363 results about "Dimple" patented technology

A golf ball is provided that has improved aerodynamic efficiency, resulting in increased flight distance for golfers of all swing speeds, and more particularly for golfers possessing very high swing speeds, such as those who can launch the balls at an initial speed greater than 160 miles per hour and more particularly at initial ball speed of about 170 miles per hour or higher. The golf ball of the present invention combines lower dimple count with multiple dimple sizes to provide higher dimple coverage and improved aerodynamic characteristics.

A round cutting insert with an anti-rotation feature. The round cutting insert includes a plurality of projections formed on a first surface and another plurality of projections formed on an opposing surface. The round cutting insert is reversible and indexable. The round cutting insert is removably received in an insert receiving pocket in a tool body wherein the insert receiving pocket includes a plurality of dimples for receiving one of the plurality of first projections or the plurality of second projections. This arrangement prevents rotation of the round cutting insert while mounted in the insert receiving pocket.

A solid golf ball is composed of a solid core and a cover of one or more layers which encloses the core and has on a surface thereof numerous dimples. The solid core has a diameter of 38.7 to 39.6 mm and a deflection hardness of 3.0 to 4.0 mm. The cover has a Shore D hardness of 59 to 70 and has 313 to 371 dimples formed thereon. The ball has an initial velocity of at least 76.8 m / s, a coefficient of lift (CL) when hit of at least 0.165 at a Reynolds number of 70,000 and a spin rate of 2,000 rpm, and a coefficient of drag (CD) when hit of not more than 0.230 at a Reynolds number of 180,000 and a spin rate of 2,520 rpm. The golf ball has a carry which is long enough to make the ball advantageous for competitive play, in addition to which it has a good feel when hit and excellent durability to cracking with repeated impact.

A golf ball is provided that has improved aerodynamic efficiency, resulting in increased flight distance for golfers of all swing speeds, and more particularly for golfers possessing very high swing speeds, such as those who can launch the balls at an initial speed greater than 160 miles per hour and more particularly at initial ball speed of about 170 miles per hour or higher. The golf ball of the present invention combines lower dimple count with multiple dimple sizes to provide higher dimple coverage and improved aerodynamic characteristics.

A head suspension for supporting a head slider over a disk in a dynamic storage device and providing precise movement of the head slider relative to tracks on the disk. The head suspension includes a load beam, a flexure having a slider mounting region, and a dimple interface transmitting a load beam force to the slider mounting region. The head suspension further includes a microactuator mounted to the load beam. Movement of the microactuator is transmitted through the dimple interface by action of frictional forces at the dimple interface so as to cause movement of the slider mounting region transverse to tracks on the disk. A method of precisely moving a head slider supported by a head suspension includes providing and driving a microactuator configured to transmit movement of the microactuator to a slider mounting region through a dimple interface by action of frictional forces at the dimple interface.

A golf ball is provided that has improved aerodynamic efficiency, resulting in increased flight distance for golfers of all swing speeds, and more particularly for golfers possessing very high swing speeds, such as those who can launch the balls at an initial speed greater than 160 miles per hour and more particularly at initial ball speed of about 170 miles per hour or higher. The golf ball of the present invention combines lower dimple count with multiple dimple sizes to provide higher dimple coverage and improved aerodynamic characteristics.

A magnetic head suspension assembly is fabricated with an integral piece which includes a load beam section, a flexure section, a rest mount section and a leaf spring section between the load beam and rear mount. A tongue extends from the load beam to the flexure and has a down-facing load dimple which contacts the non-air bearing surface of an attached air bearing slider. The flexure includes narrow thin legs adjacent to a cutout that delineates the load beam tongue. The head suspension is characterised by a high first bending mode frequency and low pitch and roll stiffness.

The present invention relates to a CMOS compatible MEMS microphone, comprising: an SOI substrate, wherein a CMOS circuitry is accommodated on its silicon device layer; a microphone diaphragm formed with a part of the silicon device layer, wherein the microphone diaphragm is doped to become conductive; a microphone backplate including CMOS passivation layers with a metal layer sandwiched and a plurality of through holes, provided above the silicon device layer, wherein the plurality of through holes are formed in the portions thereof opposite to the microphone diaphragm, and the metal layer forms an electrode plate of the backplate; a plurality of dimples protruding from the lower surface of the microphone backplate opposite to the diaphragm; and an air gap, provided between the diaphragm and the microphone backplate, wherein a spacer forming a boundary of the air gap is provided outside of the diaphragm or on the edge of the diaphragm; wherein a back hole is formed to be open in substrate underneath the diaphragm so as to allow sound pass through, and the microphone diaphragm is used as an electrode plate to form a variable capacitive sensing element with the electrode plate of the microphone backplate.

