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4558results about How to "Increase roughness" patented technology

Resist composition and pattern forming method using the same

A resist composition comprising at least one kind of a nitrogen-containing compound selected from the group consisting of an amine compound having a phenoxy group, an ammonium salt compound having a phenoxy group, an amine compound having a sulfonic acid ester group and an ammonium salt compound having a sulfonic acid ester group; and a pattern forming method using the composition.
Owner:FUJIFILM CORP

Actinic ray-sensitive or radiation-sensitive resin composition, and actinic ray-sensitive or radiation-sensitive film and pattern forming method using the same composition

The actinic ray-sensitive or radiation-sensitive resin composition of the present invention contains (A) a resin capable of increasing the solubility in an alkaline developer by the action of an acid, and (C) at least one selected from the group of compounds represented by the following formula (ZI-3), (ZI-4) or (ZI-5) and capable of generating an acid upon irradiation of actinic rays or radiation, wherein the resin (A) contains at least one repeating unit having a group capable of decomposing by the action of an acid to leave a leaving group having a ring structure, and the leaving group having a ring structure has at least one of a polar group as a substituent and a polar atom as a part of the ring structure, and a compound derived from the leaving group having a ring structure has a log P value of not less than 0 and less than 2.8.
Owner:FUJIFILM CORP

Welding wire sending and pulverized solder sending laser cladding forming method and device

InactiveCN101733550AIncrease peripheral light intensityOvercoming the deficiency of undermeltingLiquid spraying apparatusWelding/cutting media/materialsLight beamLaser beams
The invention discloses a welding wire sending and pulverized solder sending laser cladding forming method. The method is characterized in that a conscope is used to change a solid laser beam transmitted by a laser to an annular light beam through light path transformation, then an annular focus lens is used to focus the annular light beam to an annular conical light beam, a hollow conical aphotic zone is formed in the annular conical light beam, a welding wire sending and pulverized solder sending protective gas composite nozzle is arranged in the aphotic zone and has the same axis of the annular conical light beam, a welding wire sending hole is arranged in the center, parallel pulverized solder sending holes are around the welding wire sending hole, collimating protective gas holes are parallel to and around the pulverized solder sending holes, wire is sent to a molten pool through the welding wire sending hole along the axial direction of the light beam and vertically to a machining face, airborne pulverized solder is sent to the molten pool through the pulverized solder sending holes at the same time, and collimating protective gas surrounds the welding wire and pulverized solder and is blown to the molten pool. The invention adopts the welding wire sending and pulverized solder sending protective gas composite nozzle to realize welding wire, pulverized solder and protective gas composite cladding and solve the defects of the prior art.
Owner:SUZHOU UNIV

Fluorinated resins having a surface with high wettability

A fluorinated resin having enhanced wettability to water prepared by roughening a surface of the fluorinated resin such that a central line roughness average (Ra) of the surface is increased to at least 0.1 mum, and then depositing thereon a thin hydrophilic film while maintaining the central line roughness average (Ra) of at least 0.1 mum, the thin hydrophilic film being formed from a hydrophilic substance having a contact angle of water of less that 90°, and the resulting fluorinated resin having up to 20° of contact angle of water. The fluorinated resins are able to maintain high hydrophilicity even after prolonged exposure to the atmosphere and can be used in various fields that require bio-compatibility and in permeable membranes or filters.
Owner:SAMSANG CORP

Polishing method for semiconductor wafer and polishing pad used therein

In a polishing method for a semiconductor wafer in which polishing slurry is interposed between the semiconductor wafer and a polishing pad and the semiconductor wafer is mirror-polished by a polishing step for planarization, when polishing is conducted using a suede-like foam urethane resin polishing pad having physical properties of low compressibility lower than 9 % and high pore density equal to or higher than about 150 pores / cm.sup.2 as the polishing pad used in the polishing step, a mirror silicon wafer with good surface roughness of 50 bits in haze can be manufactured.
Owner:SHIN-ETSU HANDOTAI CO LTD

Double-component polyurethane water-based paint

The invention provides a double-component polyurethane water-based paint, belonging to the field of organic polymer compounds. The double-component polyurethane water-based paint comprises isocyanate curing agents component A and component B, wherein the molar ratio of OH groups of a polymer in the component A to NCO groups in the component B is 1: (1-2.2); and the component A contains polymer aqueous dispersion and polymer emulsion, wherein the content of OH in the polymer aqueous dispersion is 2.0-5.0% and the grain size of latex in the polymer aqueous dispersion is 10-100nm, the weight of the polymer emulsion is 0.05-16 times that of the polymer aqueous dispersion, the content of OH in the polymer emulsion is 0-2.0%, and the grain size of the latex in the polymer emulsion is 80-500nm. In the invention, the polymer aqueous dispersion which has small average grain size and contains -OH and the polymer emulsion which has large average grain size are compounded, wherein the latex with a large grain size can increase the roughness and unevenness of a film and reduce the gloss of the film, and the emulsion with small particles promotes the latex with the large grain size to aggregate, reduces the lowest film-forming temperature of the film, improves the film-forming capability of the film and decreases the usage amount of a film-forming additive; and the hardness, chemical-resistance and wear-resistance of the film are improved by using two different water-based polymers are used for compounding.
Owner:SOUTH CHINA UNIV OF TECH +1
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