955 results about "Signal integrity" patented technology

The present invention is directed to a system that programmably interconnects integrated circuit chips and other components at near-intra-chip density. The system's contact structure allows it to adapt to components with a wide variety of contact spacings and interconnection requirements, the use of releasable attachment means allows component placement to be modified as needed, the system identifies the contacts and the components to facilitate specifying the inter-component connections, and the system provides signal conditioning and retiming to minimize issues with signal integrity and signal skew.

Over-terminating the differential mode impedance of a differential transmission line, such as an INFINIBAND™ cable, at the receiving end, improves the differential signal integrity for typical variations in termination network impedance component (e.g., resistor) and transmission line characteristics. Eye opening of the differential signal can be made larger with reduced attenuation but increased jitter compared to under-terminating the differential mode impedance. Because the differential signal quality (larger eye opening) is improved, data can be transmitted over a longer transmission line with the same transmitter and receiver.

The invention details methods and apparatus for a routing system or router that includes a model. The model can be in many different forms including but not limited to: resolution enhancement technologies such as OPC; lithography model including but not limited to aerial image; pattern-dependent functions; functions for timing / signal integrity / power; manufacturing process variations; and measured silicon data. In one embodiment, the model can be described as input to the system and the model calculator can interact either with the data structure or the query engine of the detail router or both. The model calculator can accept input as a set of geometry description and produce output to guide the query functions. An example technique called set intersection is disclosed herein to combine multiple models in the system. A preferred embodiment of this invention includes a full chip grid-based router being aware of manufacturability.

A signal integrity network analyzer is provided. The analyzer preferably includes a characterization module for characterizing a device under test, an acquisition module for acquiring a waveform, a de-embedding module for selectively embedding and de-embedding on or more system fixtures, and an analysis module for performing analysis on the acquired waveform, with one or more system features selectively embedded or de-embedded. A single user interface is provided and is adapted to control the characterization module, the acquisition module, the de-embedding module and the analysis module.

A package-board co-design methodology preserves the signal integrity of high-speed signals passing from semiconductor packages to application PCBs. An optimal architecture of interconnects between package and PCB enhances the signal propagation, minimizes parasitic levels, and decreases electromagnetic interference from adjacent high frequency signals. The invention results in devices with superior signal quality and EMI shielding properties with enhanced capability for carrying data stream at multiple-gigabit per second bit-rates.

Coaxial and twisted pair conductive yarn structures reduce signal crosstalk between adjacent lines in woven electrical networks. A coaxial conductive yarn structure includes an inner conductive yarn having a plurality of conductive strands twisted together. An outer conductive yarn is wrapped around the inner conductive yarn. An insulating layer separates the inner and outer yarns. A twisted pair conductive yarn structure includes first and second conductive yarns, each including a plurality of conductive strands being twisted together. The first and second conductive yarns are twisted together to form a helical structure. In a woven electrical network, at least one conductor of adjacent conductive yarn structures is connected to ground to reduce signal crosstalk. Coaxial and twisted pair yarn structures may also be formed simultaneously with weaving or knitting the threads that make up the structures into a fabric.

An interconnection system with capacitors integrated into a printed circuit board footprint of an electrical connector. One end of each capacitor shares a pad on the printed circuit board with a contact tail of a conductive element in a connector. The shared pads are not connected through vias to internal circuit structures. Rather, a via, such as which would conventionally be formed as part of the connector mounting pad, is formed as part of a separate, adjacent pad. A second end of the capacitor is attached to the adjacent pad, forming an electrical connection between the conductive element and the via through the capacitor. Incorporating capacitors into the footprint reduces the number of vias required, which improves signal integrity. The capacitors may be placed on the printed circuit board separately from the connector or may be incorporated into the connector, allowing the connector and capacitors to be placed in one operation.

A circuit card stripline Fast Faraday cup quantitatively measures the picosecond time structure of a charged particle beam. The stripline configuration maintains signal integrity, and stitching of the stripline increases the bandwidth. A calibration procedure ensures the measurement of the absolute charge and time structure of the charged particle beam.

