2149results about How to "Improve adhesion strength" patented technology

An orthopaedic implant system includes an orthopaedic implant implantable at a selected location within a corporeal body. The implant includes a first structural material and a second structural material. The first structural material is non-resorbable relative to the corporeal body and is different relative to the second structural material. The implant is an internal fixation device.

The invention relates to an apparatus and process for solid-state deposition and consolidation of powder particles entrained in a subsonic or sonic gas jet onto the surface of an object. Under high velocity impact and thermal plastic deformation, the powder particles adhesively bond to the substrate and cohesively bond together to form consolidated materials with metallurgical bonds. The powder particles and optionally the surface of the object are heated to a temperature that reduces yield strength and permits plastic deformation at low flow stress levels during high velocity impact, but which is not so high as to melt the powder particles.

A bonding technique suitable for bonding a non-metal body, such as a silicon MEMS sensor, to a metal surface, such a steel mechanical component is rapid enough to be compatible with typical manufacturing processes, and avoids any detrimental change in material properties of the metal surface arising from the bonding process. The bonding technique has many possible applications, including bonding of MEMS strain sensors to metal mechanical components. The inventive bonding technique uses inductive heating of a heat-activated bonding agent disposed between metal and non-metal objects to quickly and effectively bond the two without changing their material properties. Representative tests of silicon to steel bonding using this technique have demonstrated excellent bond strength without changing the steel's material properties. Thus, with this induction bonding approach, silicon MEMS devices can be manufacturably bonded to mechanical steel components for real time monitoring of the conditions / environment of a steel component.

An orthopaedic screw having a plurality of regions, at least one of which may be porous. The orthopaedic screw includes a head, a tip and at least one thread. The porosity of the screw of the present invention can vary within the part or region, including changes in pore shape, size and density. These characteristics can vary along the length of the screw axis and / or radially (from the outer diameter to the axis). The orthopaedic screw may further include at least one solid region formed of any implantable polymer, reinforced polymer or metal.

A method is provided for producing a metal composite. The composite includes a metal material and a resin curing layer provided along the metal material, and is obtained by using heat and pressure to mold a preform. The preform includes a sheet-shaped base material containing a thermosetting resin, and a metal material arranged or layered so as to contact the sheet-shaped base material. The method for producing a metal composite includes heating the sheet-shaped base material and semi-curing the thermosetting resin while the metal material in the preform arranged inside a mold is heated to a temperature exceeding 180° C., and molding the preform into a composite using pressure, wherein the thermosetting resin is at least one type selected from the group consisting of epoxy resins, phenol resins, benzoxazine resins, and unsaturated polyester resins.

The invention relates to self-adhesive addition-crosslinking silicone compositions which comprises(A) diorganopolysiloxanes, (B) organohydrogenpolysiloxanes containing less than 20 SiH bonded hydrogen atoms and less than 12% aryl groups, (C) organosilicon compounds having epoxy groups and hydrolyzable groups and (D) a hydrosilylation catalyst. The compositions are transparent to translucent, exhibit good compositional comparability, and cure to form strongly adhesive elastomers with good physical properties.

The invention provides conductive paste for a crystalline silicon solar cell. The conductive paste comprises the following components in parts by weight: 100 parts of conductive metal powder, 1.0-10 parts of inorganic binder, 10-65 parts of organic carrier and 0.05-5.0 parts of conductive carbon. The conductive paste is excellent in conductivity; the photoelectric conversion efficiency of the cell is not influenced; and widely applied conductive paste for the crystalline silicon solar cell such as front-side silver paste, front-side seed layer silver paste, back-side silver paste and back electric field aluminum paste can be prepared.

Noble metallic tips, made of a Pt alloy or an Ir alloy, are fixed to electrode base materials. The electrode base materials are an alloy containing a chief element selected from the group consisting of Ni, Fe, and Co and a plurality of additive elements. At least two kinds of additive elements contained in this alloy have a standard free energy of formation smaller than that of the chief element.

A solid electrolytic capacitor comprising a capacitor element comprising a valve-acting metal substrate having on the surface thereof a dielectric film and a solid electrolytic layer provided on the dielectric film, the capacitor element provided with lead wires (lead frames), in which the bonding structure between the capacitor element and the lead frames is improved. The solid electrolytic capacitor has high strength at the bonded portion between the capacitor element and the lead frames and has excellent heat resistance and is highly reliable. Also, a method for manufacturing such a solid electrolytic capacitor is disclosed.

The invention discloses a color filter substrate, a liquid crystal display panel comprising the color filter substrate and a manufacturing method of the color filter substrate. The color filter substrate comprises a substrate body, black matrixes and color filter patterns, wherein the substrate body is provided with display regions and non-display regions located on the peripheries of the display regions, the black matrixes are arranged on the substrate body, sub-pixel regions are defined on the black matrixes, corresponding to the display regions, of the substrate body and the surface of the black matrixes, corresponding to the non-display regions, of the substrate body are uneven surfaces and the color filter patterns are arranged in the sub-pixel regions. According to the color filter substrate, the black matrixes, located at the positions of the non-display regions, on the color filter substrate are provided with the uneven surfaces, the shape of the face, making contact with sealant, of the color filter substrate is changed, the contacting area between the color filter substrate and the sealant is increased, the adhesion strength between the color filter substrate and the sealant is enhanced, the stripping strength of the color filter substrate and a thin film transistor array substrate is enhanced and the problem that liquid crystal leakage is generated due to the fact that the color filter substrate and the sealant are easy to strip is avoided.