964 results about "Liquidus" patented technology

A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.

A method and apparatus are described for the casting of a composite metal ingot comprising at least two separately formed layers of one or more alloys. An open ended annular mould has a feed end and an exit end and divider wall for dividing the feed end into at least two separate feed chambers, where each feed chamber is adjacent at least one other feed chamber. For each pair of adjacent feed chambers a first alloy stream is fed through one of the pair of feed chambers into the mould and a second alloy stream is fed through another of the feed chambers. A self-supporting surface is generated on the surface of the first alloy stream and the second alloy stream is contacted with the first stream such that the upper surface of the second alloy stream is maintained at a position such that it first contacts the self-supporting surface where the self-supporting surface temperature is between the liquidus and solidus temperatures of the first alloy or it first contacts the self-supporting surface where the self-supporting surface temperature is below the solidus temperatures of the first alloy but the interface between the two alloys is then reheated to between the liquidus and solidus temperatures, whereby the two alloy streams are joined as two layers. The joined alloy layers are then cooled to form a composite ingot. This composite ingot has a substantially continuous metallurgical bond between alloy layers with dispersed particles of one or more intermetallic compositions of the first alloy in a region of the second alloy adjacent the interface.

A 3D Printing Rapid Prototyping process using Al / Mg particles coated with a metal (i.e. copper, nickel, zinc, or tin) that (1) prevents oxidation of the Al / Mg particles, and (2) either alone, or when alloyed with the aluminum or magnesium core metal, melts below the liquidus temperature of the core.

Solder compositions are introduced to interface between an IC chip and its associated heat exchanger cover. The solder compositions have a solidus-liquidus temperature range that encompasses the IC chip operational temperature range. The solder composition has the desired property of absorbing and rejecting heat energy by changing state or phase with each temperature rise and decline that result from temperature fluctuations associated with the thermal cycles of the integrated circuit chips. A path for high thermal conduction (low thermal resistance) from the IC chip to the heat exchanger to the ambient air is provided by an electronic module cover, configured as a cap with a heat exchanger formed or attached as a single construction, and made of the same material as the substrate, or made with materials of compatible thermal coefficients of expansion to mitigate the effects of vertical displacement during thermal cycling. The cap-heat exchanger cover is constructed to be compliant, and to contact both the IC chip and substrate.

A low-melting point, heat transfer fluid made of a mixture of four inorganic nitrate salts: 9-18 wt % NaNO3, 40-52 wt % KNO3, 13-21 wt % LiNO3, and 20-27 wt % Ca(NO3)2. These compositions can have liquidus temperatures less than 100 C; thermal stability limits greater than 500 C; and viscosity in the range of 5-6 cP at 300 C; and 2-3 cP at 400 C.

A method of a drawing a glass ribbon from molten glass sheet via a downdraw process by creating a temperature drop across a thickness of the molten glass flowing over forming surfaces of a forming wedge. The forming wedge includes an electrically conductive material for heating the glass above the root.

Sodium containing aluminosilicate and boroaluminosilicate glasses are described herein. The glasses can be used as substrates or superstrates for photovoltaic devices, for example, thin film photovoltaic devices such as CIGS photovoltaic devices. These glasses can be characterized as having strain points≧535° C., for example, ≧570° C., thermal expansion coefficients of from 8 to 9 ppm / ° C., as well as liquidus viscosities in excess of 50,000 poise. As such they are ideally suited for being formed into sheet by the fusion process.

A method of joining contacts on two chips, each having multiple contacts, to each other involves maintaining a first of the chips at a first temperature, the first of the chips having a rigid electrical contact thereon, bringing a second chip, having an electrical contact that is malleable with respect to the rigid contact and matingly corresponding thereto, into contact with the first such that the corresponding rigid and malleable contacts are brought together, locally raising the second of the chips to a local temperature that is sufficiently high to cause material of the rigid and malleable contact to interdiffuse, interpenetrate or both, but below both a temperature that would cause the material to become liquidus and a fuse temperature, and allowing the second of the chips to cool to at least the first temperature.

