3297results about How to "Easy to peel" patented technology

Film structures, packages, films and methods of making the same are provided wherein the film structures have a desiccant material incorporated into at least one layer of the film structures and further wherein the film structures can comprise a material for making a peelable seal when the film structures are heat sealed to other film structures. The film structures are utilized for a package to hold a product that may be sensitive to the presence of moisture. The product may preferably be pharmaceutical products, nutraceutical products, or devices such as absorbable sutures or medical stents, although any moisture-sensitive product is contemplated by the present invention.

Provided is a laminated body (1) comprising a substrate (2) to be ground and a support (5), where the substrate (2) is ground to a very small thickness and can then be separated from the support (5) without damaging the substrate (2). One embodiment of the present invention is a laminated body (1) comprising a substrate (2) to be ground, a joining layer (3) in contact with the substrate (2) to be ground, a photothermal conversion layer (4) comprising a light absorbing agent and a heat decomposable resin, and a light transmitting support (5). After grinding the substrate surface which is opposite that in contact with the joining layer (3), the laminated body (1) is irradiated through the light transmitting support (5) and the photothermal conversion layer (4) decomposes to separate the substrate (2) and the light transmitting support (5).

This specification describes techniques for fabricating connections between pairs of components. Each connection includes an array of bumps on a male component, and a matching array of wells filled with bonding material on a female component. The bump/well connections can be spaced with a pitch of less than 100 microns. One application of the invention is the attachment of electronic components to interconnection circuits or circuit assemblies to form electronic modules. The electronic components may be IC chips or high-density interconnect cables. Another application is alignment of optical components. The direct chip attachment techniques are described in the context of fabrication, assembly, test, rework, and cooling of electronic modules employing flip chip components. The preferred method is to fabricate the module on a glass carrier using a release layer so that the carrier can be removed after most of the processing is done.

It is an object of the present invention to provide a highly sophisticated functional IC card that can ensure security by preventing forgery such as changing a picture of a face, and display other images as well as the picture of a face. An IC card comprising a display device and a plurality of thin film integrated circuits; wherein driving of the display device is controlled by the plurality of thin film integrated circuits; a semiconductor element used for the plurality of thin film integrated circuits and the display device is formed by using a polycrystalline semiconductor film; the plurality of thin film integrated circuits are laminated; the display device and the plurality of thin film integrated circuits are equipped for the same printed wiring board; and the IC card has a thickness of from 0.05 mm to 1 mm.

A thermal dissipator disposable in a heat transfer relationship with a heat-generating source, such as an electronic component, which is mounted on a substrate, such as a printed circuit board. The dissipator includes a thermal dissipation member having a top and bottom surface, and a pressure sensitive adhesive layer disposed on the thermal dissipation member to cover at-least a portion of the bottom surface thereof. The dissipation member is formed of a thermally-conductive, electrically-nonconductive ceramic material. The pressure sensitive adhesive layer has an inner surface adhered to the bottom surface of the thermal dissipation member, and an outer surface bondable to a heat transfer surface of the source for attaching the dissipator to the source in a heat transfer relationship therewith.

An adhesive sheet for an artificial nail comprises a releasable protective film having, at a tip end side of a bare nail to which a double-sided adhesive sheet member is attached, a peeling tongue piece having a width smaller than the width of the double-sided adhesive sheet member and projecting outward from the double-sided adhesive sheet member, wherein the double-sided adhesive sheet member and the releasable protective film are chamfered in a convex R shape from a base end of the peeling tongue piece toward both sides in a width direction.

A manufacturing method of a semiconductor device comprising the steps of: affixing a die attach film and a dicing film to a back surface of a semiconductor wafer: thereafter dicing the semiconductor wafer and the die attach film to divide the semiconductor wafer into a plurality of semiconductor chips: thereafter pulling the dicing film from the center toward the outer periphery of the dicing film with a first tensile force to cut the die attach film chip by chip; and thereafter picking up the semiconductor chips together with the die attach film while pulling the dicing film from the center toward the outer periphery of the dicing film with a second tensile force smaller than the first tensile force.

