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97results about How to "Poor heat resistance" patented technology

Semiconductor device and manufacturing method thereof

A method for manufacturing a semiconductor device, including the steps of: forming a shielding film 38 on a first insulating film 37; sequentially forming a second insulating film 39 and an amorphous semiconductor film 40 on the shielding film 38; melting the amorphous semiconductor film 40 at least in portions to be channels of thin-film transistors by irradiating an energy beam onto the amorphous semiconductor film 40, and converting the amorphous semiconductor film 40 into a polycrystalline semiconductor film 41; sequentially forming a gate insulating film 43a and a gate electrode 44a on the polycrystalline semiconductor film 41 on the channels; and forming source and drain regions 41a in the polycrystalline semiconductor film 41 on sides of the gate electrode 44a, and forming a TFT 60 by use of the source and drain regions 41a, the gate insulating film 43a, and the gate electrode 44a.
Owner:FUJITSU SEMICON LTD

Photoelectric conversion device

A photoelectric conversion device taking the form of a thin film and having a substrate exhibiting poor thermal resistance. The device prevents thermal deformation which would normally be caused by local application of excessive heat to the substrate. The device has output terminals permitting the output from the device to be taken out. The output terminals are formed on the surface of the substrate opposite to the photoelectric conversion device. The device further includes electrical connector portions for electrically connecting the electrodes of the device with the output terminals. The present invention also provides a method of treating a substrate having poor thermal resistance with a plasma with a high throughput. The substrate is continuously supplied into a reaction chamber and treated with a plasma. This supply operation is carried out in such a way that the total length of the substrate existing in a plasma processing region formed by electrodes is longer than the length of the electrodes.
Owner:SEMICON ENERGY LAB CO LTD +1

Cooling devices for various applications

The figure displays the diagram of a laminar flow water cooler (110) for a microprocessor comprising an integral radiator (112) provided with thin-walled and hollow fins which are produced by controlled compression of double convex bellows of a polymer or glass hot-blown blank. In order to form a closed circuit filled with water at the atmospheric pressure, the manifolds (113, 114, 115) of the radiator (112) are connected to the manifolds of an original component (114) formed by a mini heater (116) provided with a copper heating plate with internal grooved face and a mini pump (118) provided with a brushless electric motor devoid of a centrifugal turbine, wherein said mini heater and mini pump are disposed in a rigid small-sized moulded polymer hose. The total thermal resistance of said cooler can be equal to 0.15° / W that is of interest, in particular for high performance microprocessors for dissipating more than 200 W through the very hot central area of 1.5 cm2 of the heat dissipating surface thereof. The concept of the production of the inventive cooler makes it possible to design efficient and low-cost cooling devices which are usable for microprocessors, high-power electronic devices, thermal engines or fuel cells, in particular mounted in a motor vehicle. Said invention can be used for cooling any component dissipating a given thermal flux within the determined power and temperature limits.
Owner:TECH DE LECHANGE THERMIQUE TET

Stabilizer for chlorine-containing resins and chlorine-containing resin composition

A stabilizer for chlorine-containing resins of the invention consists of a polyol mixture composed of pentaerythritol and condensates thereof, wherein, with respect to the total amount of the polyol mixture, the content of pentaerythritol having a degree of condensation (n) of 1 is 0 to 10% by mass and the total content of pentaerythritol and condensates thereof having a degree of condensation (n) of 1 to 3 is 5 to 30% by mass. A chlorine-containing resin composition of the invention contains, with respect to 100 parts by mass of a chlorine-containing resin, 0.01 to 10 parts by mass of the above-mentioned stabilizer for chlorine-containing resins.
Owner:ADEKA CORP

