7197results about How to "Improve air tightness" patented technology

A method of fabricating a microstructure having an inside cavity. The method includes depositing a first layer or a first stack of layers in a substantially closed geometric configuration on a first substrate. Then, performing an indent on the first layer or on the top layer of said first stack of layers. Then, depositing a second layer or a second stack of layers substantially with said substantially closed geometric configuration on a second substrate. Then, aligning and bonding said first substrate on said second substrate such that a microstructure having a cavity is formed according to said closed geometry configuration.

A semiconductor manufacturing method includes depositing a low-k dielectric layer, forming a trench in the low-k dielectric layer, forming a barrier layer in the trench, filling a metal on the barrier layer, planarizing the metal, and forming a capping layer on the planarized metal, wherein the capping layer includes at least two layers.

A protective, biocompatible coating or encapsulation material protects and insulates a component or device intended to be implanted in living tissue. The coating or encapsulation material comprises a thin layer or layers of alumina, zirconia or other ceramic, less than 25 microns thick, e.g., 5-10 microns thick. The alumina layer(s) may be applied at relatively low temperature. Once applied, the layer provides excellent hermeticity, and prevents electrical leakage. Even though very thin, the alumina layer retains excellent insulating characteristics. In one embodiment, an alumina layer less than about 6 microns thick provides an insulative coating that exhibits less than 10 pA of leakage current over an area 75 mils by 25 mils area while soaking in a saline solution at temperatures up to 80° C. over a three month period.

A downhole gas-liquid separation device comprises a barrel-shaped body, and a positioning wheel is fixedly installed in the body. A rotatable swirling wheel is installed on the positioning wheel and provided with spiral wheel blades, and the positioning wheel is provided with fluid channels. A lower connector is connected to the body, a diverting joint is arranged at the inner end, located in an inner cavity of the body, of the lower connector, a gas outlet channel is formed in the center of the diverting joint in a coaxial mode, and the outer side of the diverting joint is provided with liquid drainage channels. An interval is formed between the swirling wheel and the diverting joint. The downhole gas-liquid separation device is small in part number, simple in structure and lower in cost; the swirling wheel is driven to rotate when liquid passes through the swirling wheel to enable the liquid to generate centrifugal force and swirlingly flow in the inner cavity in the mode of being attached to the wall, the liquid in gas is gathered to the center, and then the liquid and the gas flow out through the liquid drainage channels formed in the outer side and the gas outlet channel formed in the center respectively, so that gas and liquid separation is achieved; accordingly, the liquid sent to a motor does not contain the gas, damage to the motor is avoided, and the service life of the motor is prolonged.

A method is disclosed for the fabrication of feedthrough devices that can transmit a single or plurality of electrical signal(s) to or from within a leak-tight (hermetic) chamber from or to the outside of said leak-tight (hermetic) chamber. The invention allows materials known to be well-tolerated within the human body such as alumina-oxide ceramic and platinum to be used as raw materials in the fabrication of body-compatible, single or multi-channel leak-tight (hermetic) feedthroughs.

A method for improving the useful life of a thin film lithium-ion battery containing a solid electrolyte and an anode that expands on charging and long life batteries made by the method. The method includes providing a hermetic barrier package for the thin film battery that includes an anode expansion absorbing structure and at least one film getter.

A prosthetic socket seal includes at least one radially projecting sealing lip which jointly with a base subtends an annular gap. This annular gap is vented on a proximal side by the external atmosphere, resulting in creation of a pressure gradient at the sealing lip that produces stronger compression of the sealing lip against the prosthetic socket with increasing partial vacuum on a distal side of the sealing lip.

A prosthetic socket is fitted at a distance from its distal end with an annular chamber. This annular chamber is closed by a contour-conforming sealing wall facing the inner side of the prosthetic socket, said wall being designed to hermetically rest against the outer side of a residual limb. The space between the contour-conforming wall and the hard prosthetic socket is vented to atmosphere, whereby self-enhancing compression by the sealing wall against a residual limb arises when a partial vacuum arises in the distal prosthetic socket between the wall and the distal end. A liner having a sealing wall also is disclosed.

