Copper-based alloy and its manufacturing method
A copper-based alloy and weight technology, applied in the field of copper-based alloys and their manufacturing, can solve the problems of increased temperature difference and poor thermal processing performance.
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Embodiment 1-8 and comparative example 1-4
[0051] The raw materials of copper-based alloys with the chemical composition shown in Table 1 were packed in a silica crucible as the main component, heated to 1100° C., and kept for 30 minutes. At the same time, the surface of the obtained molten metal was covered with C powder. Afterwards, an ingot of 30 x 70 x 1000 mm was cast with a vertical small continuous casting equipment. Sn-plated copper scraps using JISC2600 (Cu-30Zn) are used as raw materials for each copper-based alloy, the weight percentages of which are shown in Table 1, and oxygen-free copper (JISC 1020), rough Zn ingots and rough Sn ingots are used as adjustment components Other raw materials used. In addition, B, Mg, and Si are added as deoxidizers by melting Cu—B, Cu—Mg, and Cu—Si master alloys together with raw materials. Cr and Ni were added by using Cu-Cr master alloy and coarse Ni ingot. Also, in Comparative Example 4, using commercially available oxygen-free copper chips, the balance was adjusted so ...
Embodiment 9 and 10
[0058] Examples 9 and 10, Comparative Example 5
[0059] To confirm the effect of C on hot workability under mass production conditions, 15000 kg of each copper-based alloy having the chemical composition shown in Table 3 was melted in a crucible mainly composed of silica. Four ingots with dimensions 180x500x3600 mm were obtained from each copper-based alloy using a vertical continuous casting apparatus. In the casting, the copper mold used, in the case of repeated polishing of the mold surface, casts Cu-Zn alloys such as JIS C2600 or JIS C28015000 times or more, and great wear occurs.
[0060] Zn(wt%)
Sn(wt%)
C (ppm)
S(ppm)
O(ppm)
Example 9
25.1
0.82
230
-
30
Example 10
24.8
0.73
90
-
20
Comparative example 5
24.9
0.76
-
10
20
[0061] For the copper-based alloys of Examples 9 and 10, Sn-plated scrap of...
Embodiment 11, comparative example 6 and 7
[0070] In Example 11, in order to confirm the characteristics of the rod material produced as above, the same copper-based alloy as in Example 10 was repeatedly cold-rolled and annealed to obtain a cold-rolled material with a thickness of 1 mm and a grain size of about 10 microns. Then, this cold-rolled material was rolled to a thickness of 0.25 mm and low-temperature annealed at 230° C. in the final step. Samples were obtained from the rods produced.
[0071] For the obtained rods, 0.2% proof stress, tensile strength, Young's modulus, electrical conductivity, stress relaxation rate and stress corrosion cracking life were measured. 0.2% proof stress, tensile strength and Young's modulus were measured according to JIS-Z-2241, and electrical conductivity was measured according to JIS-H-0505. In parallel to the rolling direction, a bending stress is applied on the surface of the sample for a stress relaxation test. The applied bending stress is 80% of the proof stress of 0.2%. T...
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