of light-emitting diode grain. The metal circuit board includes the metal plate, the first dielectric layer and the circuitry layer orderly; the first dielectric layer is with the complex number of hatch; where the light - emitting diode grain set on and they connects with the circuitry layer by electricity. The invention resolves the problem of thermolysis that prolongs the light-emitting diode module group life cycle and ensures the quality of the production by reinsuring the process of the heat energy generating of the light-emitting diode grain can be transmitted to the circuitry layer or the metal plate through the base board directly that reduces the temperature of the light-emitting diode component.

A heat dissipation assembly includes a heat sink and a fan. The heat sink device has a base and a plurality of fins formed on the base, the fins are parallel with each other, one or more of the fins cooperatively form at least two concave engagement parts. The fan has at least two elastic arms extending from middle positions of two opposite sides of the fan, an engagement hook is formed at an end of the at least two arms. The at least two engagement hooks are engagable with the at least two engagement parts, for fastening the fan on the heat sink device.

A ceiling mount lamp having a fixing structure capable of assisting heat dissipation is disclosed. The ceiling mount lamp includes a fixing unit including a frame body and a back plate, and a lighting unit installed between the frame body and the back plate. At least one side of the light guide plate is provided with a circuit board on which an LED unit is disposed, and at least one side between the frame body and the back plate of the fixing unit is mounted with a U-shaped fixing member. One outer surface of the U-shaped fixing member is fastened with the circuit board, and another outer surface of the U-shaped fixing member is provided with at least a hook part, which provides an elastic force to push against the circuit board and the LED unit, such that the LED unit is pressed close to the light guide plate.

A lamp comprises: a thermally conductive body; a plurality of LEDs configured as an array and mounted in thermal communication with the body and a light reflective hood located in front of the plane of light emitting diodes. The hood has at least two frustoconical light reflective surfaces that surround the array of LEDs and are configured such that in operation light emitted by the lamp is within a selected emission angle (beam spread). The hood is configured such that in operation a variation in illuminance (luminous flux per unit area incident on a surface) is 10% or less over approximately a third to one half of the selected emission angle.

A light emitting diode (LED) illumination device includes a vapor chamber, a circuit board and at least one LED. At least one protrusion is formed on a surface of the vapor chamber, and a heat conducting tin layer is formed on the protrusion. The circuit board includes at least one through hole for passing the protrusion. The circuit board is formed by sequentially stacking an insulating layer and a heat conducting layer. The LEDs are installed on and contacted with the protrusions respectively, and each LED has two pins electrically connected to the circuit board. The LED device of the present invention is in a direct contact with the protrusion of the LED, such that the heat dissipated from the LED can be conducted to the vapor chamber, and then the vapor chamber carries away the heat quickly.

The present invention relates to different embodiments of high bay lighting fixtures comprising many improved features, such as the ability to dissipate heat from a light source in a non-traditional manner. One such example is the elimination of a traditional heat sink by placing housings and / or a heat spreader plate in thermal contact with the light emitting elements. By doing so, the housings and / or heat spreader plate can dissipate heat from the light emitting elements and spread it throughout the lighting fixture. Different embodiments also help dissipate heat from the light source by spreading out the light emitting elements. Other embodiments improve heat dissipation by using air slots, so that heat can more easily escape from the lighting fixture. Still another example of dissipating heat from the light source can be to use heat fins.

A motor includes a base having a fixing seat, an axial tube mounted to the fixing seat, a rotor mounted to the axial tube, and a circuit board mounted to the base and including a stator and at least one heat-generating component. The base includes at least one slot. At least one fixed plate is located adjacent to the slot. The fixed plate is at a different height from the base. The fixed plate is smaller than the slot. The heat-generating component is fixed to the fixed plate. The fixed plate assists in dissipation of heat generated by the heat-generating component.

By filling an air gap between tiers of a stacked IC device with a thermally conductive material, heat generated at one or more locations within one of the tiers can be laterally displaced. The lateral displacement of the heat can be along the full length of the tier and the thermal material can be electrically insulating. Through silicon-vias (TSVs) can be constructed at certain locations to assist in heat dissipation away from thermally troubled locations.

A self-contained clutch for diesel engines for off-highway implementation is provided. A stationary friction disc, pressure plate and endplate sandwich a pair of rotating separator discs. Attenuation of vibration damping of the rotator discs may be achieved by a centrifugal weight. A pulse-width-modulated DC motor or valve is employed in association with a hydraulic actuator to control pressure to the clutch piston. An RFID tag uniquely identifies the nature and parameters of the clutch itself and is associated with the clutch such that the controller can most efficiently operate the clutch. Heat is dissipated by an oil pump servicing the support bearings and / or by the integration of a centrifugal fan into the heat disc stack.

An optical device for transforming an input light distribution from an LED light source to provide an omni-directional output light distribution for solid-state lighting is disclosed. The optical device has a conical form, comprising first and second coaxial cones of different refractive index, defined by coaxial inner and outer cone surfaces, which converge from a cone base to a rounded tip at the apex. Preferably, each of the inner and outer cone surfaces comprises a plurality of conical facets defining a grating structure. The inner cone, i.e. air cavity, is directly coupled to an LED emitter area. Cone angles and spacings of conical facets, defining inner and outer gratings, are tailored to reshape a predetermined input light distribution. Apertures assist in heat dissipation. A lightweight, compact device with high transmission efficiency can be manufactured at low cost by one-step injection molding from an optical-grade polymer, such as PMMA.

Aluminum high bay lighting fixtures a primary housing; at least one secondary housing partially surrounding a primary housing; a plurality of light emitting elements in thermal contact with the primary housing; a heat spreader plate in thermal contact with the light emitting elements and the primary and secondary housings. At least one of the primary and secondary housings include openings to help dissipate heat from the light source and / or allow at least some of the light from the light emitting elements to be outputted in a direction opposite the main light emitting direction. The shortest distance from a distal end of the primary housing to the light sources is greater than the shortest distance from a distal end of the secondary housing to the light sources.

The invention provides a battery pack comprising a battery cell assembly and a heat dissipation assembly. The battery cell assembly comprises a battery cell array and a channel arranged in the battery cell array. The battery cell array is formed by arranging a plurality of cells in a certain form. The channel is enclosed by N cells, wherein N>2. The heat dissipation assembly comprises a heat-absorbing member arranged in the channel. The heat-absorbing member comprises N side walls, wherein the N side walls respectively abut against the side walls of the N battery cells. Compared with the prior art, the battery pack has the advantages that the battery pack assists the battery cell assembly in heat dissipation through the heat dissipation assembly, which can make the temperature of each area of the battery cell assembly more balanced.