A bipolar battery includes a bipolar electrode and an electrolyte layer. The bipolar electrode includes a current collector, a positive electrode layer formed on one surface of the current collector, and a negative electrode layer formed on the other surface of the current collector. The bipolar electrode is sequentially laminated to provide connection in series via the electrolyte layer to form a stack structure. The positive electrode layer, the negative electrode layer and the electrolyte layer are potted with a resin portion.

A package includes a base body having a mounting portion for mounting a light-emitting device, a frame-shaped first reflection member attached to the upper surface of the base body, an inner peripheral surface of which is shaped into a first light reflecting surface and surrounds the mounting portion, and a frame-shaped second reflection member attached to the upper surface of the base body, with a spacing secured between an inner peripheral surface of the second reflection member and an outer peripheral surface of the first reflection member, the inner peripheral surface surrounding the first reflection member and having a second light reflecting surface at a location above an upper end of the first reflection member.

A micro package, a multi-stack micro package, and a manufacture method therefor are provided. A micro package according to the present invention includes a device substrate for mounting a devices, being a circuit module; a protection cap for protecting the device; bonding substances which, formed by patterning on predetermined areas on the device substrate, bond the device substrate and the protection cap; layers formed on a portion of the device substrate and a portion of the protection cap and exterior sides of the bonding substances; vias which are formed by etching away another portion of the protection cap, and electrically connected to an upper surface of the device substrate through the bonding substances; under barrier metals (UBMs) formed on the vias; and solder bumpers, being connection terminals for an external signal, formed on the UBMs. As stated above, the present invention has advantages of guaranteeing the hermetical sealing since the above layers prevent moisture absorption from outside at the same time of lowering possibility of damages to the device inside the package since the processing temperature drops below 150° upon wafer bonding due to the use of the polymer substance as a bonding substance.

An cylindrical convex portion of which opposite ends are open is integrally formed onto a fuel tank made of RDPE therewith so as to inwardly extend in the fuel tank, to provide an opening thereon. A press-fit portion of a filler hose connecting pipe made of PA as a tubular member is press-fitted in the cylindrical convex portion to connecting the tubular member to the fuel tank. At least one annular projection is provided on the outer peripheral surface of the press-fit portion of the tubular member so as to bite in the inner peripheral surface of the cylindrical connvex portion. A face of the annular projection in direction axially of one end of tubular member is formed so as to extend outwardly and inclinedly with respect to the axial direction of the tubular member form one end toward the other end thereof.

A method of manufacturing a sealed structure with excellent hermeticity and a method of manufacturing a light-emitting device sealed with the sealed structure. In the methods of manufacturing a sealed structure and a light-emitting device using a glass frit layer, a first step of forming a buffer layer for preventing a crack generated in a substrate and the glass frit layer by laser light irradiation, a second step of forming the glass frit layer to overlap with the buffer layer over the substrate, and a third step of welding the substrates by irradiating the glass frit layer or the buffer layer with laser light are performed, whereby a sealed structure with high hermeticity and a reliable light-emitting device sealed with the sealed structure can be manufactured. By applying the method of manufacturing a light-emitting device especially to an organic EL element, a highly reliable light-emitting device can be obtained.

Out of optical elements that are provided to the top end side of an inserting portion of an endoscope, a first optical element arranged closest to an observation object side and a second optical element joined hermetically to the first optical element via an air layer are joined at joined surfaces by a first adhesive. Also, peripheries of end portions of the joined surfaces are covered with a second adhesive whose moisture permeability is lower than the first adhesive.