Methods of drawing glass sheet via a downdraw process are provided. In certain aspects, the methods utilize rapid cooling below the root (70) of the forming apparatus (10). Such rapid cooling can, for example, facilitate the use of glass having a liquidus viscosity less than about 100,000 poise. In other aspects, the methods utilize slow cooling between the viscosities of 1011 poises and 1014 poises. Such slow cooling can facilitate the production of glass substrates which exhibit low levels of compaction. In further aspects, substrates are removed from the glass sheet at elevated temperatures which can facilitate increases in the production rates of downdraw machines. In still further aspects, rapid cooling below the root, slow cooling between the viscosities of 1011 poises and 1014 poises, and / or substrate removal at elevated temperatures are combined. Such combinations can facilitate economically effective utilization of downdraw equipment.

The invention discloses a high strength glass fiber composition which comprises the components with the weight percentage: 58-65% of SiO2, 14-20% of Al2O3, 15-25% of CaO+MgO, 0.05-1% of K2O+Na2O, 0.05-1% of Fe2O3 and 0.1-2% of CeO2; wherein, the proportional relation of the components is that CaO / MgO is more than 0.7 and less than 2.2. By preference and combination of the components, the high strength glass fiber composition not only can fully utilize rich raw mineral materials of China, but also can reduce mold temperature, liquidus temperature and clarification temperature and has lower total cost and easy large scale commercial process under the premise of ensuring the high strength of glass fiber.

Disclosed is a process for producing a glass substrate for an information recording medium by press-shaping a molten glass which gives a glass containing 0.1 to 30 mol % of TiO2, 1 to 45 mol % of CaO, 5 to 40 mol % of total of MgO and the above CaO, 3 to 30 mol % of total of Na2O and Li2O, 0 to 15 mol % of Al2O3 and 35 to 65 mol % of SiO2 and having properties of a liquidus temperature of 1,360° C. or lower and a viscosity of at least 10 poise in a shaping-allowable temperature range, or by preparing a preform formed of a glass which contains 0.1 to 30 mol % of TiO2, 1 to 45 mol % of CaO, 5 to 40 mol % of total of MgO and the above CaO, 3 to 30 mol % of total of Na2O and Li2O, 0 to 15 mol % of Al2O3 and 35 to 65 mol % of SiO2 and has properties of a liquidus temperature of 1,360° C. or lower and shaping the preform in the form of a disc by a re-heat pressing method. According to the above process, there can be mass-produced, with high productivity, high-quality glass substrates to be used for information recording media such as a magnetic disc, an optical disc, a magneto-optic disc, and the like.

A thermal energy storage material (TESM) system (and associated methods) that reproducibly stores and recovers latent heat comprising i) at least one first metal containing material including at least one first metal compound that includes a nitrate ion, a nitrite ion, or both; ii) at least one second metal containing material including at least one second metal compound; and iii) optionally including water, wherein the water concentration if any is present is less than about 10 wt. %; wherein the TESM has a liquidus temperature, TL, from about 100° C. to about 250° C.; and wherein the TESM exhibits a heat storage density from 300° C. to 80° C. of at least about 1 MJ / l; so that upon being used in a system that generates heat, at least a portion of the heat is captured and stored by the TESM and subsequently released for use, and the system is generally resistant to corrosion at temperatures of about 300° C.

A lead-free solder alloy substantially contains Sn and Ti, and has a temperature of a liquidus line of not greater than 400° C. The lead-free solder alloy contains no toxic lead and has sufficient bonding strength to oxide materials such as glass and ceramics.

Improved silicon carbide composites made by an infiltration process feature a metal phase in addition to any residual silicon phase. Not only are properties such as mechanical toughness improved, but the infiltrant can be so engineered as to have much diminished amounts of expansion upon solidification, thereby enhancing net-shape-making capabilities. Further, multi-component infiltrant materials may have a lower liquidus temperature than pure silicon, thereby providing the practitioner greater control over the infiltration process. In particular, the infiltration may be conducted at the lower temperatures, where low-cost but effective bedding or barrier materials can terminate the infiltration process once the infiltrant has migrated through the permeable mass up to the boundary between the mass and the bedding material.

