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60results about How to "High degree of design" patented technology
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Semiconductor device and manufacturing method of the same
InactiveUS20080150157A1High degree of designSemiconductor/solid-state device detailsSolid-state devicesElectrical conductorEngineering
A semiconductor device, includes a wiring board; a first semiconductor element mounted on the wiring board; a second semiconductor element mounted on the first semiconductor element so that a position of the second semiconductor element is shifted relative to a position of the first semiconductor element; wherein a part of a main surface of the second semiconductor element faces the first semiconductor element; and an electrode pad provided on the main surface of the second semiconductor element is connected to a second semiconductor element connection pad of the wiring board by a connection part.
Owner:SOCIONEXT INC
Method for producing metal composite, and chassis for electronic equipment
ActiveUS20130242487A1Excellent amenability to thin-walling and lightweightingHigh degree of designMagnetic/electric field screeningDigital data processing detailsEpoxyShell molding
A method is provided for producing a metal composite. The composite includes a metal material and a resin curing layer provided along the metal material, and is obtained by using heat and pressure to mold a preform. The preform includes a sheet-shaped base material containing a thermosetting resin, and a metal material arranged or layered so as to contact the sheet-shaped base material. The method for producing a metal composite includes heating the sheet-shaped base material and semi-curing the thermosetting resin while the metal material in the preform arranged inside a mold is heated to a temperature exceeding 180° C., and molding the preform into a composite using pressure, wherein the thermosetting resin is at least one type selected from the group consisting of epoxy resins, phenol resins, benzoxazine resins, and unsaturated polyester resins.
Owner:TORAY IND INC
Multilayer substrate and manufacturing method thereof
ActiveUS20060057341A1Suppress mutationHigh pattern accuracySemiconductor/solid-state device detailsPrinted circuit aspectsImpedance matchingConductive materials
Owner:TDK CORPARATION
Semiconductor device
ActiveUS20120306533A1Switch accuratelyReduce power consumptionPower reduction in field effect transistorsSolid-state devicesPower semiconductor deviceNODAL
A programmable analog device and an analog device that can retain data even when supply of a power supply potential is interrupted and consumes less power. In a semiconductor device, first to fourth transistors are used as switches in a unit cell including an analog element, and the output of the unit cell switches between a conducting state, a non-conducting state, and a conducting state through the analog element by controlling the potential of a first node where the first transistor and the second transistor are connected and the potential of a second node where the third transistor and the fourth transistor are connected.
Owner:SEMICON ENERGY LAB CO LTD
Apparatus for detecting displacement of electromagnetic actuator
ActiveUS20110234210A1Simple structureHigh design freedomElectric/magnetic position measurementsMagnetsDriving currentCoupling
Owner:YAMAHA CORP
Semiconductor device and manufacturing method of the same
InactiveUS7906852B2High degree of designSemiconductor/solid-state device detailsSolid-state devicesPower semiconductor deviceElectrical conductor
Owner:SOCIONEXT INC
Multilayer substrate and manufacturing method thereof
ActiveUS7868464B2High degree of designSelection is rather arbitrarySemiconductor/solid-state device detailsPrinted circuit aspectsImpedance matchingConductive materials
A multilayer substrate according to the present invention includes a plurality of laminated insulating layers and conductive patterns formed between the respective insulating layers. The conductive patterns include a first conductive pattern having a predetermined thickness and a second conductive pattern thicker than the first conductive pattern. The first and second conductive patterns are located in the same layer. The first conductive pattern is formed by pattern-etching a conductive layer having a uniform thickness by the subtractive method. The second conductive pattern is formed by forming a pattern-forming groove and then filling the inside of the pattern-forming groove with a conductive material simultaneously with forming a via hole. The first conductive pattern is suitable for an LC pattern for a high-frequency circuit requiring small variations in the width and the thickness of the pattern as well as accuracy in the thickness relative to an insulating pattern, and for a normal conductive pattern requiring impedance matching. The second conductive pattern is suitable for an L pattern for a choke coil.
Owner:TDK CORPARATION
Integral wall base and flash cove
An integral wall base and flash cove having a wall portion, an elongated toe and a concave cove interconnecting the wall portion and the elongated toe in smooth transition. The integral wall base and flash cove can be wrapped around inside and outside corners without the need for a separate molded corner. The integral wall base and flash cove can be installed without required a cove stick or top cap moulding.