A wafer level package structure with a plurality of compact sensors such as acceleration sensors and gyro sensors is provided. This package structure is composed of a semiconductor wafer with plural sensor units, and a pair of package wafers bonded to both surfaces of the semiconductor wafer. Each of the sensor units has a frame having an opening, a movable portion held in the opening to be movable relative to the frame, and a detecting portion for outputting an electric signal according to a positional displacement of the movable portion. Since the semiconductor wafer is bonded to each of the package wafers by a solid-phase direct bonding without diffusion between a surface-activated region formed on the frame and a surface-activated region formed on the package wafer, it is possible to prevent that variations in sensor characteristics occur due to residual stress at the bonding interface.

A chip-on-film (COF) package and method for image sensor has been disclosed. According to the method a COF film with opening is provided. The COF film has an upper surface, a lower surface and at least an opening. An image sensing chip is flip-chip mounted on the upper surface of the COF film. A transparent glass is bonded to the lower surface of the COF film. The opening is clipped by the transparent glass and the image sensing chip to form a hermetic space. The active surface of the image sensing chip includes an image sensing region toward the transparent glass through the opening and is sealed in the hermetic space by a limited filling material in order to prevent the image sensing region of the image sensing chip from contamination by means of COF tape packaging method.

A micro package, a multi-stack micro package, and a manufacture method therefor are provided. A micro package according to the present invention includes a device substrate for mounting a devices, being a circuit module; a protection cap for protecting the device; bonding substances which, formed by patterning on predetermined areas on the device substrate, bond the device substrate and the protection cap; layers formed on a portion of the device substrate and a portion of the protection cap and exterior sides of the bonding substances; vias which are formed by etching away another portion of the protection cap, and electrically connected to an upper surface of the device substrate through the bonding substances; under barrier metals (UBMs) formed on the vias; and solder bumpers, being connection terminals for an external signal, formed on the UBMs. As stated above, the present invention has advantages of guaranteeing the hermetical sealing since the above layers prevent moisture absorption from outside at the same time of lowering possibility of damages to the device inside the package since the processing temperature drops below 150° upon wafer bonding due to the use of the polymer substance as a bonding substance.

The invention discloses a composite fire-proof material with high refractoriness under load for coke ovens. The preparation method of the material comprises the following steps of: evenly mixing and crushing 40%-60% of Al2O3, 15%-30% of SiC micro powder, less than 2% of Fe2O3, 5%-10% of Si micro powder and 1%-3% of cement as an additive; adding 3%-5% of Al(H2PO4)3 as an adhesive and stirring and mixing evenly; and pouring the mixture to a working region in 20-30 minutes. The furnace-building process comprises the following steps of: cleaning a kiln, measuring, molding, positioning and supporting a mould, adding materials, pouring and correcting, cleaning, starting for warming up and testing. The coke ovens newly built by pouring is characterized in that the top of the chamber of the furnace is fan-shaped, the chamber of the furnace is built by on-site seamless overall vibration pouring according to the process above with the furnace-building materials above, afterheat of the furnace can be recycled for power generation and no chemical residues exist. The furnace is short in charring time and higher in coke recovery and can be started and used at any time between the normal temperature and 1550 DEG C.

The invention relates to a compound sealing method for glass plates, which is characterized by realizing the air-tight joint between compounded glass plates in a preset position by using a metal brazing technology. The invention provides a brand new technological method for the compound sealing between glass plates. The method has the advantages of firm connection in sealing positions, high air tightness, favorable thermal shock resistance and the like, and the annealing of toughened glass are avoided because of a lower brazing temperature used, thereby providing convenience to the processing of toughened vacuum glass, toughened insulated glass and other toughened compound glass products