The invention provides microcrystalline glass and a substrate thereof. The microcrystalline glass is low in liquidus temperature, and comprises the following components in percentage by weight: 60 to80 percent of SiO2; 4 to 20 percent of Al2O3; 0 to 15 percent of Li2O; greater than 0 and smaller or equal to 12 percent of Na2O; 0 to 5 percent of K2O; greater than 0 and smaller or equal to 5 percent of ZrO2; 0 to 5 percent of P2O5; 0 to 10 percent of TiO2. Crystalline phase contains one or more of R2SiO3, R2Si2O5, R2TiO3, R4Ti5O12, R3PO3, RAlSi2O6, RAlSiO4O10, R2Al2Si2O8, R4Al4Si5O18, quartz and quartz solid solution. The liquidus temperature of the microcrystalline glass is 1450 DEG C or less, the heat conductivity is 2w / m.k or more, the Vickers hardness is 600 kgf / mm<2> or more, and the microcrystalline glass is applicable to portable electronic equipment and optical equipment.

Disclosed is a glass material essentially free of BaO and alkali oxide particularly suitable for the glass substrate of LCDs. The glass material consists essentially, expressed in mole percent on an oxide basis, of 70–80%, preferably 72–77% of SiO2, 3–9%, preferably 4–7% of Al2O3, 8–18%, preferably 10–16% B2O3, 3–10%, preferably 3–8% of CaO, 0–4%, preferably 0–3% RO, 0–0.2%, preferably 0–0.1% SnO, 0–1%, preferably 0 to 0.5% of XO, where RO represents, collectively, MgO, SrO and ZnO, XO represents, collectively, TiO2, ZrO2, Y2O3 and La2O3. The glass has a strain point in the range of over about 600° C., a coefficient of thermal expansion (CTE) in the range of about 23–35×10−7 / ° C., a density lower than about 2.35 g / cm3, a liquidus temperature lower than or equal to about 1200° C. and a durability in BHF less than or equal to 0.5 mg / cm2 weight loss.

A lead-free alloy solder containing rare-earth elements and multiple other elements for electronic package contains Ag (0.1-5 wt.%), Cu (0.1-1 wt.%), Bi (0.1-8 wt.%), In (0.1-7.5 wt.%), Sb (0-8 wt.%), the mixture of La and Ce or the mixture of La, Ce and one or both of Pr and Nd (0.01-2 wt.%) and Sn (the balance). It has liquidus temp less than 210 deg.c (even 190 deg.C or lower), less than 15 deg.c for liquidus and solidus temp difference, at least 60 MPa of yield strength, at least 18% of elongation percentage, excellent wetting ability, and high soldering quality.

When a glass melt of an optical glass having a refractive index (nd) of at least 1.7 and an Abbe number (νd) of 28 to 41 is flowed down from a flow pipe made of Pt or a Pt alloy to form glass gobs continuously, there is caused a problem that the glass gobs have striae or that the weight variability among the glass gobs is large, and the problem can be overcome by the use of an optical glass comprising silicon oxide and boron oxide, the ratio of a content of the silicon oxide to a content of the boron oxide being greater than 0.78, the optical glass having a contact angle of at least 40° to Pt or a Pt alloy at a predetermined temperature equivalent to, or higher than, its liquidus temperature or in a predetermined temperature range whose lower limit is equivalent to, or higher than, the liquidus temperature and having a sag temperature Ts of 580° C. or lower.

