An apparatus and method are provided for replacing parts in a
vacuum chamber without venting the vacuum. A
transfer system is used to transfer a removably mounted component from a
processing module that is attached to a
transfer system and replacing the component with another component from a
maintenance system that is connected through an isolation
assembly to a transfer module. The
maintenance system may include a supply of replacement parts and receive expended or otherwise serviceable items that are to be replaced. These serviceable items may include chamber component that has a tendency to degrade during processes being performed in the
processing module. Typically, such items are etched or eroded away or accumulate coatings, requiring occasional removal and replacement. Focus rings, chamber shields, dark space shields, insulators, deposition baffles and adaptors are some of the items requiring periodic replacement. Such items are installed in the
process module in a way that permits their removal and replacement by a transfer arm or other
transfer mechanism of the
transfer system or otherwise by robotic mechanisms. The
processing module may be an
etching, deposition, ALD, patterning, developing,
metrology, thermal processing, cleaning or other module used in a vacuum process, particularly for processing of
semiconductor wafers.