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124results about How to "Prevent bad connection" patented technology

Electrical connector

An electrical connector includes a plug connector and a receptacle connector detachably fitted with each other. The plug connector comprises a plurality of coaxial cables, a flexible printed circuit board and a ground bar. Each of the coaxial cable has a center conductor, an insulator covering the center conductor, a braid as an external conductor covering the insulator, and a sheath covering the braid. The flexible printed circuit board has lands each connected to the center conductor of the coaxial cable and land portions to which the ground bar is connected. The grand bar has a main portion adapted to contact the braids of the coaxial cables, and fixed portions each positioned contiguously with the main portion and connected to the land portion. The electrical connector achieves the low height geometry of the plug connector and hence that of the receptacle connector and precludes any failed connection between the ground bar and the coaxial cables.
Owner:DDK LTD

Optical fiber connection tool and optical fiber connection method

InactiveUS7258496B2Avoiding the increase in a lossPrevent bad connectionCoupling light guidesEngineeringOptical fiber cable
An optical fiber connecting tool is provided in which an optical fiber connecting tool 5 is used which has a ferule 7, a connecting structure 10 which has two clamping sections 18, 19 which are disposed in a ferule 7. A pre-installed optical fiber 6 and a newly installed optical fiber 17 are clamped in a butt-connected condition by a clamping section 18. The newly installed optical fiber 17 is clamped by the other clamping section 19. An optical fiber connecting tool 1 is provided which has an open / close member 2 which is detachably disposed on the clamping section 18 and another open / close member 3 which is detachably disposed on the another clamping section 19 such that the both of the open / close members 2, 3 can be operated independently. Also, a method for connecting optical fibers according to the present invention prevents an increase in a loss due to a bent optical fiber and a damage in the optical fiber by extracting the open / close member 2 from the clamping section 18 before extracting the open / close member 3 from the another clamping section and dispose a deformation which is generated on the tip section of the optical fiber when the optical fiber connecting part is attached on the tip section of the optical fiber according to steps for performing an extracting operation for the open / close member e from the another clamping section. Here, for the optical fiber connecting part, for example, various members can be adapted such as a member which does not have the above explained ferule, and a member which realize a connection and a clamping operation for the optical fibers by a structure of only the above explained connecting structure.
Owner:FUJIKURA LTD

Hybrid connector and cable with said connector

[Problem] To provide a hybrid connector and a cable with the connector which correct a positional error of connector units and enable to connect connectors when they are connected and even if there is a small positional error of the connection unit.[Solving Means] A hybrid connector holds plural connector units 2a to 4b in a common connector housing 5a, 5b. Each of the plural connector units is held individually movably in a direction (XY) orthogonal to an axial direction (Z) of connection. The connector unit is preferably movably held through a holding member 18 formed by an elastic matter. Front edges at the fitting start of the plural connector units 2a to 4b are tapered, and the connector units move along tapered portions in the connection fitting time. The plural connector units may be different in front-edge fitting start position along a connecting direction.
Owner:SUMITOMO ELECTRIC IND LTD

Semiconductor device fabricating method and fabricating apparatus

Respective attracting openings of a bonding head are disposed so as to avoid joining regions at which bump electrodes (obverse electrodes) of a semiconductor chip are joined with bump electrodes of a package substrate. Bump electrodes (reverse electrodes) that are connected to the bump electrodes are provided at a reverse side of the semiconductor chip at positions opposing the bump electrodes. Because the attracting openings do not overlap the joining regions, the bump electrodes (reverse electrodes) are not suctioned at the joining regions.
Owner:TAIWAN SEMICON MFG CO LTD

Repairing line structure and method for manufacturing same

The invention provides a new repairing line structure, which comprises the original repairing lines, intermittent repairing lines and auxiliary repairing lines; the repairing lines are not directly overlapped with signal scan lines. The intermittent repairing lines are partially overlapped with two signal scan lines, or more than two signal scan lines are outspread as a unit. The intermittent repairing lines and the signal scan lines are overlapped into two or more rows. The manufacturing method of the repairing line structure is as follows: a metal film is arranged on a substrate through sputtering; a mask template forms intermittent repairing lines and auxiliary repairing lines outside a pixel area of the substrate through the exposure process and the chemical etching process; an electrode insulating layer film is arranged on the substrate; a metal film is deposited on the substrate; the mask template forms array substrate signal scanning electrodes through the exposure process and the chemical etching process, and forms the repairing lines outside the pixel area of the substrate at the same time. The repairing points are completely positioned in liquid crystal so as to avoid bad connections caused by oxidation corrosion; in addition, various repairing routes are provided to avoid incapable repairing due to the breaking of certain repairing line. The repairing points are completely positioned in liquid crystal so as to avoid bad connections caused by oxidation corrosion; in addition, various repairing routes are provided to avoid incapable repairing caused by the breaking of certain repairing line.
Owner:SHANGHAI SVA LIQUID CRYSTAL DISPLAY

Chip Package and Package Process Thereof

A chip package and a package process thereof are provided. The chip package comprises a package substrate, a chip, a plurality of spacers, an adhesive layer, and a plurality of wires. The package substrate has a carrying surface. The chip is disposed on the carrying surface. The spacers are formed between the chip and the carrying surface to maintain an interval between the chip and the package substrate. The adhesive layer is disposed between the chip and carrying surface to encapsulate the spacers. The chip is electrically connected to the package substrate via the wires.
Owner:ADVANCED SEMICON ENG INC
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