581results about How to "Low wettability" patented technology

A chemical analysis apparatus is equipped with analysis sections having openings, means for supplying samples or reagents from the openings, means for combining and mixing samples with reagents to obtain droplets as liquids to be measured, and means for measuring the physical properties of the liquids to be measured during reaction or after completion of reaction. Furthermore, plate members are provided facing each other in analysis sections and a plurality of electrodes are provided on the plate member faces that face each other. Voltage is applied from the plurality of electrodes to the droplets of the samples and the reagents.

A catheter having a distal tip with an inner layer formed of a polymeric material having a coefficient of friction and surface energy which are relatively low, such that the inner layer has a lubricious, non-polar inner surface repulsive to polar liquids. As a result, blood coagulation in the distal tip, and adherence of the distal tip on the guidewire are prevented or minimized.

The present invention, the quality of the surface of a substrate is improved and the wettability thereof is controlled by light irradiation from the reverse side with respect to the substrate having the conductive layer. A conductive material or an insulating material is adhered on the modified surface by discharging it (including jetting, etc.), or the like to form a conductive layer and an insulating layer. The processing efficiency by the light can be enhanced by function of the light absorption and energy radiation of the photocatalytic substance. Furthermore, the mask layer is formed selectively on the conductive layer and the wettability of the region on the conductive layer that is a non-irradiation region is also controlled.

Methods of forming a conductive metal layers on substrates are disclosed which employ a seed layer to enhance bonding, especially to smooth, low-roughness or hydrophobic substrates. In one aspect of the invention, the seed layer can be formed by applying nanoparticles onto a surface of the substrate; and the metallization is achieved by electroplating an electrically conducting metal onto the seed layer, whereby the nanoparticles serve as nucleation sites for metal deposition. In another approach, the seed layer can be formed by a self-assembling linker material, such as a sulfur-containing silane material.

The invention discloses a circular diamond saw blade bit and a manufacturing method thereof. The circular diamond saw blade bit is made of diamond particles and matrix powder used for consolidation of the diamond particles. The matrix powder comprises, by mass percent, 40%-80% of Fe, 15%-30% of Cu, 0%-10% of Ni, 2%-8% of Sn, 0%-10% of Co, 0%-5% of Me and the balance inevitable impurities. Me is at least one of Mn, Ti, Si, Cr, P and Al. The manufacturing method comprises the steps of mixing raw materials, conducting cold-press molding and free sintering. The manufacturing method is simple and can effectively avoid the loss of a graphite mould and reduce manufacturing cost. Meanwhile, a volume production requirement can be met, and blade bits in complicated shapes can be produced; production efficiency is prolonged, and the service life of the tool is similar to that of a tool manufactured through a hot-press sintering method; the purpose that high-quality diamond cutting tools are produced under the condition of low cost can be achieved; and the circular diamond saw blade bit and a manufacturing method thereof are easy to popularize in an industrialized manner.

A probe-array substrate includes a plurality of probe holding units each having a projection that exhibits a hydrophilicity and a hydrophobic region disposed so as to surround each of the probe holding units. The probe-array substrate can further include an inspection region for use in checking whether mixture of probe solutions is present among the plurality of probe holding units. The inspection region is disposed between the neighboring probe holding units across the hydrophobic region.

In a manufacturing process of a semiconductor device, electroplating and CMP have had a problem of increase in manufacturing costs for forming a wiring. Correspondingly, an opening is formed in a porous insulating film after a mask is formed thereover, and a conductive material containing Ag is dropped into the opening. Further, a first conductive layer is formed by baking the conductive material dropped into the opening by selective irradiation with laser light. Subsequently, a metal film is formed over the entire surface by sputtering, and the mask is removed thereafter to have only the metal film remain over the first conductive layer, thereby forming an embedded wiring layer formed with a stack of the first conductive layer containing Ag and the second conductive layer (metal film).

An article comprises a textured surface disposed on a substrate. The surface has an effective liquid wettability sufficient to generate, with a reference liquid, a contact angle in a range from about 120° to about 180°. The surface comprises a material having a nominal liquid wettability sufficient to generate, with the reference liquid, a nominal contact angle in a range from about 60° to about 90°, the material comprising at least one material selected from the group consisting of a polymer and a ceramic. The properties of the surface may include low-drag or low-friction, self-cleaning capability, and resistance to icing, fouling, and fogging, and the like. Methods of making such a surface are also described.

An air battery that is excellent in heavy-load discharge characteristics and storage characteristics is provided by ensuring the stability of the three-phase interface of a catalyst layer of an air electrode. The air battery has an air electrode including a catalyst layer that is bonded under pressure to a current collector and a water-repellent film. The catalyst layer includes a catalyst for reducing oxygen, a promoter for decomposing a product of the oxygen reduction, conductive carbon, and a binder. A non-polymeric fluorine compound is added to the catalyst layer in order to enhance the water repellency of the catalyst layer.

