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1439 results about "Beryllium" patented technology

Beryllium is a chemical element with the symbol Be and atomic number 4. It is a relatively rare element in the universe, usually occurring as a product of the spallation of larger atomic nuclei that have collided with cosmic rays. Within the cores of stars, beryllium is depleted as it is fused into heavier elements. It is a divalent element which occurs naturally only in combination with other elements in minerals. Notable gemstones which contain beryllium include beryl (aquamarine, emerald) and chrysoberyl. As a free element it is a steel-gray, strong, lightweight and brittle alkaline earth metal.

Cast Aluminium Alloy

InactiveUS20070240796A1Improve stabilityIntensive particle hardeningNiobiumManganese
Cast aluminium alloys comprising 1.0-8.0% in weight magnesium (Mg), >1.0-4.0% in weight silicon (Si), 0.01-<0.5% in weight scandium (Sc), 0.005-0.2% in weight titanium (Ti), 0-0.5% in weight of at least one element or selected from the group consisting of zirconium (Zr), hafnium (Hf), molybdenum (Mo), terbium (Tb), niobium (Nb), gadolinium (Gd), erbium (Er) and vanadium (V), 0-0.8% in weight manganese (Mn), 0-0.3% in weight chromium (Cr), 0-1.0% in weight copper (Cu), 0-0.1% in weight zinc (Zn), 0-0.6% in weight iron (Fe), 0-0.004% in weight beryllium (Be), and the remainder of aluminium with further impurities to an individual maximum of 0.1% in weight and totally maximally 0.5% in weight.
Owner:EADS DEUT GMBH +1

Non ionic/electrolyte, liquid/gaseous, mechanically refined/nanoparticle dispersion Building Materials/High Wear-Heat Resistant Part Brushes, Windings, Battery Cells, Brake Pads, Die Cast Molding, Refrigeration, Polarized/Integrated Optical, Spectrometric Processors, Central Processor Unit Processors, Electronic Storage Media, Analogous Series/Parallel Circuit Generators/Transceivers, Particulate Matter PM Carbonaceous-Polyamide, Crystalline Silica, and Cellulosic Filament Extraction/Miners Suit

InactiveUS20140178513A1High wear-heat resistant partAuxillary shaping apparatusShaping pressTransceiverTransformer
The variable hydraulic press and distillation reservoir process scientific formula non ionic or electrolyte mechanically refined and nanoparticle dispersion preform slurry extrusion with or without ionic suspension Preform slurry high wear-heat resistant parts electronic composite coils, windings, annealing, drawn, spun, coils, windings, wire, woven textile mesh, shielding, parts brushes, inductors, antinode couplers, electric rheostats, starters, motors, alternators, generators, ionic suspension enhanced composite coils, composite windings, spun wound coils and windings beryllium Be4, magnesium Mg12, copper Cu29 and carbon nanofoam C6, electronic parts capacitors, ionic suspension circuit battery cells, electronic parts rheostats, resistors, transformers, transducers, rectifiers, power supplies, or heat sinks Preform slurry high wear-heat resistant parts aerospace, automotive, and transportation brake calipers, rotors, pads, and bushings Preform slurry non ionic or electrolyte mechanically refined and nanoparticle high wear-heat resistant parts precision casting molds 2.5 phase die cast molding Building Materials fine concrete, mortar, brick, and tiles.
Owner:MATTHEWS ROBERT RICHARD

Metal alloys for the reflective or the semi-reflective layer of an optical storage medium

InactiveUS6841219B2Improve reflectivitySimilar sputtering characteristicLayered productsPhotomechanical apparatusIndiumCobalt
A silver-based alloy thin film is provided for the highly reflective or semi-reflective layer of optical discs. Alloy additions to silver include gold, rhodium, ruthenium, osmium, platinum, palladium, copper, silicon, cadmium, tin, lithium, nickel, cobalt, indium, chromium, antimony, gallium, boron, molybdenum, zirconium, beryllium, titanium, magnesium, and zinc. These alloys have moderate to high reflective and reasonable corrosion resistance in the ambient environment.
Owner:TARGET TECH