The invention relates to an under-pressure grouting and hole sealing device and method for gas extraction drill air bag blocking. The device is characterized in that the device comprises an extraction pipe, a first tip air bag, a second tip air bag, a slurry outlet pipe and a grouting pipe, wherein the extraction pipe is composed of a first extraction pipe body, a second extraction pipe body and a third extraction pipe body, the first extraction pipe body is sleeved with the first tip air bag, a one-way needle valve is arranged on the first tip air bag, the slurry outlet pipe with a one-way check valve arranged inside penetrates through the first tip air bag, the outer end of the slurry outlet pipe is communicated with the grouting pipe, the third extraction pipe body is sleeved with the second tip air bag, a one-way needle valve is arranged on the second tip air bag, the two ends of the second extraction pipe body are connected with one end of the first extraction pipe body and one end of the third extraction pipe body respectively, the tip of the other end of the third extraction pipe body is provided with a plurality of sieve holes which allow gas to inflow, and the first tip air bag and the second tip air bag are filled with expansion agents in advance. The device and the method can be widely applied to permanent hole sealing for coal mine underground gas extraction hole drilling.

The invention discloses a vertical sinter ore cooling machine capable of efficiently recycling the sensible heat of sinter ores, which pertains to the technical field of sintering equipment and is used for preventing air leak in the cooling course of sinter ores and effectively recycling the sensible heat of the sinter ores. The technical proposal of the invention is that: the cooling machine consists of a feeding part, a cooling part and a conveying part; the cooling part comprises a vertical closed body, a hot wind pipeline, a blower, as well as a hopper, an upper sealing valve, a pre-storing chamber, a lower sealing valve, a heat exchanging chamber, a wind distributing board, an isopiestic wind chamber and a discharging channel which are in sequence arranged on the body from top to bottom; an annular wind chamber is arranged between the pre-storing chamber and the heat exchanging chamber; the annular wind chamber is communicated with the hot wind pipeline; the isopiestic wind chamber is communicated with the blower; and wind shields and ore falling openings are distributed evenly on the wind distributing board . The vertical sinter ore cooling machine has the following advantages of: 1. an air leak rate near to 0; 2. improved gas-solid heat exchange efficiency of the cooling machine; 3. raised quality of the recycled hot air; and 4. being beneficial to increasing the utilization rate of exhaust-heat boilers. Based on the advantages, the vertical sinter ore cooling machine is expected to be used commonly as an upgraded replacement of the existing sinter cooling machine.

The production method of austenitic stainless steel plate fin heat exchanger includes the following steps: part preparation: partition, sealing strip, fin, sealing head and connecting pipe preparation; cleaning before welding; acid pickling to remove oil, dirt and oxide, and using high-pressure water to wash; element assembling and holding; vacuum braze welding, adopting argon arc welding to weldscaling head and connecting pipe, making general assembly; test and inspection, making x-ray inspection, helium leak detection, flow resistance test, pressure test, TUV, ASME and other test and inspection. Said invented process raise the production quality of said stainless steel plate fin heat exchanger, tensile-strength of connector and its service life.

In order to give excellent hermeticity in a broad temperature range to an electrochemical device, a sealant comprising a rubber component and a tackifier is used, the rubber component comprising at least one of butyl rubber and polyisobutylene rubber, the tackifier comprising at least one selected from the group consisting of a terpene resin, an aliphatic petroleum resin and an alicyclic petroleum resin.

Methods and assemblies related to frame or bezel packaging of a sealed glass assembly, such as a fit-sealed OLED device, such as an OLED display panel. The frame or bezel packaging may have one or more of (a) rounded or chamfered corners, (a) a cover, (b) a reinforced lead edge, (c) openings or cutouts in the back panel to conserve material and lighten the bezel, and (d) a shock absorbent intermediate layer of low modulus of elasticity material applied between the sealed glass assembly and the back and / or sides of the frame or bezel. The frame or bezel design may include a gap between the sealed glass assembly and the back panel of the bezel. The gap may be filled at least in part with low modulus of elasticity backing material. The glass package may have one or more of (a) rounded or chamfered corners, (b) rounded or chamfered edges, (c) a low modulus of elasticity material applied around its periphery or portions of its periphery, such as on the corners only, (d) a shortened lead end, and (e) a thickened lead end.