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492 results about "Interconnector" patented technology

An interconnector is a structure which enables energy to flow between networks. The term is used more specifically to refer to international connections between electricity and natural gas networks.

Strip lighting system incorporating light emitting devices

The present invention provides an elongated lighting apparatus for use in environments subject to temperature fluctuations, wherein the lighting apparatus can be illuminated along its entire length during operation. The elongated lighting apparatus comprises several components which operate in harmony in order to provide this functionality. The lighting apparatus comprises at least two elongated tubular members fabricated from a material that allows the passage of light therethrough. These elongated tubular members are fixedly mounted on a surface in an end to end configuration, separated by a region enabling the thermal expansion/contraction of the members. Slidably positioned inside each tubular member is a substrate having a plurality of light emitting devices integrated thereon for providing illumination. The open ends of the elongated tubular members are enclosed by end caps that enable the sealing of these ends of the members. At least one of these end caps has a protrusion therein that projects towards the region of separation and this protrusion is fabricated from a material that allows the passage of light therethrough. Positioned proximate to a protrusion in an end cap is at least one of the plurality of light emitting devices, wherein this protrusion provides a means for light diffusion into the region separating the elongated tubular members, thereby illuminating this region. Enclosing the region between the elongated tubular members is a flexible interconnector also fabricated from a material that allows the passage of light therethrough. The flexible interconnector provides a means for the visual concealment of the region separating the adjacent members. The lighting apparatus further comprises electrical interconnection between the light emitting devices and an external power source thereby providing a system for the energization of the light sources.
Owner:SIGNIFY HLDG BV

Method for fabricating solid oxide fuel cell module

There is provided a method of manufacturing a solid oxide fuel cell module comprising a plurality of cells each made up of a fuel electrode, an electrolyte, and an air electrode sequentially formed on a surface of a substrate with an internal fuel flow part provided therein, at least a face of the substrate, in contact with the cells, and interconnectors, being an insulator, and the cells adjacent to each other, being electrically connected in series through the intermediary of the respective interconnectors, said method of manufacturing the solid oxide fuel cell module comprising the steps of co-sintering the respective fuel electrodes, and the respective electrolytes, subsequently forming a dense interconnector out of a dense interconnector material, or an interconnector material turning dense by sintering in at least parts of the solid oxide fuel cell module, in contact with the respective fuel electrodes, and the respective electrolyte, and forming an air electrode on the respective electrolytes before electrically connecting the air electrode with the respective dense interconnectors. With the invention, it is possible to solve various problems of sinterability, encountered in the process of manufacturing the solid oxide fuel cell module of a multi-segment type, and to secure electrical contact of the parts of the respective dense interconnectors, in contact with the fuel electrodes while attaining high gas-sealing performance by the agency of the respective dense interconnectors, and electrolytes, thereby enhancing productivity.
Owner:TOKYO GAS CO LTD

Semiconductor device and producing method thereof

The invention discloses a three-dimensional semiconductor packaging using an interposer. The invention provides a semiconductor device and a producing method thereof. The semiconductor device comprises a first chip whose first side is electrically coupled to the interposer and a second chip whose second side is electrically coupled to the interposer. The interposer is electrically coupled to a below substrate, such as a packaging substrate, a high-density interconnector, a printed circuit board and so on. The substrate is provided with a recess, making a second chip being disposed in the recess. The recess allows using quite a small conductive bump, thereby quite a large amount of conductive bumps can be used. A radiating fin can be placed in the recess to assist the second chip to dissipate heat.
Owner:TAIWAN SEMICON MFG CO LTD
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