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115 results about "Design intent" patented technology

System and Method for Identifying Original Design Intents Using 3D Scan Data

Programmatic extraction and management of solid and surface modeling parameters from raw 3D scan data is discussed. An automated process reads raw 3D scan data and works in communication with a CAD system able to perform CAD part modeling. The user is provided with an automatic function to segment a mesh model (formed from the raw 3D scan data) into dozens of mesh regions. A graphical user interface is provided which enables a user to choose a type of the design intent along with the mesh regions from which the design intent is calculated. Each design intent is represented in a vector, a plane or a poly-line depending upon the type of design intent. In response to a user demand for the parameters of a modeling feature, a best approximation of the requested parameter value is calculated by processing the raw 3D scan data using a set of functions.
Owner:INUS TECH

Dynamic layout system and processes

A completely free form layout of the physical content of a publication. The publication is represented as an unstructured set of content objects whose design relationships are specified as separate relationship objects, all of which interact with objects representing the properties of the display media. Through this representation, the present invention is better able to capture, represent and display the design intent of a designer throughout the entire design process.
Owner:QUARK INC

Mechanical product design two-dimensional knowledge pushing method based on design intent

ActiveCN104899242ARich knowledge push resultsAdapt to the needs of deepening developmentSpecial data processing applicationsInformatizationConcept Attribute
The present invention discloses a mechanical product design two-dimensional knowledge pushing method based on design intents. The mechanical product design two-dimensional knowledge pushing method mainly comprises: establishing a mechanical product design intent database, establishing a design intent acquisition and decomposition method, constructing a design intent attribute table by a rough set theory and performing reduction to obtain the simplest design intent set; establishing a mechanical product design knowledge ontology database; and calculating similarity degrees between intent elements and a compared knowledge ontology in a sequential traversing manner by using an improved similarity degree matching algorithm based on a knowledge ontology concept semantic distance and a concept attribute, sequentially carrying out matching on each intent element, of which the similarity degree is greater than a threshold value, in an intent element set from large to small according to the similarity degrees until completing all the matching, and completing matching of the knowledge ontologies by utilizing a text semantic similarity degree calculating method. The mechanical product design two-dimensional knowledge pushing method can solve the problem of low knowledge intelligent degree of knowledge pushing in the mechanical product design, can improve efficiency of mechanical product design and is suitable for the requirement of the manufacturing information engineering technology for deepening development.
Owner:SICHUAN UNIV

Method and apparatus for determining mask layouts for a multiple patterning process

One embodiment provides a method for determining mask layouts. During operation, the system can receive a design intent. Next, the system can determine a set of critical edges in the design layout, and select a first edge and a second edge. The system can then determine a first trench and a second trench using the first edge and the second edge, respectively. Note that an edge of the first trench may substantially overlap with the first edge, and an edge of the second trench may substantially overlap with the second edge. Next, the system may assign the first trench and the second trench to the first mask layout and the second mask layout, respectively. The system can then increase the first trench and the second trench, thereby improving pattern fidelity. The resulting mask layouts may be used in a double patterning process.
Owner:SYNOPSYS INC

Integrated method for measurement and reconstruction of three-dimensional model and system thereof

InactiveCN101630418ASimplify the reverse engineering processFully consider the design intentUsing optical meansStereoscopic photographySurface markerComputer vision
The invention relates to an integrated method for the measurement and reconstruction of a three-dimensional model and a system thereof. The method comprises the following steps: 1) obtaining the three-dimensional coordinates of surface markers of an object sample; 2) interactively constructing the three-dimensional model based on the three-dimensional coordinates. The method integrates measurement and reconstruction as a whole and simplifies an inverse reconstruction process of the three-dimensional model to benefit for the rapid inverse reconstruction of the object sample and to avoid complex secondary measurement (supplement measurement) and guarantee the integrity of the reconstructed model. Color and texture information of surfaces of the samples can be reconstructed, data volume of the reconstructed model is small and is suitable for being used under network environment. Repeated measure can be effectively avoided to improve the efficiency of measurement and reconstruction. A measuring apparatus has the advantages of small volume, light weight and convenient motion. The design intent of the model can be fully considered in the measurement and reconstruction process in favor of measurement planning.
Owner:白晓亮 +2

Modeling and correcting short-range and long-range effects in e-beam lithography

Processes and apparatuses are described for modeling and correcting electron-beam (e-beam) proximity effects during e-beam lithography. An uncalibrated e-beam model, which includes a long-range component and a short-range component, can be calibrated based on one or more test layouts. During correction, a first resist intensity map can be computed based on the long-range component of the calibrated e-beam model and a mask layout. Next, a target pattern in the mask layout can be corrected by, iteratively: (1) computing a second resist intensity map based on the short-range component of the calibrated e-beam model and the target pattern; (2) obtaining a combined resist intensity map by combining the first resist intensity map and the second resist intensity map; and (3) adjusting the target pattern based on the combined resist intensity map and the design intent.
Owner:SYNOPSYS INC
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