A carrying platform for a wafer-level ball mounter comprises a bottom X-axis movement system, a bottom Y-axis movement system, a bottom Z-axis movement system, an outer-circle Z-axis movement mechanism, an inner-circle Z-axis movement mechanism, wafer supporting columns, an outer carrying platform circle and an inner carrying platform circle. Vacuum absorption holes are formed in the outer carrying platform circle, the inner carrying platform circle and the wafer supporting columns respectively. According to the carrying platform for the wafer-level ball mounter, a high-precision lead screw is adopted for driving, and therefore the carrying platform has high precision and high stability; the smallest ball diameter phi of the wafer-level ball mounter can be 0.1mm. According to the carrying platform, a inner and outer circle carrying platform structure and a wafer supporting column structure are adopted, automatic wafer feeding and discharging can be performed through mechanical arms, the automation degree of equipment is improved to the maximum extent, the production efficiency is improved, and the stability of products is improved. By replacing a jig, the carrying platform can correspond to wafers being six inches, eight inches and twelve inches, and is high in applicability.