1521 results about "Electronic chip" patented technology

Apparatus for remote interaction with an object of interest includes a remote station for obtaining information from the object of interest, a base station for transmitting energy in space to and communicating with the remote station and the remote station having conversion means for energizing the remote station responsive to receipt of the transmitted energy. The energy may be of any suitable type including RF power, light, acoustic, magnetic energy or other form of space transmitted or "radiant" energy. The remote station does not have to contain a source of stored energy or a wired connection to a source of energy. The remote station receives the energy transmission and data transmission from the base station and transmits data to the base station. Microprocessor controllers may be provided for the base station and the remote station. The remote station may receive information from sensors and through one or more transponders sequentially communicate information to the base station. An associated method is provided. In other embodiments which are suited for use in miniaturized electronic chip systems, power enhancement and increased effective antenna size are provided. An electronic article containing a microchip having at least one antenna structured to communicate with an antenna remotely disposed with respect to the microchip formed therein and an associated method are provided.

A method of fabricating an electronic chip on a wafer in which a first mask at a predetermined lower resolution is developed on the wafer and then etched under a first set of conditions for a predetermined period to achieve a mask that is below the resolution limit of current lithography. The etched mask is then used as a hard mask for etching material on a lower layer.

A method of forming a thinned encapsulated chip structure, wherein the method comprises providing a separation structure arranged within an electronic chip, encapsulating part of the electronic chip by an encapsulating structure, and thinning selectively the electronic chip partially encapsulated by the encapsulating structure so that the encapsulating structure remains with a larger thickness than the thinned electronic chip, wherein the separation structure functions as a thinning stop.

An electronic card game provides an electronic card game to a plurality of players on an electronic card table. The electronic card table includes a table top with a playing surface and a plurality of electronic player interaction areas located around a periphery of the table top. Each electronic player interaction area provides a player interface for interaction with one of the players. A server computer administers the electronic card at the electronic card table using electronic cards and electronic chips. The electronic card table reports information regarding play of the electronic card game to the server computer. The server computer stores the information in a database.

A system provides an electronic card game to a plurality of players on an electronic card table. The electronic card table has a table top with a playing surface and a plurality of electronic player interaction areas located around a periphery of the table top. Each electronic player interaction area provides a player interface for interaction with one of the players. A database maintains a player account for each player. Each player account includes identification information and a monetary amount. A server computer is coupled to the plurality of electronic player interaction areas and the database for administering the electronic card game using electronic cards and electronic chips. The server computer allows each player to log-in to one of the electronic player interaction areas, draw down at least a portion of the monetary amount in their player account, and purchase electronic chips using the drawn down portion of the monetary amount.

A heat dissipation system is provided. The heat dissipation system includes: an evaporator having a plate chamber with the wick structures which has a plurality of pore sizes arranged in the plate chamber, a condenser, a vapor line, and a liquid line. The two-phase circulation of the vapor-condensate in the heat dissipation system, especially in the heat dissipation system with a plate evaporator, can effectively increase the heat conductivity of the plate heat source such as electronic chip. The design and composition of the wick structures are enormously decreased the turning-on temperature of the heat dissipation system and maintained the heat dissipation system in the balancing state under the low heat source power.

An optical navigation sensor apparatus for an optical mouse includes an optical navigation sensor having an electronic chip, an aperture plate and an imaging lens integrated into a single package. The imaging lens includes a lens housing surrounding the aperture and providing a barrier to the entry of foreign matter into the aperture. In one form, the optical navigation sensor also includes a light emitting diode (LED) for illuminating a small area of a surface under the sensor and generating a reflected image that is detected by the electronic chip. In a sensor having an integral LED, an integral collimating lens is included for receiving light from the LED and focusing the light from the LED on the surface to be illuminated. The collimating lens is incorporated into a lens housing surrounding the LED and protecting the LED from exposure to foreign material.

