Carrying platform for wafer-level ball mounter

Abstract

A carrying platform for a wafer-level ball mounter comprises a bottom X-axis movement system, a bottom Y-axis movement system, a bottom Z-axis movement system, an outer-circle Z-axis movement mechanism, an inner-circle Z-axis movement mechanism, wafer supporting columns, an outer carrying platform circle and an inner carrying platform circle. Vacuum absorption holes are formed in the outer carrying platform circle, the inner carrying platform circle and the wafer supporting columns respectively. According to the carrying platform for the wafer-level ball mounter, a high-precision lead screw is adopted for driving, and therefore the carrying platform has high precision and high stability; the smallest ball diameter phi of the wafer-level ball mounter can be 0.1mm. According to the carrying platform, a inner and outer circle carrying platform structure and a wafer supporting column structure are adopted, automatic wafer feeding and discharging can be performed through mechanical arms, the automation degree of equipment is improved to the maximum extent, the production efficiency is improved, and the stability of products is improved. By replacing a jig, the carrying platform can correspond to wafers being six inches, eight inches and twelve inches, and is high in applicability.

Description

technical field [0001] The invention relates to semiconductor production equipment, in particular to a mounting platform for a wafer-level ball planting machine. Background technique [0002] With the rapid development of the semiconductor industry, the semiconductor industry is also growing at a high speed. In the back-end process of semiconductors, WLP (wafer level package) packaging has become the mainstream of the market. WLP packaging is widely used in large-scale integrated circuits due to its high density, small size, good heat dissipation, and excellent electrical performance. . One of the core processes of WLP packaging technology is ball placement. In the future, the mainstream of ball planting in the market will be wafer-level ball planting, and the mounting method of the wafer mounting platform in the wafer-level ball mounting equipment is directly related to the success rate of ball planting; the current mounting platform of the wafer-level ball planting machi...

AI Technical Summary

Problems solved by technology

[0003] 1. Although the X and Y axes are driven by linear motors, the overall positioning accuracy of the platform has not been greatly improved, resulting in a great waste of cost

[0004] 2. The Z-axis is driven by a single screw plus a guide column, resulting in unstable mechanism and low precision

The positioning accuracy of the existing mounting platform is low, and it cannot be applied to the ball planting equipment with a ball diameter below φ0.3mm, and the ball planting effect is poor, which does not meet the current development trend of the semiconductor industry's ball planting with increasingly smaller diameter solder balls

[0005] 3. Most of the existing loading platforms use manual placement of wafers to the loading platform, which has a low degree of automation and low production efficiency

Images