Owner:TARKETT USA
Insulating substrate, metal-clad laminate, printed wiring board and semiconductor device
InactiveUS20130242520A1Direction can be controlledDegree of warping be controlledSemiconductor/solid-state device detailsSynthetic resin layered productsFiberEngineering
The present invention provides: an insulating substrate or metal-clad laminate able to sufficiently reduce or prevent negative warping of a semiconductor device; a printed wiring board that uses the insulating substrate or metal-clad laminate; and a semiconductor device. The insulating substrate is composed of a cured product of a laminate including one or more fibrous base material layers and two or more resin layers, in which the outermost layers on both sides is the resin layers. At least one of the fibrous base material layers is shifted towards the first side or a second side on the opposite side thereof with respect to the reference position, namely the dividing position at which a total thickness of the insulating substrate is equally divided by the number of the fibrous base material layers and each divided region having the thickness is further equally divided by two. The fibrous base material layers are not shifted in different directions. It is possible to produce a printed wiring board by using, as a core substrate, a metal-clad laminate containing the insulating substrate. Also, it is possible to produce a semiconductor device by mounting a semiconductor element onto the printed wiring board.
Owner:SUMITOMO BAKELITE CO LTD
Vibration absorbing hose
InactiveUS6935378B2Large effect to gas permeation resistanceReduce resistanceSpringsLayered productsEngineeringAspect ratio
A vibration absorbing hose including a corrugated portion has multi-layered construction of tubular inner rubber layer, pressure resistant reinforcement layer circumscribing an outer side of the inner rubber layer and outer rubber layer as outermost cover layer. The pressure resistant reinforcement layer is formed, for example, by providing reinforcing yarns, so as to have corrugations along the corrugated portion of the inner rubber layer. The inner rubber layer contains scaly filler in an amount of 50 phr to 200 phr so as to be oriented in a stretching direction of the inner rubber layer. The scaly filler has an aspect ratio of 2 to 90.
Owner:SUMITOMO RIKO CO LTD
Package for an integrated circuit
ActiveUS20060261457A1Small package footprintImprove design flexibilitySemiconductor/solid-state device detailsSolid-state devicesElectrical connectionIntegrated circuit packaging
According to various illustrative embodiments of the present invention, a device for an integrated circuit includes a monolithic frame having a plurality of alignment features disposed thereon, the monolithic frame having a mounting surface disposed thereon for the integrated circuit, the monolithic frame also having a thermal interface area disposed thereon for the integrated circuit. The device also includes an electrical interface capable of providing an electrical connection for the integrated circuit, the plurality of alignment features being substantially independent of the electrical interface, and an adhesive layer disposed between the monolithic frame and the electrical interface.
Owner:TEXAS INSTR INC
Lens apparatus and image-taking apparatus
A lens apparatus which is easy to assemble, provides high strength at the flange portion, and achieves high degree of design freedom, too, is disclosed. On the circumferential wall of a second barrel member, a first groove portion is disposed to guide a guide portion provided in the first barrel member and at the end of optical axis direction of the circumferential wall, a flange portion is formed. On a third barrel member, a cam portion which engages with a cam follower portion provided on the guide portion is formed.
Owner:CANON KK
Modular building block system and method of manufacture
InactiveUS20080104906A1High degree of designHigh degree of structural flexibilityWallsStereotype platesService provisionCoupling
A first load bearing component is adapted to provide load bearing strength when the modular building block is used in a building panel. A second load bearing component is coupled to the first load bearing component via a first coupling arrangement and is adapted to provide load bearing strength when the modular building block is used in the building panel. A building services component is positioned between the first load bearing component and the second load bearing component for providing a conduit for at least one building service. The first and second load bearing components and the building services component are adapted to be configurable in a plurality of positions relative to the other.
Owner:PYO JOHN M
Fluxgate sensor and electronic compass making use thereof
InactiveUS20120151786A1Increase the number of coilsIncrease the number ofMagnetic field measurement using flux-gate principleCompassesEngineeringCompass
Provided is a flux gate sensor comprising the following: a magnetic core having a first wiring layer formed on a board, a first insulating layer formed in such a way as to cover the aforementioned first wiring layer, and a magnetic core which is formed on the aforementioned first insulating layer and which has a central portion and an end portion that continues to the aforementioned central portion, that has a width larger than the width of the aforementioned central portion, and that is located on either side of the aforementioned central portion; a second insulating layer which covers the aforementioned magnetic core and which is formed on the aforementioned first insulating layer; and a second wiring layer formed on the aforementioned second insulating layer.