An engraved plate which includes a substrate and an insulating layer on a surface of the substrate wherein a concave portion which increases in width toward an opening and to which the substrate is exposed is formed at the insulating layer, and an engraved plate, a substrate with conductor layer pattern manufactured by a transferring method using the engraved plate, and a conductor layer pattern are provided.

A dicing die-bonding film has a supporting substrate, an adhesive layer formed on the supporting substrate, and a die-bonding adhesive layer formed on the adhesive layer, and further has a mark for recognizing the position of the die-bonding adhesive layer. It is possible to provide a dicing die-bonding film in which in the case a semiconductor wafer and the dicing die-bonding film are stuck onto each other, the position of the die-bonding adhesive layer in the film can be recognized.

An aligned double-walled carbon nanotube bulk structure composed of plural aligned double-walled carbon nanotubes and having a height of 0.1 μm or more and a double-walled carbon nanotube are produced by chemically vapor depositing (CVD) a carbon nanotube in the presence of a metal catalyst with controlled particle size and thickness, preferably in the presence of moisture. According to this, it is possible to provide a double-walled nanotube which is free from inclusion of the catalyst, has high purity, is easy to control the alignment and growth, is able to achieve the fabrication through the formation of a bulk structure and has excellent electron emission characteristic (particularly, a double-walled carbon nanotube bulk structure) and also to provide a production technology thereof.

An FRP is produced using a prepreg comprising reinforcing fiber, a sheet-like reinforcing fiber substrate containing reinforcing fiber, and a matrix resin, wherein the matrix resin is impregnated into the sheet-like reinforcing fiber substrate and also covers one surface of the sheet-like reinforcing fiber substrate, and the matrix resin impregnation ratio is within a range of 35% to 95%; a prepreg comprising reinforcing fiber, a sheet-like reinforcing fiber substrate containing reinforcing fiber, and a matrix resin, wherein the matrix resin exists on both surfaces of the sheet-like reinforcing fiber substrate, and the portion inside the sheet-like reinforcing fiber substrate into which the matrix resin has not been impregnated is continuous; or a prepreg comprising reinforcing fiber, a sheet-like reinforcing fiber substrate containing reinforcing fiber, and a matrix resin, wherein at least one surface exhibits a sea-and-island-type pattern comprising resin-impregnated portions (island portions) where the matrix resin is present at the surface and fiber portions (sea portions) where the matrix resin is not present at the surface, the surface coverage ratio of the matrix resin on those surfaces with said a sea-and-island-type pattern is within a range of 3% to 80%, and the weave intersection coverage ratio for the island portions, represented by a formula (1) shown below, is at least 40%, displays excellent external appearance, with no internal voids or surface pinholes, even when molded is conducted using only vacuum pressure.

Island portions weave intersection coverage ratio (%)=(T/Y)×100   (1)

(wherein, T represents a number of island portions that cover weave intersections, and Y represents a number of weave intersections within said reinforcing fiber woven fabric on said surface with said sea-and-island-type pattern).

Provided is a touch panel. The touch panel includes a base and a pressure-sensitive adhesive layer attached to the base and including an acryl-based polymer containing an acryl polymer containing 5 to 30 parts by weight of isobornyl (meth)acrylate, and 5 to 40 parts by weight of methyl (meth)acrylate in a polymerized form. Accordingly, it can effectively inhibit penetration of oxygen, moisture or other impurities at an interface between the base and the pressure-sensitive adhesive layer, or at an interface between a conductor thin film and the pressure-sensitive adhesive layer, and prevent degradation in optical properties such as visibility, etc. due to bubbles generated at the pressure-sensitive adhesive interface. In addition, when the pressure-sensitive adhesive layer is directly attached to the conductor thin film and even exposed to severe conditions such as high temperature or high temperature and high humidity, a change in the resistance of the conductor thin film may be effectively inhibited, and thus the touch panel can be stably driven for a long time.