A stator assembly for an electric motor includes a stator housing, an expandable flux ring inserted into the stator housing and a plurality of magnets on an inner surface of the flux ring. Overmold material is molded around the magnets in the flux ring, such as by injection molding. The pressure of the overmold material as it is being molded expands the flux ring pressing the flux ring into engagement with the stator housing. The overmold material secures the magnets to the flux ring and the flux ring to the housing. One of the flux ring and stator housing has a dimple that engages a hole in the other of the flux ring and stator housing to align the flux ring and stator housing. In an aspect, the overmold material is molded to form at least one of a commutator end or rear bearing support, front bearing support and fan baffle. In an aspect, the overmold material is molded to form a keying feature. The keying feature can be slots of different widths between magnetic poles of the stator assembly. In an aspect, the flux ring and housing are preformed as a unit by stamping them from blanks and rolling them together. In a variation, the flux ring blank is rolled first to form the flux ring and the housing blank rolled around the flux ring with the flux ring acting as a rolling arbor.

In a disk drive suspension circuit, an electrical contact from a flexible circuit to a face of a PZT microactuator is provided by a mechanical bias to press a contact pad of the flexible circuit against the PZT surface. The mechanical bias is provided by a piece of stainless steel that is welded to a nearby point or points on the suspension, and which biases the electrical contact pad carrying the PZT driving voltage against the PZT. The piece of stainless steel may be in the form of a flat piece welded on one or more sides of the contact pad, and may include a dimple for pressing against the contact pad. Additional insulation material may be provided between the dimple and the contact pad to prevent the dimple from penetrating through the flexible circuit's cover layer and shorting the driving voltage.

A head gimbal assembly includes a micro-actuator, a slider, and a suspension that supports the micro-actuator and the slider. The micro-actuator includes a metal frame including a top support to support the slider, a bottom support to connect to the suspension, and a pair of side arms that interconnect the top support and the bottom support. The top support includes a rotatable plate and connection arms that couple the rotatable plate to respective side arms. A PZT element is mounted to each of the side arms. Each PZT element is excitable to cause selective movement of the side arms. The suspension includes a load beam having a dimple that engages and supports the rotatable plate in use.

A HGA includes a load beam having a dimple formed thereon; a flexure including a suspension tongue and a support plate connected with the suspension tongue; and a slider having a leading edge and trailing edge opposite to the leading edge. The slider is mounted on the flexure such that the slider is supported by the dimple at the center of the slider. The leading edge is attached on the suspension tongue and trailing edge is attached on the support plate. A weight-balance structure is formed on the suspension tongue of the flexure to balance the weight of the HGA between a portion from the trailing edge to the slider center and another portion from the leading edge to the slider center. The invention also discloses various methods of manufacturing HGA with the balanced weight.

A method of texturing a metal provides a metal with a thickness of 50 to 400 μm. The metal is anodized, etched and then textured in a first texturing step to produce a first textured surface of the metal. A textured metal is produced with a dimpled surface of dimples with diameters of 5 nm to 2 and a depth of from 2 nm to 2 μm.

Provided is a high power semiconductor package including: an insulation substrate having first and second surfaces opposite to each other; an interconnection patterns formed on the first surface of the insulation substrate, the interconnection patterns including a plurality of first dimples; a power control semiconductor chip mounted on the first surface of the insulation substrate, the power control semiconductor chip electrically connected with the interconnection patterns; and an encapsulation member encapsulating the insulation substrate, the interconnection patterns, and the power control semiconductor chip and exposing at least a portion of the second surface of the insulation substrate.