Doping of germanium and silicon crystals with non-hydrogenic acceptors for far infrared lasers

A method for doping semiconductors used for far infrared lasers with non-hydrogenic acceptors having binding energies larger than the energy of the laser photons. Doping of germanium or silicon crystals with beryllium, zinc or copper. A far infrared laser comprising germanium crystals doped with double or triple acceptor dopants permitting the doped laser to be tuned continuously from 1 to 4 terahertz and to operate in continuous mode. A method for operating semiconductor hole population inversion lasers with a closed cycle refrigerator.
Owner:LAWRENCE BERKELEY NAT LAB

Thermonuclear plasma reactor for rocket thrust and electrical generation

A reactor system produces plasma rocket thrust using alpha-initiated atomic fuel pellets without the need for a critical mass of fissionable material. The fuel pellets include an outer layer reactive material to alpha particles to generate neutrons (e.g., porous lead or beryllium), an under-layer of fissionable material (e.g., thorium or enriched uranium), and an optional inner core of fusion material (e.g., heavy water ice, boron hydride). The pellets are injected one at a time into a charged reaction chamber containing a set of alpha beam channels, possibly doubling as ion accelerators, all directed toward a common point. Alpha particles converging on each successive pellet initiate an atomic reaction in the fissionable under-layer, via a neutron cascade from the pellet outer layer, producing plasma that is confined within the chamber. This may be enhanced by atomic fusion of the optional inner core. The resulting high-energy plasma creates electrostatic pressure on the chamber and is allowed to exit the chamber through a port. An ion accelerator at the exhaust port of the chamber accelerates outgoing plasma ions, possibly with added reaction mass, to generate the rocket thrust. An electric circuit that includes the charged chamber may collect the electrons in the plasma to help power the ion accelerator(s).
Owner:YURASH GREG J

High strength hot-dip galvanized or galvannealed steel sheet having improved plating adhesion and press formability and process for producing the same

Disclosed are a high strength hot-dip galvanized or galvannealed steel sheet, which has improved press formability and plating adhesion and is useful as a member for automobile, building, electric or other members, and a process for producing the same.
This high strength hot-dip galvanized or galvannealed steel sheet comprises: (a) a steel sheet substrate comprising, by weight, carbon (C): 0.05 to 0.2%, silicon (Si): 0.2 to 2.0%, manganese (Mn): 0.2 to 2.5%, and aluminum (Al): 0.01 to 1.5%, the silicon and the aluminum having a mutual relationship represented by formula 0.4(%)≦Si+0.8 Al (%)≦2.0(%), the steel sheet substrate further comprising at least one member selected from the group consisting of (i) 0.003 to 1.0% of tin (Sn), (ii) 0.005 to 1.0% in total of at least one member selected from antimony (Sb), bismuth (Bi), and selenium (Se), (iii) 0.005 to 1.0% in total of at least one member selected from beryllium (Be), magnesium (Mg), calcium (Ca), and zirconium (Zr), and (iv) 0.005 to 1.0% in total of at least one member selected from scandium (Sc), yttrium (Y), lanthanum (La), and cerium (Ce), with the balance consisting of iron (Fe) and unavoidable impurities, the volume fraction of retained austenite in the steel structure being 2 to 20%; and (b) a zinc (Zn) coating layer provided on said steel sheet substrate.
Owner:NIPPON STEEL CORP

Dense plasma focus (DPF) accelerated non radio isotopic radiological source

A non-radio-isotopic radiological source using a dense plasma focus (DPF) to produce an intense z-pinch plasma from a gas, such as helium, and which accelerates charged particles, such as generated from the gas or injected from an external source, into a target positioned along an acceleration axis and of a type known to emit ionizing radiation when impinged by the type of accelerated charged particles. In a preferred embodiment, helium gas is used to produce a DPF-accelerated He2+ ion beam to a beryllium target, to produce neutron emission having a similar energy spectra as a radio-isotopic AmBe neutron source. Furthermore, multiple DPFs may be stacked to provide staged acceleration of charged particles for enhancing energy, tenability, and control of the source.
Owner:LAWRENCE LIVERMORE NAT SECURITY LLC