Owner:THE FUJIKURA CABLE WORKS LTD
Package for an Integrated Circuit
ActiveUS20100019366A1Small footprintHigh degree of designSemiconductor/solid-state device detailsSolid-state devicesElectrical connectionIntegrated circuit packaging
Owner:TEXAS INSTR INC
Front body of vehicle
ActiveUS8894134B2High degree of designSimple structureVehicle seatsUnderstructuresVehicle frameSubframe
A front body of a vehicle is formed by attaching a subframe to left and right front side frames. The subframe is disposed in front of a floor of a cabin and extends to the left and right. An engine contact part facing toward an engine inside the front body is disposed on an upper part the subframe. The subframe has rear fastening parts fastened to the respective front side frames, and rear arm connecting parts with which respective lower arms are engaged. A portion between each of the rear arm connecting parts and the corresponding rear fastening part is deformed to absorb shocks.
Owner:HONDA MOTOR CO LTD
Rotation detecting apparatus
ActiveUS7141966B2High design freedomHigh degree of designAcceleration measurement using interia forcesUsing electrical meansMagnetic reluctanceDeflection angle
Rotation detecting apparatus for detecting rotation of a magnetic rotor includes: a sensor chip having a magnetoresistive device; and a bias magnet. The magnetoresistive device is capable of detecting change of a magnetic vector near the sensor chip so that the rotation detecting apparatus detects the rotation of the magnetic rotor. The change of the magnetic vector is generated by the bias magnetic field and the rotation of the magnetic rotor. The bias magnet is disposed around the sensor chip so that a deflection angle of the magnetic vector is controllable.
Owner:DENSO CORP
Shoe outsole
InactiveUS20020025395A1High degree of designHigh strengthSolesSynthetic resin layered productsEngineeringFiber
A shoe outsole (1) is formed of a rubber composition including a short fiber. The amount of the short fiber to be blended is 2 to 40 parts by weight for 100 parts by weight of a base rubber. The short fiber has an orientation in an almost horizontal direction. An orientation angle to the horizontal direction of the short fiber is 30 degrees or less. The short fiber may have an orientation in almost horizontal and lateral directions. Moreover, the short fiber may have an orientation in almost horizontal and longitudinal directions. The outsole (1) is excellent in a strength.
Owner:SUMITOMO RUBBER IND LTD
Lens apparatus and image-taking apparatus
A lens apparatus which is easy to assemble, provides high strength at the flange portion, and achieves high degree of design freedom, too, is disclosed. On the circumferential wall of a second barrel member, a first groove portion is disposed to guide a guide portion provided in the first barrel member and at the end of optical axis direction of the circumferential wall, a flange portion is formed. On a third barrel member, a cam portion which engages with a cam follower portion provided on the guide portion is formed.
Owner:CANON KK
MEMS sensor, method of manufacturing MEMS sensor, and electronic apparatus
ActiveUS20100270596A1Improve accuracyEasy to manufactureAcceleration measurement using interia forcesDecorative surface effectsMems sensorsPhysics
A MEMS sensor includes: a substrate; a fixed electrode portion formed in the substrate; a movable weight portion formed above the fixed electrode portion via a gap; a movable electrode portion formed in the movable weight portion and disposed so as to face the fixed electrode portion; a supporting portion; and a connecting portion that couples the supporting portion with the movable weight portion and is elastically deformable, wherein the movable weight portion is a stacked structure having conductive layers and an insulating layer, and plugs having a larger specific gravity than the insulating layer are embedded in the insulating layer.
Owner:138 EAST LCD ADVANCEMENTS LTD
Balloon displays
A structural and / or decorative balloon display is comprised of a plurality of connected, inflatable chambers formed by a plurality of die applications to a plurality of layers of film. In one preferred embodiment connected chambers have and maintain fluid communication. In another preferred embodiment, connected, inflatable chambers have no fluid communication. In other preferred embodiments fluid communication is terminated after inflation. Other embodiments take advantage of variations of numbers of layers, configurations of layers, and treatment of surfaces to create special balloon forms.