It is an object of the present invention to minimize an electrode in a solar cell to minimize the solar cell. The present invention provides a method for manufacturing a solar cell comprising the steps of forming a first electrode layer over a substrate, forming a photoelectric conversion layer over the first electrode layer, forming an organic layer over the photoelectric conversion layer, forming an opening reaching the first electrode layer in the photoelectric conversion layer, and forming a second electrode layer by filling the opening with a conductive paste, wherein the organic layer modifies the surface of the photoelectric conversion layer and a contact angle between the conductive paste and the photoelectric conversion becomes greater. According to the present invention, wettability of a photoelectric conversion layer can be decreased by forming an organic layer on a surface of the photoelectric conversion layer. Thereby an electrode layer and an insulating isolation layer can be thinned.

An object of the present invention is to provide a method for manufacturing a display device with few steps and high yield. One feature of the invention is to form a first mask pattern having low wettability over a conductive layer, form a second mask pattern having high wettability over the conductive layer using the first mask pattern as a mask, and form a mask pattern for etching the conductive layer by removing the first mask pattern. Another feature is to form a pixel electrode by etching the conductive layer.

Lead-free solder compositions suitable for joining electronic devices to printed wiring boards, which comprises by weight 0.2 to 0.9% copper, 0.006 to 0.07% nickel, 0.03 to 0.08% bismuth, less than 0.5% silver, less than 0.010% phosphorus, and a balance of tin and inevitable impurities. A solder composition embodying this invention finds particular application in automated wave-soldering machines where conventional lead-free solders dissolve excessive copper from printed wiring circuitry and component terminations.

A method of manufacturing an organic electronic device, the method comprising: providing a substrate; forming a well-defining structure over the substrate; and depositing a solution of organic semiconductive material and/or organic conductive material in wells defined by the well-defining structure, wherein the well-defining structure is formed by depositing a solution comprising a mixture of a first insulating material and a second insulating material, the second insulating material having a lower wettability than the first insulating material, and allowing the first and second insulating materials to at least partially phase separate wherein the second insulating material phase separates in a direction away from the substrate.

A liquid organic, fuel cell is provided which employs a solid electrolyte membrane. An organic fuel, such as a methanol/water mixture, is circulated past an anode of a cell while oxygen or air is circulated past a cathode of the cell. The cell solid electrolyte membrane is preferably fabricated from Nafion™. Additionally, a method for improving the performance of carbon electrode structures for use in organic fuel cells is provided wherein a high surface-area carbon particle/Teflon™-binder structure is immersed within a Nafion™/methanol bath to impregnate the electrode with Nafion™. A method for fabricating an anode for use in a organic fuel cell is described wherein metal alloys are deposited onto the electrode in an electro-deposition solution containing perfluorooctanesulfonic acid. A fuel additive containing perfluorooctanesulfonic acid for use with fuel cells employing a sulfuric acid electrolyte is also disclosed. New organic fuels, namely, trimethoxymethane, dimethoxymethane, and trioxane are also described for use with either conventional or improved fuel cells.

A method of manufacturing an electronic device comprises: providing a base comprising circuit elements; forming a double bank well-defining structure over the base, comprising a first layer of insulating material and a second layer of insulating material thereover; and depositing a solution of organic material in the well defined by the double bank structure. The double bank well-defining structure is formed by removing material from the first and second layers in a single processing step to form the well. The first layer is made of a material which is removed at a faster rate than material of the second layer to form an overhanging step structure in which the second layer protrudes out over an edge of the first layer.

Provided is a quaternary Pb-free solder composition incorporating Sn—Ag—Cu—In, which can prevent a cost increase and sufficiently ensure proccessability and mechanical property as a solder material. To this end, indium (In) with appropriate amount is added into the Pb-free solder composition, and the addition amount of Ag is optimized, thus preventing a decrease in wettability caused by a decrease in the amount of Ag and improving resistance to a thermal cycling and a mechanical impact. The quaternary Pb-free solder composition includes silver (Ag) of about 0.3 wt. % or more, and less than about 2.5 wt. %, copper (Cu) of about 0.2 wt. % or more, and less than about 2.0 wt. %, indium (In) of about 0.2 wt. % or more, and less than about 1.0 wt. % or less, and a balance of tin (Sn).

An article coated with a highly durable, wetting resistant coating is provided. The article comprises a coating that comprises a cermet material. The cermet material includes a nickel-bearing metal matrix and a phase disposed within the matrix. The phase includes an anion moiety, for example nitrogen, carbon, or boron; and a cation moiety, for example chromium, zirconium, titanium, vanadium, hafnium, niobium, or tantalum. The phase is present in the cermet at a level of at least about 5 volume %.