An
image sensor package mainly includes a substrate cover having a
chip cavity, an
image sensor chip, a flexible circuit, and a transparent carrier. The flexible circuit is attached to the transparent carrier. The
image sensor chip is flip-chip mounted on the flexible circuit, and then the substrate cover is mounted on the flexible circuit. The flexible circuit has a plurality of first leads electrically connected to bumps of the image sensor chip, and a plurality of second leads to inner terminals of the substrate cover, so that the
electrical connection is established between the image sensor chip and the substrate cover through the flexible circuit. A plurality of outer terminals are formed on the opposing surface of the substrate cover corresponding to the inner terminals. Accordingly, the image sensor
package provides the excellent electrical transmission and the protection of the image sensor chip. Preferably, a liquid
sealant, NCP, or ACP is disposed between the substrate cover and the flexible circuit for hermetically sealing the image sensor chip in the chip cavity. In another embodiment, a glass substrate can replace the
assembly of the flexible circuit and the transparent carrier.