211results about How to "Improve bond reliability" patented technology

A semiconductor device includes a base member made of a material containing at least a thermosetting resin, and at least one semiconductor constructing body mounted on the base member, and having a semiconductor substrate and a plurality of external connecting electrodes formed on the semiconductor substrate. An insulating layer is formed on the base member around the semiconductor constructing body. An interconnection of at least one layer is formed on one sides of the semiconductor constructing body and insulating layer, electrically connected to the external connecting electrode of the semiconductor constructing body, and having a connecting pad portion, the semiconductor substrate is fixed to the base member by fixing force of the base member.

The invention provides an optical-use adhesive sheet excellent in adhesiveness under bending, twisting or distorting stress. The optical-use adhesive sheet has an adhesive layer having a storage elastic modulus at 80 DEG C of at least 2.0X10 4 Pa and a loss elastic modulus at 80 DEG C of at least 1.0X10 4 Pa, the optical-use adhesive sheet is characterized in that the adhesive sheet has a peel force, as measured in the L-shape peel test, of at least 0.16 MPa, and has a peel distance, as measured in the constant-load peel test, of at most 50 mm. In the L-shape peel test, an L-shaped stainless steel clamp is adhered with an acrylicresin plate through the adhesive sheet, the acrylicresin plate and the stainless steel clamp are processed for 15 minutes at 50 DEG C under 5 atm, and then, the stainless steel clamp is drawn along a direction vertical to a surface of the acrylicresin plate so as to test the peel force. In the constant-load peel test, a double-faced adhesive sheet is adhered on the acrylicresin plate, then, the acrylicresin plate and the double-faced adhesive sheet are processed for 10 minutes at 50 DEG C under 5 atm, and then, a load of 100gf is applied along the direction vertical to the surface of the acrylicresin plate on a tail end in a length direction of the adhesive sheet so as to test the peel distance of the adhesive sheet after 3 hours.

The inventors have conducted vigorous studies, and discovered as a result that it is possible to form a silver layer having a high reflectance of about 90 to 99% in a visible light are a by setting a grain size of an outermost surface of a silver plated layer within a range of 0.5 μm or more to 30 μm or less.

The invention provides an adhesive sheet which can be stuck to a wafer at low temperatures of 100° C. or below, which is soft to the extent that it can be handled at room temperature, and which can be cut simultaneously with a wafer under usual cutting conditions; a dicing tape integrated type adhesive sheet formed by lamination of the adhesive sheet and a dicing tape; and a method of producing a semiconductor device using them. In order to achieve this object, the invention is characterized by specifying the breaking strength, breaking elongation, and elastic modulus of the adhesive sheet in particular numerical ranges.

The present invention relates to a thermoplastic resin composition having a low dielectric constant, a low dissipation factor and excellent adhesiveness to a substrate film or a conductor wiring, an adhesive film and a wiring film using the same. The thermoplastic resin composition includes a polyphenylene ether-based polymer having hydroxyl groups in its chemical structure and having 2,6-dimethylphenylene ether as a repeating unit, an isocyanate compound having a plurality of isocyanate groups in its structure; or a reaction product of the polyphenylene ether-based polymer having 2,6-dimethylphenylene ether as a repeating unit and the isocyanate compound having a plurality of isocyanate groups in its structure; and a hydrogenated styrene-based elastomer. .

A method of manufacturing a circuit device includes the steps of preparing a conductive foil, forming conductive patterns in convex shapes by forming an isolation trench on a surface of the conductive foil, covering the surface of the conductive foil with a resin film so as to form the resin film covering the isolation trench thicker than the resin film covering upper surfaces of the conductive patterns, exposing the upper surfaces of the conductive patterns out of the resin film by removing the resin film, electrically connecting the conductive pattern exposed out of the resin film to a circuit element, forming sealing resin to seal the circuit element, and removing a rear surface of the conductive foil until the conductive patterns are mutually isolated.

An object of the present invention is to provide a pressure-sensitive adhesive composition which is excellent in antistatic property of a pressure-sensitive adhesive tapes when separators are peeled off, and has reduced stainability in an adherend, and excellent in transparency, and prevention of occurrence of peeling off and separation, and an antistatic pressure-sensitive adhesive sheet and a double-sided pressure-sensitive adhesive tape using the same. There is provided a pressure-sensitive composition comprising an ionic liquid, a (meth)acryl-based oligomer of weight-average molecular weight of 1,000 to 50,000, and a (meth)acryl-based polymer of glass transition temperature (Tg) of 0°C or less as base polymer.

A package substrate for carrying a chip with a plurality of bumps thereon is provided. The package substrate includes a first substrate, and an interposer. The first substrate has a first circuit layer disposed on a surface thereof. The interposer includes a second substrate and a second circuit layer formed thereon. The second circuit layer comprises a plurality of bonding pads and traces. The traces are electrically connected to the corresponding bonding pads. Furthermore, the bonding pads are used for being connected to the bumps. The second circuit layer of the interposer is physically and electrically connected to the first circuit layer of the first substrate, and the second substrate and the first substrate are made of different materials.