A Signal Conditioning Filter (SCF) and a Signal Integrity Unit (SIU) address the coupled problem of equalization and noise filtering in order to improve signal fidelity for decoding. Specifically, a received signal can be filtered in a manner to optimize the signal fidelity even in the presence of both significant (large magnitudes of) ISI and noise. The present invention can provide an adaptive method that continuously monitors a signal fidelity measure. Monitoring the fidelity of a multilevel signal can be performed by external means such as by the SIU. A received signal y(t) can be “conditioned” by application of a filter with an electronically adjustable impulse response g(t). A resulting output z(t) can then be interrogated to characterize the quality of the conditioned signal. This fidelity measure q(t) can be used to adjust the filter response to maximize the fidelity measure of the conditioned signal.

The present invention is a polymeric composite comprising a polyimide component and a fluoropolymer component derived from a micro powder. The fluoropolymer micro powder has a melt point between 250 and 375° C. The fluoropolymer micro powder has an average particle size between 20 and 5000 nanometers (5.0 microns). The polyimide component and the fluoropolymer component are inter-mixed at a high dispersion level where the fluoropolymer component is present in a weight ratio from 10 to 60 percent. The polymeric composite of these two components is particularly useful in the form of a thin film used in high-speed digital circuitry or high signal integrity for low loss of a digital signal. The film can also be used as a wire wrap, or as a coverlay or base film substrate for flexible circuitry laminates.

A method and apparatus for integrated circuit layout optimization are provided. In the conventional art, the major challenges in building integrated circuits (IC) at sub-wavelength geometries include i) to ensure the design intent is faithfully transferred onto silicon; ii) to ensure the design is manufacturable, or with acceptable yield subject to process variations. The present invention provides the method to process a layout database to optimize or correct or fix layout violations or enhancements. The layout violations are identified through various means such as design rules, recommended rules, timing / signal integrity / power constraints, lithography rules, Resolution Enhancement Technologies (RET) requirements and preferences, and process and manufacturing constraints. Particularly, the method, techniques and procedures of creating software tools of the present invention used to perform the layout violations or enhancements are disclosed.

A method and apparatus is provided for quantifying the upstream communication signals transmitted by remotely deployed CMs, and particularly cable modems operated consistent with the DOCSIS specification. Specifically, the method and apparatus provides the capability to capture, demodulate, and analyze the digital transmission originating from a CM source of known or unknown origin, and determine the unique MAC address or SID of the source CM that is measured. Additionally, the method and apparatus has the ability to analyze in the presence of many CMs, a specific user defined or user defined range of CMs by the implementation of real-time filtering either by method of pre-determination of the arrival time of the CM signal or by real-time filtering and analysis of the captured CM signal.

Design-specific attributes of a circuit (such as timing, power, electro-migration, and signal integrity) are used to automatically identify one or more regions of one or more layers in a layout of the circuit. The automatically identified regions may be provided to a manufacturing tool in GDSII by use of overlapping shapes in, or alternatively by moving existing shapes to, a different layer / datatype pair. For example, information about the automatically identified regions may be stored using a conventional datatype (e.g. value 0) with a new layer, or alternatively using a conventional layer (e.g. metal 3) with a new datatype (e.g. value 1), depending on the embodiment. The automatically identified regions contain cells and / or features (e.g. groups of shapes and / or individual shapes) whose tolerance in silicon (to be fabricated) is automatically changed from default, based on the design-specific attribute(s) and sensitivity thereto, expressed as design intent by a circuit designer.

The presently claimed invention is to provide a package for compact RF signal system, and a method to form the package thereof in order to miniaturize the size of package, improve signal integrity, and reduce manufacturing cost. The package comprises a hybrid substrate with a sandwiched structure, in which the hybrid substrate comprises an upper layer and a lower layer with different dielectric properties being separated by an interposer for improving electrical isolation and mechanical stiffness. Metal layers are formed on the sidewalls of the opening to surround an active component, such that the metal sidewalls together with two ground plates in the upper and lower layers constitute a self-shielding enclosure inside the package to protect the active component.

Systems and methods are described for detachable antennas. A wireless communications device includes: a cam body defining a rotation axis, the cam body including a retaining zone having a snap-fit receptacle; a signal pin including a first signal pin end and a second signal pin end; an antenna conductively coupled to the first signal pin end; a signal clip with a protrusion, a contact pad with a recess, and a key pin that extends from the signal pin, the key pin having a first key pin end and a second key pin end, and being snap-fit into the snap-fit receptacle. The systems and methods provide advantages in that the detachable antenna is easily replaced without tools.

