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High density integrated circuit packaging with chip stacking and via interconnections

Chip stacks with decreased conductor length and improved noise immunity are formed by laser drilling of individual chips, such as memory chips, preferably near but within the periphery thereof, and forming conductors therethrough, preferably by metallization or filling with conductive paste which may be stabilized by transient liquid phase (TLP) processes and preferably with or during metallization of conductive pads, possibly including connector patterns on both sides of at least some of the chips in the stack. At least some of the chips in the stack then have electrical and mechanical connections made therebetween, preferably with electroplated solder preforms consistent with TLP processes. The connections may be contained by a layer of resilient material surrounding the connections and which may be formed in-situ. High density circuit packages thus obtained may be mounted on a carrier by surface mount techniques or separable connectors such as a plug and socket arrangement. The carrier may be of the same material as the chip stacks to match coefficients of thermal expansion. High-density circuit packages may also be in the form of removable memory modules in generally planar or prism shaped form similar to a pen or as a thermal conduction module.
Owner:INT BUSINESS MASCH CORP

Holder for a substrate cassette and device provided with such a holder

A holder is disclosed for a cassette for substrates. The holder includes a base plate on which a guide member provided with at least two guides is secured. The cassette is to be positioned between the guides, which enable the cassette to be aligned with respect to the base plate, and the side of which facing the base plate tapers inwards and downwards. The application of such a holder in an apparatus for manufacturing semiconductor devices is still hampered as a result of incorrectly positioning the holder in the apparatus. This can lead to damage to the substrates and a lower yield of the manufacturing process. The side of the guide member tapers inwards and upwards. By virtue of this structure, the cassette can be positioned more accurately and reproducibly into the holder. In this way, damage to substrates is avoided and the yield is high. The guide member may be mirror symmetrical and can include two separate guide members, which are mirror symmetrical as well. As a result, the holder can be mounted, adjusted and manufactured in a simple and inexpensive manner.
Owner:NXP BV

High density integrated circuit packaging with chip stacking and via interconnections

Chip stacks with decreased conductor length and improved noise immunity are formed by laser drilling of individual chips, such as memory chips, preferably near but within the periphery thereof, and forming conductors therethrough, preferably by metallization or filling with conductive paste which may be stabilized by transient liquid phase (TLP) processes and preferably with or during metallization of conductive pads, possibly including connector patterns on both sides of at least some of the chips in the stack. At least some of the chips in the stack then have electrical and mechanical connections made therebetween, preferably with electroplated solder preforms consistent with TLP processes. The connections may be contained by a layer of resilient material surrounding the connections and which may be formed in-situ. High density circuit packages thus obtained may be mounted on a carrier by surface mount techniques or separable connectors such as a plug and socket arrangement. The carrier may be of the same material as the chip stacks to match coefficients of thermal expansion. High-density circuit packages may also be in the form of removable memory modules in generally planar or prism shaped form similar to a pen or as a thermal conduction module.
Owner:IBM CORP
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