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3421results about How to "Improve surface roughness" patented technology

Nanoparticulate encapsulation barrier stack

A barrier stack for encapsulating a moisture and / or oxygen sensitive electronic device is provided. The barrier stack comprises a multilayer film having at least one barrier layer having low moisture and / or oxygen permeability, and at least one sealing layer arranged to be in contact with a surface of the barrier layer, wherein the sealing material comprises reactive nanoparticles capable of interacting with moisture and / or oxygen, thereby retarding the permeation of moisture and / or oxygen through defects present in the barrier layer.
Owner:AGENCY FOR SCI TECH & RES

Manufacture method and device of three-dimensional workpiece

The invention provides a method and equipment using organic adhesive mixed solvent and powder to manufacture three-dimensional workpieces. The work principle is as follows: the raw materials are stirred into slurry, which is laid as a green compact thin layer that can disintegrate in disintegrant; the green compact thin layer can form a workpiece thin layer that does not disintegrate in the disintegrant after scanned by an energy beam; in such a cycle, the steps of laying the thin layer and energy beam scanning are repeated, and then the three-dimensional workpiece can be formed; and the disintegant is used for separating the green compact not scanned by the energy beam from the workpiece, thus remaining the needed three-dimensional workpiece. The invention is widely applicable to manufacturing plastic, metallic, ceramic and compound workpieces, can avoid the defects of a selective laser sintering method, can use fine and very thin powder and therefore, can manufacture a finished product which is better than that made in the traditional selective laser sintering method in surface roughness and texture fineness, in addition, through subsequent densified sintering, the metallic and ceramic workpieces can have the strength superior to that in the traditional selective laser sintering method.
Owner:OUKESI INT

Polishing method for semiconductor wafer and polishing pad used therein

In a polishing method for a semiconductor wafer in which polishing slurry is interposed between the semiconductor wafer and a polishing pad and the semiconductor wafer is mirror-polished by a polishing step for planarization, when polishing is conducted using a suede-like foam urethane resin polishing pad having physical properties of low compressibility lower than 9 % and high pore density equal to or higher than about 150 pores / cm.sup.2 as the polishing pad used in the polishing step, a mirror silicon wafer with good surface roughness of 50 bits in haze can be manufactured.
Owner:SHIN-ETSU HANDOTAI CO LTD
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