A punched gimbal dimple with a coined, frusto-conical base in a head suspension and a method for producing such a dimple. The dimple has an apex and a base, the base having outer and inner surfaces which generally conform to conical frustums. The conical frustum half-cone angles differ by at least 2 degrees. The dimple and its coined base are fabricated by a dimple punch and die with mismatched punch tangent and chamfer angles. The coined dimple base can be more easily seen by optical systems for aligning a slider to the dimple.

The present invention is a golf ball which comprises dimples having a cross section defined by the superposition of two or more continuous and differentiable functions. Additionally, the dimples preferably have a circular boundary and maintain an axis coincident with the center of the circular boundary.

A golf ball with aerodynamic coefficient magnitude and aerodynamic force angle, resulting in improved flight performance, such as increased carry and flight consistency regardless of ball orientation. In particular, the present invention is directed to a golf ball having increased flight distance as defined by a set of aerodynamic requirements, at particular spin ratios and Reynolds Numbers. The invention is also directed toward golf balls with dimple diameters of greater than 6.5 percent of the ball diameter and dimples with a profile defined by a catenary curve.

A method of forming an internal combustion engine component having a multi-panel outer wall. The multi-panel outer wall has an inner panel (16) with an inner surface (18) and an outer surface (37). The inner panel outer surface (37) has discrete pockets (23) formed by integral structural ribs (38). Each pocket (23) has a film cooling hole (31) between the pocket (23) and the plenum (20). The method includes: forming dimples (40) in the intermediate panel (22), at least one dimple (40) having a nozzle (29); securing the intermediate panel (22) to the inner panel outer surface (37), thereby enclosing at least one pocket (23); and ensuring a respective dimple (40) having a nozzle (29) protrudes into a respective enclosed pocket (24) and a respective nozzle (29) is configured to direct a respective jet (35) of cooling fluid onto the inner panel outer surface within the respective enclosed pocket (23).

In a nuclear reactor fuel assembly structured to support at least one non-linear fuel rod, the nuclear reactor fuel assembly includes at least two support grids, a first support grid and a second support grid structured to support at least one fuel rod in a non-linear shape. Each support grid has a plurality of generally square cells and wherein the cells on the first support grid and the second support grid are generally vertically aligned. Each cell has a first side, a second side, a third side, and a fourth side. Each cell further has protrusions extending from each the cell sides, wherein the protrusions are selected from the group including a spring, a dimple or an extended dimple. A spring is always disposed opposite of a dimple or an extended dimple. The first support grid includes at least one cell having an extended dimple extending from at least one cell side. The second support grid includes at least one cell aligned with the first support grid at least one cell having an extended dimple, wherein the second support grid cell has an extended dimple extending from a cell side other than cell side having an extended dimple on the first support grid. Thus, the extended dimples cause the fuel rod to be deformed.

A QFN package with improved joint solder thickness for improved second level attachment fatigue life. The copper leadframe of a QFN chip carrier is provided with rounded protrusions in both the chip attach pad region and the surrounding lead regions before second level attachment. The rounded stand-off protrusions are formed from the copper itself of the copper of the leadframe. This may be achieved by punching dimples into one surface of the copper plate of the leadframe before plating to form protrusions on the opposing surface. This method of forming the rounded protrusions simplifies the process of forming stand-offs. The protrusions provide a structure that increases wetting area and allows the use of a larger quantity of solder for increased solder joint thickness and better die paddle solder joint area coverage. As a result of the increased solder joint thickness, second level fatigue life is significantly improved. As a result of the improved die paddle solder joint area coverage, improved thermal performance of the chip carrier is also significantly improved.

Unique composite structures are disclosed that include focused adjustably weighted end plugs, co-molded focused weighted and non-weighted logo / branding components and / or dimple arrays. A representative composite hockey stick having a tubular hollow shaft, a blade, and a weight-adjustable end-plug is disclosed. The blade includes one or more weighted regions in the form of a focused weight system co-molded to an external surface of the blade. The blade may also include one or more co-molded non-weighted logo / branding components and / or one or more dimple arrays on the front and / or back face of the blade. Methods and suitable materials for constructions of the various components and composite constructs are also disclosed.

Method of forming depressions (e.g. dimples) in a sheet material to form a textured surface thereon involves pressing one or more tool tips into a metallic or non-metallic sheet material while the sheet material is supported by a support layer that is relatively softer (e.g. having a lower Young's modulus) than the sheet material so as to allow plastic deformation and reduce pile-up of raised displaced material of the sheet material at the edges of the depressions.