A kind of conductive paste for front electrode of crystalline silicon solar cell and preparation method thereof

The invention discloses a conductive paste for a positive electrode of a crystal silicon solar cell and a preparation method of the conductive paste. The paste is prepared by mixing and grinding conductive metal powder, alloy powder which is formed by two or more elements selected from silver, zinc, tin, silicon, copper, magnesium, germanium, gold, beryllium, aluminum, indium, cerium, lanthanum, gallium, bismuth, and nickel, an organic carrier, and one or a mixture of transition metal oxide, lead oxide, stannic oxide, zinc oxide, organic compounds of zinc, and organic compounds of titanium according to a certain weight part. In the conductive paste, glass powder is not used as an inorganic binder, the problems of low electrical properties, low weldability and welding resistance, silicon chip bending and the like caused by adding the glass powder into the conductive paste for the positive electrode of thecrystal silicon solar cell in the prior art are solved, the positive electrode of the crystal silicon solar cell prepared from the paste has firm adhesive force, high ohmic contact, high weldability and high welding resistance, and the solar cell has a high electrical property and low deformability.
Owner:陈晓东

Bonding alloy filamentary silver and preparation method thereof

The invention relates to bonding alloy filamentary silver and a preparation method thereof, and belongs to the technical field of processing of a bonding wire. The bonding alloy filamentary silver comprises the following metal materials by mass ratio: less than 90wt% of silver, 3.0-10.0wt% of gold, and 3.0-8.0wt% of palladium; and the bonding alloy filamentary silver also comprises at least two of following metals of 10-100ppm of calcium, 4-10ppm of beryllium, 10-100ppm of cerium, and 50-500ppm of copper. The preparation method comprises the steps of 1) preparing materials; 2) smelting mother alloy; 3) continuously casting an alloy rod; 4) roughly working, intermediately drawing, and finely drawing; 5) carrying out middle annealing; 6) ultra-finely drawing; 7) finally annealing; 8) winding; and 9) packaging. The technology disclosed by the invention is specified and reasonable in design, and simple and convenient to operate; the obtained product is strong in electrical conductivity, has certain inoxidizability, good plasticity, high rupturing load, good elongation and low cost, can meet the demands of the semiconductor encapsulation industry and a light-emitting diode (LED) illumination technology on performance of the bonding alloy filamentary silver, and can be used as a substitute for a bonding alloy wire.
Owner:烟台招金励福贵金属股份有限公司

Anisotropic conductive joint package

An anisotropic conductive joint package in which an anisotropic conductive film is joined to at least one conductive material selected from among the group consisting of gold (Au), silver (Ag), copper (Cu), aluminum (Al), magnesium (Mg), nickel (Ni), a tin oxide doped with indium (ITO), molybdenum (Mo), iron (Fe), palladium (Pd), beryllium (Be), and rhenium (Re). The package is characterized in that: the anisotropic conductive film has an insulating base and conductive paths composed of conductive members, insulated from one another, and extending through the insulating base in the direction of the thickness of the insulating base, one ends of the conductive paths are exposed from one side of the insulating base, the other ends are exposed from the other side, the density of the conductive paths is 3,000,000 pieces / mm2 or more, the insulating base is a structural body composed of an anodic oxide film of an aluminum substrate having micropores, and each micropore does not have a branch structure along the depth. The package can be used as an anisotropic conductive member of an electronic component of a semiconductor device or the like or a connector for inspection even if the structure has a much higher degree of integration realized by drastically improving the installation density of the conductive paths.
Owner:FUJIFILM CORP
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