8599results about How to "Reduce contact area" patented technology

The invention relates to an arc-shaped cutting anastomat comprising an anastomosis nail shaping mechanism, a nail pushing assembly, a trigger handle, a nail supporting seat, a base of the nail supporting seat, a knife cushioning ring and two splints, wherein the nail pushing assembly comprises a cutting knife, a nail pushing sheet, a nail bin and a guide post; the end of the nail pushing sheet and both sides of the cutting knife are respectively provided with a plurality of inner nail pushing dental sheets which are near the cutting knife and a plurality of outer nail pushing dental sheets which are far away from the cutting knife; the cutting knife and the nail pushing sheet are injected and molded at a time to be fixed together; the outer side of the each outer nail pushing dental sheeton the nail pushing sheet is provided with a reinforcing rib; the inner side of each nail pushing dental sheet on the nail pushing sheet is provided with a reinforcing rib; both ends of the first guide surfaces of the nail pushing dental sheets are respectively connected with the first contact surfaces and the second contact surfaces of the nail pushing dental sheets through concave arc-shaped connecting surfaces, and both ends of the second guide surfaces thereof are respectively connected with the first contact surfaces and the second contact surfaces through the concave arc-shaped connecting surfaces; and the first contact surfaces and the second contact surfaces are respectively in contact with the inner walls of the nail pushing dental sheet holes of the nail bin. The invention has the advantages of good trigger anastomosis shaping effect and high safety.

Tread structures, wave motion navigational controls, and ramp up recovery controls are provided to an autonomous floor cleaner to reduce wheel slippage. The floor cleaner delivers liquid to the floor as part of the cleaning process. Wheels on the device are provided with relatively deep peripheral grooves to minimize the contact surfaces of a sprocket wheel and to accommodate the layer of liquid on the floor. In the event of wheel slippage, or to prevent wheel slippage, the device is designed to move forward with a slight side-to-side wave action caused by periodically altering the relative speeds of two drive wheels. There is also provided a slippage recovery mode where the drive wheels shut down or greatly slow when severe slippage is sensed, followed by a slow ramp up of speed.

Artificial implants having reduced area to provide reduced wear are provided. The reduced area is particularly located at areas where greatest wear is exhibited. In a particular embodiment of a mobile bearing knee implant, the area is reduced on the mobile bearing insert underside, where it contacts a tibial component. The reduced area may be any shape of indentations, for example, grooves, dimples, straight patterns, curved patterns, crossing patterns, holes, channels or slots. The indentations may be various sizes, and have been found to be particularly effective if covering about 10% to about 20% of the insert at depths between about 1-2 mm.

The invention relates to a method of interpreting a control command given on a touch screen of a portable electronic device, in which method the combination of a touch on an area interpreted as a contact area and a release of the touch from the area interpreted as said same contact area is interpreted as a control command. The method comprises interpreting, once the contact area has been touched, a larger contact area as said same contact area for the release of the touch than the contact area before the touch.

The present invention relates to cost effective methods for metallization and or metallization and interconnection of high efficiency silicon based back-contacted back-junction solar panels and solar panels thereof having a multiplicity of alternating rectangular emitter- and base regions on the back-side of each cell, each with rectangular metallic electric finger conductor above and running in parallel with the corresponding emitter- and base region, a first insulation layer in-between the wafer and finger conductors, and a second insulation layer in between the finger conductors and cell interconnections.