A slider and microactuator elements are disposed on a gimbal portion of a flexure. A tongue of the gimbal portion has a first tongue portion, a second tongue portion, and a hinge portion. A leading-side portion of the slider is movably disposed on the first tongue portion. A trailing-side portion of the slider is secured to the second tongue portion. The hinge portion is formed between the first tongue portion and the second tongue portion. The gimbal portion is provided with a damper member includes a viscoelastic material layer and a constrained plate. The damper member comprises a first damper and a second damper. The hinge portion is exposed between the first damper and the second damper. A dimple on a load beam contacts the hinge portion at a point of contact.

A Hard Disk Drive (HDD) includes a write-inhibit signal that is generated by a head-disk interaction sensor during a write process that is integrated with a suspension of the HDD when fly-height modulation of the slider is detected during a write process. The suspension load beam includes a dimple and a laminated flexure. The laminated flexure includes a surface that is adapted to receive a slider and a surface that is adapted to contact the dimple. The head-disk interaction sensor is fabricated as part of the laminations of the flexure. The head-disk interaction sensor can be an accelerometer that senses an acceleration of the flexure when the slider contacts the disk of the disk drive and / or a pressure sensor that senses a pressure between the flexure and the dimple when the slider contacts the disk. A write-inhibit circuit is responsive to the sensor signal by inhibiting the write process.

A memory card connector has a sliding member and a sliding pin for coupling the insertion and rejection of the memory card. The sliding member can be stayed at the position of insertion or rejection of the memory card. A retaining sheet is formed on the side of the sliding member. The end of the retaining sheet is stamped into a dimple. A retaining portion is formed on the housing of the memory card connector corresponding to the position of the dimple. The dimple can be pushed into the retaining portion when the memory card is rejected to the rejection position. The dimple can be protruded into a notch formed on the memory card by the resilience force of the retaining sheet while the notch reaches the position corresponding to the dimple. Because of the dimple leaving the position corresponding to the retaining portion of the housing; the dimple can be retained in the notch when the memory card is pushed toward the insertion position. The dimple retains the notch of the memory card for preventing the memory card from dropping out of the predetermined position or being ejected abnormally while the memory card is in the insertion state.

A Hard Disk Drive (HDD) includes a write-inhibit signal that is generated by a head-disk interaction sensor during a write process that is integrated with a suspension of the HDD when fly-height modulation of the slider is detected during a write process. The suspension load beam includes a dimple and a laminated flexure. The laminated flexure includes a surface that is adapted to receive a slider and a surface that is adapted to contact the dimple. The head-disk interaction sensor is fabricated as part of the laminations of the flexure. The head-disk interaction sensor can be an accelerometer that senses an acceleration of the flexure when the slider contacts the disk of the disk drive and / or a pressure sensor that senses a pressure between the flexure and the dimple when the slider contacts the disk. A write-inhibit circuit is responsive to the sensor signal by inhibiting the write process.

A HGA of the invention includes a slider, a load beam having a locating hole formed therein; a flexure to support the slider and connect with the load beam; a separate dimple element having a dimple to extend through the locating hole and support the flexure at a position corresponding to a center area of the slider. The invention also discloses a method for manufacturing the HGA and a disk drive unit with the HGA.

A prophy cup has an outer surface with dimples formed therein. The dimples increase the turbulent flow in a boundary layer proximate to the surface. The increased turbulent flow reduces the separation of fluid (a slurry of saliva, blood and pumice) at the boundary layer to minimize the quantity of fluid ejected from the surface. A dental handpiece housing is configured to split longitudinally so that a wiper is positioned proximate to the outer surface of the prophy cup. The wiper removes slurry as the prophy cup rotates during a dental cleaning procedure to further reduce the quantity of fluid ejected from the surface during the procedure.

A heat exchanger has plural tubes, an inlet tank, a fin, and an outlet tank. Each tube has a dimple structure for inducing a turbulent flow of heat exchange fluid flowing through each tube, thereby increasing heat exchange performance. The dimples of each tube satisfy the following formula:8.80<thesumAdimpleoftheproductofawidthdandadepthhofeachdimplealengthLofthetube×aheightHofthetube×100<13.60