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156results about How to "Adhesive strength" patented technology

Electrostatic chuck

An electrostatic chuck of the invention includes a base portion; a heat insulating layer bonded onto the base portion; and a chuck function portion bonded on the heat insulating layer and composed by providing a heater electrode and an electrostatic chuck (ESC) electrode in a ceramic substrate portion. Adhesive layers are respectively provided on the both surface sides of the heat insulating layer. In the case where the base portion and the chuck function portion are bonded together with high adhesion strength, openings are formed in the heat insulating layer and are filled with the adhesive layers.
Owner:SHINKO ELECTRIC IND CO LTD

Multilayered anisotropic conductive adhesive for fine pitch

Provided is an anisotropic conductive adhesive for a fine pitch having a conductive adhesive layer and a nonconductive adhesive layer formed on one surface or both surfaces of the conductive adhesive layer. The anisotropic conductive adhesive for a fine pitch can be used to adhere an integrated circuit, on which a plurality of bumps each having a second height are formed, to a substrate, on which a plurality of electrodes each having a first height are formed keeping predetermined distances from each other, so that the integrated circuit is electrically connected to the electrodes. The anisotropic conductive adhesive includes a nonconductive first adhesive layer and a second adhesive layer. The nonconductive first adhesive layer includes a thermosetting resin and a hardener for hardening the thermosetting resin and has a first thickness of ½- 3/2 of the second height. The second adhesive layer includes a thermosetting resin, a hardener for hardening the thermosetting resin, and a plurality of conductive particles each having an average particle diameter of ½ or less of the width of gaps between the plurality of electrodes and a first density dispersion, has a second thickness larger than two times the average particle diameter of the conductive particles, and is formed on one surface of the nonconductive first adhesive layer.
Owner:TELEPHUS

Multilayered anisotropic conductive adhesive for fine pitch

Provided is an anisotropic conductive adhesive for a fine pitch having a conductive adhesive layer and a nonconductive adhesive layer formed on one surface or both surfaces of the conductive adhesive layer. The anisotropic conductive adhesive for a fine pitch can be used to adhere an integrated circuit, on which a plurality of bumps each having a second height are formed, to a substrate, on which a plurality of electrodes each having a first height are formed keeping predetermined distances from each other, so that the integrated circuit is electrically connected to the electrodes. The anisotropic conductive adhesive includes a nonconductive first adhesive layer and a second adhesive layer. The nonconductive first adhesive layer includes a thermosetting resin and a hardener for hardening the thermosetting resin and has a first thickness of ½– 3 / 2 of the second height. The second adhesive layer includes a thermosetting resin, a hardener for hardening the thermosetting resin, and a plurality of conductive particles each having an average particle diameter of ½ or less of the width of gaps between the plurality of electrodes and a first density dispersion, has a second thickness larger than two times the average particle diameter of the conductive particles, and is formed on one surface of the nonconductive first adhesive layer.
Owner:TELEPHUS

Modified carbon nanotube grafted by living polymer, carbon nanotube electrode and dye-sensitized solar cell using the same, and each preparation method thereof

InactiveUS20100084007A1Minimizing lowering of physical propertyGood dispersionMaterial nanotechnologyElectrolytic capacitorsEnd-groupElectro spray
Disclosed are to provide a modified carbon nanotube obtained by reacting a polymer to a carbon nanotube by a radical graft method, capable of minimizing lowering of a physical property of a carbon nanotube caused when being modified, and capable of enhancing dispersibility of the carbon nanotube and an adhesion strength between carbon nanotubes, the polymer having a molecular weight controlled by a living radical polymerization and still having a living radical end group.Also disclosed are to provide a carbon nanotube electrode and a dye-sensitized solar cell using the same, capable of forming a carbon nanotube film having a thickness thinner than that of the conventional electrode by directly spraying, on a substrate, by an electro-spray process, a uniform dispersion solution that the modified carbon nanotube is dispersed in a proper solvent without requiring an additional organic binder, capable of exhibiting an excellent catalytic characteristic owing to a close adhesion strength between carbon nanotubes and an increased relative density of the carbon nanotube film, and capable of implementing an excellent long-term stability owing to a strong bonding force between a carbon nanotube and a substrate.
Owner:KOREA INST OF SCI & TECH

Silicone pressure-sensitive adhesive composition

A silicone pressure-sensitive adhesive composition exhibiting powerful adhesive strength to silicone rubbers. The composition includes (A) a polydiorganosiloxane composed of components (A1) and (A2) described below and having a mass ratio of (A1) / (A2) within a range from 100 / 0 to 10 / 90,(A1) a linear polydiorganosiloxane having two or more alkenyl groups within each molecule,(A2) a linear polydiorganosiloxane having SiOH groups at the terminals and having no alkenyl groups,(B) a polyorganosiloxane containing R33SiO0.5 units, SiO2 units and silanol groups and having a molar ratio of R33SiO0.5 units / SiO2 units within a range from 0.5 to 0.9,(C) a polyorganohydrogensiloxane containing three or more SiH groups,(D) a reaction retarder,(E) a platinum group metal-based catalyst, and(F) at least one metal compound having a formula MYx wherein M represents a metal element having an atomic valence of 3 or 4 such as aluminum, x represents a number equal to the atomic valence of M, and Y represents a ligand.The composition is useful for producing a pressure-sensitive adhesive tape.
Owner:SHIN ETSU CHEM IND CO LTD

Plating resin molded article and process for producing the same

The present invention is a process of producing a plating resin molded article, wherein metal plating is carried out on the surface of a thermoplastic resin molded article and either of requirements (1), (2) and (3) described below is included: (1) the thermoplastic resin molded article contains a thermoplastic resin and a water-soluble substance, a step of carrying out the removal of fat of the resin molded article and a step of electroless plating are provided in combination, and a step of etching by an acid containing a heavy metal is not included; (2) the thermoplastic resin molded article contains a polyamide-based resin and a styrene-based resin, a step of carrying out the removal of fat of the resin molded article and a step of electroless plating are provided in combination, and a step of etching by an acid containing a heavy metal is not included; or (3) a step of contact-treating the thermoplastic resin molded article with an acid or base not containing a heavy metal as the pre-treatment of the metal plating step is included. The present invention provides further the plating resin molded article obtained by the above-mentioned step. Although an etching treatment by chromic acid is not carried out, the plating resin molded article having a high adhering strength of a plating layer is provided.
Owner:DAICEL POLYMER LTD
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