Mounting devices for optical devices, and related sub-assemblies, apparatuses, and methods are disclosed. The mounting devices may be employed to secure optical devices that are configured to convert optical signals to electrical signals, or electrical signals to optical signals. The mounting devices may be configured to secure optical devices to an electronics board, such as a printed circuit board (PCB) as an example. To preserve signal integrity, the mounting devices may also be configured to align the optical devices with electrical lead connections on the electronics board. The mounting devices may also be configured to improve grounding of the optical devices to provide and improve radio frequency (RF) shielding to avoid degradation of signal-to-noise (S / N) ratios from RF interference from electronic devices on the electronics board and other nearby electronic devices.

The invention provides a signal connector and relates to the field of data transmission. The signal connector includes a backplane connection portion and a daughter card connection unit. The backplaneconnection portion is provided with a first signal terminal pair and a first shielding sheet, and the daughter card connection unit is provided with a second signal terminal pair and a second shielding sheet. When the backplane connecting portion and the daughter card connecting unit cooperate with each other, the first signal terminal pair and the second signal terminal pair are joined one by one, and the first shielding sheet and the second shielding sheet can form a shielding cavity which coats the first signal terminal pair and the second signal terminal. Through the signal connector provided by the invention, the better shielding structure can be formed between transmission signals, the signal crosstalk can be reduced, and the signal integrity can be improved.

Apparatus enabling modular implementation of active optical cable (AOC) with multiple integrated functions including: integration of different types of data on the AOC via media conversion; distribution of electrical power over the AOC; electrical multiplexing data channels for optical fibers; integration of voltage regulators enabling AOC operation at different supply voltages; integration of voltage regulators to provide stable, low noise power source; ruggedized, blind-mateable electrical connectors; integration of electronics and optoelectronics inside a connector backshell; implementation of health monitoring and test channel enabling monitoring, test, and control of both ends of the AOC and monitoring and control of upstream systems and components; and enabling a form, fit, function replacement of existing electrical cables to improve SWaP, electromagnetic interference resiliency, length-bandwidth product, electromagnetic pulse resistance, signal integrity, system reliability, testability and maintenance. AOCs are customized for different connectors, pin-outs, electrical data combinations, power distribution and power supplies with minimal redesign / requalification.

A radio receiver includes a first diversity antenna structure, a second diversity antenna structure, a first RF receiver section, a second RF receiver section, a combining module, and a baseband processing module. The first diversity antenna structure includes a plurality of first antennas and each of the plurality of first antennas is operably coupled to receive inbound radio frequency (RF) signals, wherein the first diversity antenna structure provides the received inbound RF signals from one of the plurality of first antennas based on a first antenna selection signal to produce first received inbound RF signals. The second diversity antenna structure includes a plurality of second antennas and each of the plurality of second antennas is operably coupled to receive the inbound RF signals, wherein the second diversity antenna structure provides the received inbound RF signals from one of the plurality of second antennas based on a second antenna selection signal to produce second received inbound RF signals. The first RF receiver section is operably coupled to convert the first received inbound RF signals into first inbound baseband signals. The second RF receiver section is operably coupled to convert the second received inbound RF signals into second inbound baseband signals. The combining module is operably coupled to combine the first and second inbound baseband signals to produce inbound baseband signals. The baseband processing module is operably coupled to convert the inbound baseband signals into inbound data and to produce the first and second antenna selection signals based on signal integrity of the first and second diversity antenna structures, respectively.

A cable structure for signal transmission comprises a connector housing and a plurality of housing contacts positioned within a defined contact plane in the connector housing. The housing contacts are configured for engaging external contacts of a device when the cable structure is coupled to a device. At least one signal conductor terminates in the connector housing, and is electrically coupled to one of the housing contacts generally in said contact plane. At least one ground conductor terminates in the connector housing, in a second plane spaced from the contact plane. A shorting bar has a first portion positioned generally in said contact plane and electrically coupled to a housing contact. A second portion of the shorting bar is positioned generally in said second plane and is electrically coupled to the ground conductor. The shorting bar maintains the signal conductor and ground conductor termination within separate spaced planes to improve the signal integrity of the cable structure while keeping the housing contacts in a common plane.