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1635results about How to "Improve solderability" patented technology

Low CTE power and ground planes

Conductive materials that have low coefficients of thermal expansion (CTEs) and that are used for power and ground planes are disclosed. Fibrous materials (such as carbon, graphite, glass, quartz, polyethylene, and liquid crystal polymer fibers) with low CTEs are metallized to provide a resultant conductive material with a low CTE. Such fibers may be metallized in their individual state and then formed into a fabric, or these materials may be formed into a fabric and then metallized or a combination of both metallizations may be used. In addition, a graphite or carbon sheet may be metallized on one or both sides to provide a material that has a low CTE and high conductivity. These metallized, low CTE power and ground planes may be laminated with other planes / cores into a composite, or laminated into a core which is then laminated with other planes / cores into a composite. The resultant composite may be used for printed circuit boards (PCBs) or PCBs used as laminate chip carriers.
Owner:GLOBALFOUNDRIES INC

Porous power and ground planes for reduced PCB delamination and better reliability

Power and ground planes used in Printed Circuit Boards (PCBs) having porous, conductive materials allow liquids (e.g., water and / or other solvents) to pass through the power and ground planes, thus decreasing failures in PCBs (or PCBs used as laminate chip carriers) caused by cathodic / anodic filament growth and delamination of insulators. Porous conductive materials suitable for use in PCBs may be formed by using metal-coated organic cloths (such as polyester or liquid crystal polymers) or fabrics (such as those made from carbon / graphite or glass fibers), using metal wire mesh instead of metal sheets, using sintered metal, or making metal sheets porous by forming an array of holes in the metal sheets. Fabrics and mesh may be woven or random. If an array of holes is formed in a metal sheet, such an array may be formed with no additional processing steps than are performed using conventional PCB assembly methods.
Owner:GLOBALFOUNDRIES INC

Method for producing high strength aluminum alloy welded structures

InactiveUS6524410B1Poor weldabilityMore design optionVehicle frameHigh intensity
The present invention relates to a method for fabricating lightweight alloy feedstock for welded structures. Specifically, the method for producing the tubular stock proposed in the present invention enables a bicycle manufacturer to readily weld a lightweight yet high strength bicycle frame. The properties attained in the final product allow the bicycle manufacturer to reduce the overall weight of the bicycle without sacrificing durability.
Owner:TRI KOR ALLOYS

High-carbon high-chromium high-niobium cast iron self-protecting flux-cored wire

The invention provides a high-carbon high-chromium high-niobium cast iron self-protection flux-cored wire. The flux-cored wire has a steel belt as an outer skin. The flux core comprises the following components in weight percentage: 10 to 30 percent of ferroniobium, 20 to 30 percent of high carbon ferrochrome, 0.1 to 3 percent of V, 0.2 to 3 percent of W, 0.6 to 0.8 percent of ferromanganese, 0.2 to 0.8 percent of 75 ferrosilicon, 20 to 30 percent of chromium carbide, 5 to 12 percent of graphite, 1 to 10 percent of aluminum-magnesium alloy, 1 to 5 percent of silicon carbide and 1 to 3 percent of ferroboron; and the percentage of a counter weight is between 46 and 54 percent. The high-carbon high-chromium high-niobium cast iron self-protection flux-cored wire has the advantages of high hardness, good wear resistance, good oxidation resistance and strong shock resistance, and is widely applied to grinding rolls and grinding disks of coal grinding machines in thermal power plants and cement plants, material charging equipment in blast furnaces(material charging slots, receiving cones, material storage areas and sieve plates), slag vertical mills, hammer heads and rollers of crushers and sintering equipment workpieces in steel plants.
Owner:CENT RES INST OF BUILDING & CONSTR CO LTD MCC GRP

Method of manufacturing quad flat non-leaded semiconductor package

A method of manufacturing a quad flat non-leaded semiconductor package is provided. A metal plate is prepared and is defined with predetermined positions of a plurality of electrically conductive pads. A resist layer is formed on the metal plate, and a plurality of openings are formed in the resist layer and correspond to the predetermined positions of the electrically conductive pads. A solderable metal plated layer is formed in each of the openings of the resist layer. The resist layer on the metal plate is removed. A portion of the metal plate, which is not covered by the metal plated layers, is etched using the metal plated layers as a mask. A chip is mounted on the metal plate and is electrically connected to the electrically conductive pads. A molding process is performed such that the chip and the metal plate are encapsulated by an encapsulant.
Owner:SILICONWARE PRECISION IND CO LTD