Fiber article comprising a biodegradable plastic

ActiveUS20050233142A1Decrease in hydrolysis resistanceReduced strengthFibre treatmentWoven fabricsBiodegradable plasticFiber structure
A fiber article having excellent hydrolysis resistance, characterized in that the article is fiber structure composed of 10 to 90% by weight of a fiber (A) comprised of a biodegradable plastic formulated with a carbodiimide compound as a stabilizer against hydrolysis and 90 to 10% by weight of at least one fiber (B) selected from a natural fiber, a regenerated fiber, a semi-synthetic fiber and a synthetic fiber, which fiber structure has been subjected to at least one treatment processing selected from scouring processing, bleaching processing, liquid ammonium processing, mercerization processing, biological processing, dyeing processing, or resin treatment, and concentration of total terminal carboxyl groups derived from the fiber (A) in said fiber article is not higher than 30 equivalents / ton based on the fiber (A), etc. It is an object of the present invention to solve conventional problems of a fiber or a fiber article comprising a biodegradable plastic, such as poor hydrolysis resistance, poor heat resistance, strength reduction and coloring by yellowing, and in particular to provide a fiber article superior in hydrolysis resistance, alkali resistance and dyeing resistance.
Owner:NISSHINBO IND INC

Cleaning sheets and method of cleaning with the same

The invention provides cleaning sheets for use in cleaning, e.g., various substrate-processing apparatus, systems for conveying exposure masks (reticles) in microfabrication, etc., and a method of cleaning these with the cleaning sheets. A cleaning sheet which comprises a sheet material comprising a thermoset resin layer having porosity and, formed on one side of the sheet material, a pressure-sensitive adhesive layer comprising a thermoplastic resin.
Owner:NITTO DENKO CORP

Artificial leather manufacturing method adopting TPU (thermoplastic urethane) to plasticize PVC (polyvinyl chloride) and reducing use of plasticizer

InactiveCN105088806AInnovativeHave a positive effectTextiles and paperThermoplasticPolyvinyl chloride
The invention discloses an artificial leather manufacturing method adopting TPU (thermoplastic urethane) to plasticize PVC (polyvinyl chloride) and reducing use of a plasticizer. According to the method, 80-90 parts of PVC powder, 3-5 parts of a stabilizer, 50-60 parts of the plasticizer, 10-20 parts of TPU, 2-3 parts of a foaming agent, 5-10 parts of filler and an appropriate quantity of a colorant are mixed uniformly, and an artificial leather product is prepared with a traditional calendering process. PVC and TPU are all polar macromolecules and have good compatibility; the TPU macromolecules contain both soft segments and hard segments, the elasticity modulus of the TPU macromolecules is between that of plastics and that of rubber, the TPU macromolecules can still keep better elasticity in a relatively wide temperature range and further have good performance of low-temperature resistance, solvent resistance, heat resistance and the like; when the TPU is used for plasticizing PVC, the glass-transition temperature of a PVC/TPU blended material is reduced remarkably, the heat resistance is improved, and 30%-40% of the use quantity of a micromolecular plasticizer can be reduced; TPU adopts the macromolecules, is not easy to transfer and has lasting plasticizing effect; besides, polar groups such as epoxy groups, ester bonds and the like in the plasticizer and urethane groups in the TPU macromolecules can form a hydrogen bond or dipole interaction, and accordingly, the transference resistance of the plasticizer is further improved.
Owner:SICHUAN UNIV

Controller

ActiveUS20050269534A1Inferior heat resistanceIncrease pressureDiaphragm valvesEngine sealsEngineeringFlange
Booster means 11 for transmitting a force acting on a piston 10 to a valve stem 9 on amplification comprises pivotal members 25 each supported by casings 7, 8 so as to hold an outer end and an inner end thereof in contact with an outer peripheral portion of the piston 10 and a flange portion 22a formed on the valve stem 9 respectively from below and to be pivotally movable about a horizontal rod 26 positioned closer to the inner end. Metal bellows 16 are provided between an outer peripheral portion of the casing top wall 8a and the outer peripheral portion of the piston 10 for sealing off a compressed air admitting space.
Owner:FUJIKIN INC

Release film for use in manufacture of printed circuit boards

To provide a release film which is used to avoid adherence between a press hot plate and a printed circuit board or a cover lay film at the time of press work effected to printed circuit boards such as printed wiring boards, flexible printed circuit boards and multilayered printed circuit boards and which has a heat resistance, a releasing property, a non-contamination property, a follow up capability relative to the circuit pattern, an excellent workability during processing and a small environmental impact at the time of disposal, the release film has a shear modulus of 5×105˜107 Pa at a hot press lamination temperature and is formed by overlapping at least one thermoplastic resin layer and at least one metallic layer one above the other.
Owner:KURARAY CO LTD
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