A system and method provides an electronic poker game to a plurality of players using an electronic poker table. The electronic poker table has a table top with a playing surface and a plurality of electronic player interaction areas located around a periphery of the table top. Each electronic player interaction area provides a player interface for interaction with one of the players. The electronic poker table includes at least one device coupled to the electronic poker table for reading tickets having an associated value. A game computer administers the electronic poker game by using electronic cards and electronic chips, associates the value of a first ticket read by the at least one device with one of the players and allows the one player to purchase electronic chips with at least a portion of the value of the first ticket.

An electronic packaging combines features of a MAP (molded array package) and a lead frame package. The package includes an electrically conductive substrate somewhat like a lead frame package but defines a grid of conductive pads rather than a multiplicity of leads as is common with a lead frame package. An electronic chip is attached to the top surface of the lead frame, and the output terminals of the electronic chip are individually electrically connected to selected connecting pads of the lead frame grid array. Both flip chips and wire bond chips may be connected to the grid array. The channels defining the grid of connecting pads extend part way through the conductive substrate and increase in width from the top surface of the lead frame to the bottom of the channel such that the molding compound is locked in place when it cures and hardens. The grid pads are then singulated by sawing or etching channels from the bottom surface of the lead frame substrate that correspond to the channels defining the connecting pads on the top surface.

An integrated sensor and electronics package wherein a micro-electromechanical sensor die is bonded to one side of the package substrate, one or more electronic chips are bonded to an opposite side of the package substrate, internal electrical connections run from the sensor die, through the package substrate, and to the one or more electronic chips, and input / output connections on the package substrate are electrically connected to one or more of the electronic chips.

A method for assembling a device on two substantially parallel taut threads. The device includes an electronic chip and two substantially parallel grooves open on opposite sides of the device. The distance separating the grooves corresponds to the distance separating the threads. The device presents a penetrating shape along an axis perpendicular to the plane of the grooves, having a base at the level of the grooves and an apex of smaller size than the distance separating the threads. The method includes the steps consisting in placing the apex of the device between the two threads; in moving the device between the two threads resulting in the threads being separated from one another by the penetrating shape of the device; and in continuing movement of the device until the threads penetrate into the grooves reverting to their initial separation distance.

A composition for use as underfill material is provided. The underfill material includes a first curable transparent resin composition and a second curable fluxing resin composition. The first curable resin composition includes at least one aromatic epoxy resin in combination with a solvent, a functionalized colloidal silica dispersion, and at least one other component selected from the group consisting of cycloaliphatic epoxy monomers, aliphatic epoxy monomers, hydroxy aromatic compounds and combinations and mixtures thereof, thereby forming a solvent-modified resin. The second curable fluxing composition includes at least one epoxy resin. The combination of the two resin compositions is useful in producing underfill materials and is suitable for use as an encapsulant for electronic chips.

A plurality of heat-dissipating electronic chips are arranged in a vertical chip stack. The electronic chips have electronic components thereon. A cold plate is secured to a back side of the chip stack. A silicon carrier sandwich, defining a fluid cavity, is secured to a front side of the chip stack. An inlet manifold is configured to supply cooling fluid to the cold plate and the fluid cavity of the silicon carrier sandwich. An outlet manifold is configured to receive the cooling fluid from the cold plate and the fluid cavity of the silicon carrier sandwich. The cold plate, the silicon carrier sandwich, the inlet manifold, and the outlet manifold are configured and dimensioned to electrically isolate the cooling fluid from the electronic components. A method of operating an electronic apparatus and a method of manufacturing an electronic apparatus are also disclosed. Single-sided heat removal with double-sided electrical input-output and double-sided heat removal with double-sided electrical input-output are also disclosed.

A method and apparatus for accurately registering electronic chip bonding pads with substrate leads. Images are developed of different portions of the interface between the electronic chip and the substrate by reflecting collimated, parallel light from the bottom of the chip through transparent areas of the substrate. Image analysis of the composite, superimposed images from spaced positions containing the bonding pads and the leads provide a corrective positioning after which the electronic chip and substrate are brought into contact.