Enamel steel for cold rolling water heater and manufacturing method thereof

The invention discloses enamel steel for a cold rolling water heater and a manufacturing process thereof. The enamel steel for cold rolling water heater comprises components as follows in percentage by weight: C: 0.01%-0.08%. Si: less than or equal to 0.03%, Mn: 0.10%-0.60%, P: less than or equal to 0.02%, S: 0.003%-0.02%, N: 0.001%-0.006%, AIs: less than or equal to 0.04%, Ti: 0.02%-0.12%, and the balance of ferrum and unavoidable impurities, wherein excess Ti content in steel is equal to Ti-(4*C+3.43*N=1.5S) which is less than or equal to 0. The manufacturing process is characterized in that the heating temperature of billet steel is 1160-1300 DEG C; the hot rolling finish rolling temperature is 850-950 DEG C; the coiling temperature of steel plates is 660-760 DEG C; the cold rolling draft is 60%-80%; the annealing temperature is 760-880 DEG C; the temperature preservation time is 60-200s; rapid cooling speed rate is 15-45 DEG C/s, planishing elongation is 0.7%-1.8%; and surface roughness is 0.7-1.9 micrometres. The invention has the advantages of excellent formability, enamel-spreadable property, pressing resistance, weldability and fish-scaling resistance, stable yield strength after enamelfiring, less cost increase, stable effect and significant economic benefits.
Owner:ANGANG STEEL CO LTD

Method for plating printed circuit board and printed circuit board manufactured therefrom

Disclosed herein are a method for plating a printed circuit board and the printed circuit board manufactured therefrom. In the method, a bare soldering or wire bonding portion of a copper (Cu)- or copper alloy layer, is plated with palladium (Pd) or a palladium alloy, and then gold (Au) or a gold alloy is deposited over the palladium or palladium alloy plated layer by an electroless substitution plating process based on ionization tendency. Having superior hardness, ductility and corrosion resistance, palladium is suitable for use between a connector and a substrate and meets requirements for the printed circuit board even when applied to a low thickness, greatly reducing the process time. Accordingly, the problem of black pad, which frequently occur on electroless nickel and electroless gold finish upon surface mount technology, can be perfectly solved. Particularly, fatal bending cracks can be prevented from occurring in the rigid-flexible or flexible printed circuit boards.
Owner:SAMSUNG ELECTRO MECHANICS CO LTD +1

Aluminium alloy profile for building template, and preparation method thereof

The invention discloses an aluminium alloy profile for a building template, and a preparation method thereof. The aluminium alloy profile comprises the following components in percentage by weight: 0.85-0.95 percent of magnesium, 0.06-0.65 percent of silicone, 0.15-0.20 percent of copper, 0.05-0.08 percent of manganese, 0.03-0.05 percent of zirconium, 0.04-0.06 percent of chromium, 0.008-0.012 percent of titanium, 0-0.2 percent of iron, 0-0.10 percent of zinc and the balance of aluminium. The aluminium alloy profile provided by the invention has the advantages that the tensile strength is more than 300 MPa, the yield strength is more than 260 MPa, the breakage elongation percentage is more than 12 percent, the tenacity, the weldability and the corrosion resistance are obviously improved compared with that of an original 6061 alloy, the pendulum impact value is more than 20 J / cm<2>, the welding coefficient is not less than 0.6, smaller quench sensitivity is provided, and critical quenching speed is dropped from 10 DEG C / S of the original alloy to 7 DEG C / S; during the processing of the aluminium alloy profile, air cooling is adopted to process an extrusion outlet with the temperature of 450 DEG C in a high-temperature segment as well as an extrusion outlet with the temperature of being smaller than or equal to 25 DEG C in a low-temperature segment, while a moderate-temperature segment, namely a quench sensitive area with the temperature of 450-250 DEG C utilizes water mist to replace direct water-cooling, so that the difficulty for controlling cross section deformation of the profile in the production field is greatly reduced.
Owner:GUANGDONG WEIYE ALUMINUM FACTORY GRP

High strength medium wall quenched and tempered seamless steel pipes and related method for manufacturing said steel pipes

Disclosed herein are embodiments of a seamless quenched and tempered steel pipe which can have a wall thickness WT higher than or equal to 6 mm and lower than or equal to 35 mm. Some embodiments of the steel pipe can have a chemical composition comprising C, Mn, Si, Cr, Ni, Mo, Al, N, Ca, Nb, Ti, V, Zr, and Ta based on the composition weight, the remaining being iron and impurities. In some embodiments, wherein (V+Nb) content is lower than 0.07 wt %; defining a first parameter P1=(60×C)+Cr+[5×e(35×Mo / WT)]+50×(V+Nb), the chemical composition satisfies a first condition P1≦14.5.
Owner:DALMINE SPA
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