The invention belongs to the technical field of metal semisolid processing, relating to a method and a device for preparing semisolid metal slurry by mixing vibration. A slurry containing container is tightly fixed on a mechanical vibration table, and superheating molten metal 0-40 DEG C higher than the liquidus is poured into the slurry containing container of which the temperature is lower than molten metal temperature. An ultrasonic vibrator is lowered below the molten metal liquid level for 1-25 mm and simultaneously starts low-frequency mechanical vibration and supersonic vibration; after performing mixing vibration for certain time, the molten metal is controlled to be 5-30 DEG C below the liquidus temperature to obtain the semisolid metal slurry of which the solid phase rate is 5-40%. The semisolid metal slurry prepared with the method has fine primary and round grain and even distribution. The device of the invention comprises a slurry containing container, an attemperation unit, a supersonic generating and controlling unit, a low-frequency mechanical vibration generating and controlling unit and a lifting unit. The invention can be used for preparing semisolid slurry of various alloy parts, such as aluminium, magnesium, stannum, copper, zinc and the like as well as used for forming parts.

The invention discloses a glass fiber capable of being used as an advanced reinforced substrate of a composite material, comprising the following components in percentage by weight: 57 to 65 percent of SiO2, 14 to 20 percent of Al2O3, 8 to 13 percent of CaO, 7 to 12 percent of MgO, less than 23 percent of CaO and MgO, 0.05 to 2 percent of Na2O and K2O, and 0.05 to 1 percent of Fe2O3. While the mold temperature, the liquidus temperature and the refining temperature of the glass fiber are maintained to be relatively low, through optimization and combination of the components, the mechanical performance of the glass fiber is greatly improved compared with conventional E glass fiber, and the increase range of monofilament strength can be increased up to 26 percent, and the total cost of the glass fiber is possibly close to or lower than the cost of the conventional E glass fiber, thus being easy for implementing large-scale industrial production.

The invention generally encompasses phosphonium ionic liquids, salts, compositions and their use in many applications, including but not limited to: as electrolytes in electronic devices such as memory devices including static, permanent and dynamic random access memory, as electrolytes in energy storage devices such as batteries, electrochemical double layer capacitors (EDLCs) or supercapacitors or ultracapacitors, electrolytic capacitors, as electrolytes in dye-sensitized solar cells (DSSCs), as electrolytes in fuel cells, as a heat transfer medium, among other applications. In particular, the invention generally relates to phosphonium ionic liquids, salts, compositions, wherein the compositions exhibit superior combination of thermodynamic stability, low volatility, wide liquidus range, ionic conductivity, and electrochemical stability. The invention further encompasses methods of making such phosphonium ionic liquids, salts, compositions, operational devices and systems comprising the same.

A compositional range of fusion-formable, high strain point sodium free, silicate, aluminosilicate and boroaluminosilicate glasses are described herein. The glasses can be used as substrates for photovoltaic devices, for example, thin film photovoltaic devices such as CIGS photovoltaic devices. These glasses can be characterized as having strain points≧540° C., thermal expansion coefficient of from 6.5 to 10.5 ppm / ° C., as well as liquidus viscosities in excess of 50,000 poise. As such they are ideally suited for being formed into sheet by the fusion process.

Glasses are disclosed which are used to produce substrates in flat panel display devices. The glasses exhibit a density less than about 2.45 gm / cm3 and a liquidus viscosity greater than about 200,000 poises, the glass consisting essentially of the following composition, expressed in terms of mol percent on an oxide basis: 65-75 SiO2, 7-13 Al2O3, 5-15 B2O3, 0-3 MgO, 5-15 CaO, 0-5 SrO, and essentially free of BaO. The glasses also exhibit a strain point exceeding 650° C.

A glass article of the present invention has a rate of dissolution in an acidic liquid of from 10 to 100 nm / min in terms of etching rate in immersing in a 0.1% by weight 50° C. aqueous solution of hydrofluoric acid and an average linear thermal expansion coefficient of 70x10-7 / ° C. or higher as measured in the range of from -50° C. to 70° C., and the working temperature T4 (° C.) and the liquidus temperature TL (° C.) thereof satisfy the relationship: T4-TL>=-100° C.