Patents
Literature
Hiro is an intelligent assistant for R&D personnel, combined with Patent DNA, to facilitate innovative research.
Hiro

363 results about "Dimple" patented technology

A dimple (also known as a gelasin) is a small natural indentation in the flesh on a part of the human body, most notably in the cheek or on the chin.

Stator assembly with an overmolding that secures magnets to a flux ring and the flux ring to a stator housing

A stator assembly for an electric motor includes a stator housing, an expandable flux ring inserted into the stator housing and a plurality of magnets on an inner surface of the flux ring. Overmold material is molded around the magnets in the flux ring, such as by injection molding. The pressure of the overmold material as it is being molded expands the flux ring pressing the flux ring into engagement with the stator housing. The overmold material secures the magnets to the flux ring and the flux ring to the housing. One of the flux ring and stator housing has a dimple that engages a hole in the other of the flux ring and stator housing to align the flux ring and stator housing. In an aspect, the overmold material is molded to form at least one of a commutator end or rear bearing support, front bearing support and fan baffle. In an aspect, the overmold material is molded to form a keying feature. The keying feature can be slots of different widths between magnetic poles of the stator assembly. In an aspect, the flux ring and housing are preformed as a unit by stamping them from blanks and rolling them together. In a variation, the flux ring blank is rolled first to form the flux ring and the housing blank rolled around the flux ring with the flux ring acting as a rolling arbor.
Owner:BLACK & DECKER INC

Metal and metal oxide surface texturing

A method of texturing a metal provides a metal with a thickness of 50 to 400 μm. The metal is anodized, etched and then textured in a first texturing step to produce a first textured surface of the metal. A textured metal is produced with a dimpled surface of dimples with diameters of 5 nm to 2 and a depth of from 2 nm to 2 μm.
Owner:CLEAN CELL INT

High power semiconductor package

Provided is a high power semiconductor package including: an insulation substrate having first and second surfaces opposite to each other; an interconnection patterns formed on the first surface of the insulation substrate, the interconnection patterns including a plurality of first dimples; a power control semiconductor chip mounted on the first surface of the insulation substrate, the power control semiconductor chip electrically connected with the interconnection patterns; and an encapsulation member encapsulating the insulation substrate, the interconnection patterns, and the power control semiconductor chip and exposing at least a portion of the second surface of the insulation substrate.
Owner:SEMICON COMPONENTS IND LLC

Quad flat no-lead chip carrier with stand-off

A QFN package with improved joint solder thickness for improved second level attachment fatigue life. The copper leadframe of a QFN chip carrier is provided with rounded protrusions in both the chip attach pad region and the surrounding lead regions before second level attachment. The rounded stand-off protrusions are formed from the copper itself of the copper of the leadframe. This may be achieved by punching dimples into one surface of the copper plate of the leadframe before plating to form protrusions on the opposing surface. This method of forming the rounded protrusions simplifies the process of forming stand-offs. The protrusions provide a structure that increases wetting area and allows the use of a larger quantity of solder for increased solder joint thickness and better die paddle solder joint area coverage. As a result of the increased solder joint thickness, second level fatigue life is significantly improved. As a result of the improved die paddle solder joint area coverage, improved thermal performance of the chip carrier is also significantly improved.
Owner:GLOBALFOUNDRIES US INC

Co-molded, focused weighted, dimple arrayed hockey sticks and other composite structures

Unique composite structures are disclosed that include focused adjustably weighted end plugs, co-molded focused weighted and non-weighted logo / branding components and / or dimple arrays. A representative composite hockey stick having a tubular hollow shaft, a blade, and a weight-adjustable end-plug is disclosed. The blade includes one or more weighted regions in the form of a focused weight system co-molded to an external surface of the blade. The blade may also include one or more co-molded non-weighted logo / branding components and / or one or more dimple arrays on the front and / or back face of the blade. Methods and suitable materials for constructions of the various components and composite constructs are also disclosed.
Owner:BAUER HOCKEY

Disk drive suspension

A slider and microactuator elements are disposed on a gimbal portion of a flexure. A tongue of the gimbal portion has a first tongue portion, a second tongue portion, and a hinge portion. A leading-side portion of the slider is movably disposed on the first tongue portion. A trailing-side portion of the slider is secured to the second tongue portion. The hinge portion is formed between the first tongue portion and the second tongue portion. The gimbal portion is provided with a damper member includes a viscoelastic material layer and a constrained plate. The damper member comprises a first damper and a second damper. The hinge portion is exposed between the first damper and the second damper. A dimple on a load beam contacts the hinge portion at a point of contact.
Owner:NHK SPRING CO LTD

Memory card connector

A memory card connector has a sliding member and a sliding pin for coupling the insertion and rejection of the memory card. The sliding member can be stayed at the position of insertion or rejection of the memory card. A retaining sheet is formed on the side of the sliding member. The end of the retaining sheet is stamped into a dimple. A retaining portion is formed on the housing of the memory card connector corresponding to the position of the dimple. The dimple can be pushed into the retaining portion when the memory card is rejected to the rejection position. The dimple can be protruded into a notch formed on the memory card by the resilience force of the retaining sheet while the notch reaches the position corresponding to the dimple. Because of the dimple leaving the position corresponding to the retaining portion of the housing; the dimple can be retained in the notch when the memory card is pushed toward the insertion position. The dimple retains the notch of the memory card for preventing the memory card from dropping out of the predetermined position or being ejected abnormally while the memory card is in the insertion state.
Owner:CHENG UEI PRECISION IND CO LTD

Heat exchanger

A heat exchanger has plural tubes, an inlet tank, a fin, and an outlet tank. Each tube has a dimple structure for inducing a turbulent flow of heat exchange fluid flowing through each tube, thereby increasing heat exchange performance. The dimples of each tube satisfy the following formula:8.80<thesumAdimpleoftheproductofawidthdandadepthhofeachdimplealengthLofthetube×aheightHofthetube×100<13.60
Owner:HALLA CLIMATE CONTROL
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products