Owner:ROUSE GRAHAM MANLY
Delivery module for selective catalytic reduction
ActiveUS20110016852A1High degree of design freedomEconomically fabricatedLiquid surface applicatorsInternal combustion piston enginesExternal combustion engineInternal combustion engine
The invention relates to a delivery module for a dosage system used to introduce a reducing agent into the exhaust gas tract of an internal combustion engine. The delivery module has a housing, which accommodates various components, and which is produced as an injection moulded component. A heating system is integrated in the vicinity of the center of the housing. The housing has at least one chamber for receiving additional components.
Owner:ROBERT BOSCH GMBH
Vibration absorbing hose
Owner:SUMITOMO RIKO CO LTD
Integral wall base and flash cove
An integral wall base and flash cove having a wall portion, an elongated toe and a concave cove interconnecting the wall portion and the elongated toe in smooth transition. The integral wall base and flash cove can be wrapped around inside and outside corners without the need for a separate molded corner. The integral wall base and flash cove can be installed without required a cove stick or top cap moulding.
Owner:TARKETT USA
Method for producing a metal composite
ActiveUS9505177B2Excellent amenability to thin-walling and lightweightingHigh degree of designMagnetic/electric field screeningDigital data processing detailsEpoxyShell molding
A method is provided for producing a metal composite. The composite includes a metal material and a resin curing layer provided along the metal material, and is obtained by using heat and pressure to mold a preform. The preform includes a sheet-shaped base material containing a thermosetting resin, and a metal material arranged or layered so as to contact the sheet-shaped base material. The method for producing a metal composite includes heating the sheet-shaped base material and semi-curing the thermosetting resin while the metal material in the preform arranged inside a mold is heated to a temperature exceeding 180° C., and molding the preform into a composite using pressure, wherein the thermosetting resin is at least one type selected from the group consisting of epoxy resins, phenol resins, benzoxazine resins, and unsaturated polyester resins.
Owner:TORAY IND INC
Semiconductor optical device, arrayed semiconductor optical device, and optical module
ActiveUS20170123172A1Reduce parasitic capacitanceIncrease freedomOptical wave guidanceLaser optical resonator constructionElectrical conductorOptical Module
Provided is a semiconductor optical device, an arrayed semiconductor optical device, an optical module having a structure to reduce the parasitic capacitance as well as a high design degree of freedom and having a multilayer structure in which a semi-insulating substrate, a first semiconductor layer having one conductive type, an active layer having light emission function, a second semiconductor layer having the other conductive type, an insulating layer, and a conductive layer are stacked in order from the bottom. The multilayer structure includes a light emitting structure, a first electrode structure, and a second electrode structure. In the semi-insulating substrate and the first semiconductor layer, a first grove which separates the second electrode structure from a remaining portion and approaches the second electrode structure with a non-linear shape rather than a linear shape in its entirety is formed.
Owner:LUMENTUM JAPAN INC
Vibration absorbing hose
InactiveUS6983769B2Good flexibilityImproved vibration absorption performanceLayered product treatmentSynthetic resin layered productsYarnEngineering
Owner:SUMITOMO RIKO CO LTD
Package for an integrated circuit
ActiveUS7612440B2Small footprintHigh degree of designSemiconductor/solid-state device detailsSolid-state devicesElectrical connectionIntegrated circuit packaging
Owner:TEXAS INSTR INC
MEMS sensor, method of manufacturing MEMS sensor, and electronic apparatus
ActiveUS8183651B2Improve accuracyEasy to manufactureAcceleration measurement using interia forcesDecorative surface effectsEngineeringMems sensors
A MEMS sensor includes: a substrate; a fixed electrode portion formed in the substrate; a movable weight portion formed above the fixed electrode portion via a gap; a movable electrode portion formed in the movable weight portion and disposed so as to face the fixed electrode portion; a supporting portion; and a connecting portion that couples the supporting portion with the movable weight portion and is elastically deformable, wherein the movable weight portion is a stacked structure having conductive layers and an insulating layer, and plugs having a larger specific gravity than the insulating layer are embedded in the insulating layer.
Owner:138 EAST LCD ADVANCEMENTS LTD
Mist forming method using fluid injection valve, fluid injection valve, and mist forming apparatus
A mist forming method using a fluid injection valve formed of a valve seat, a valve body, and a nozzle portion or an injection hole plate having injection holes, and configured to turn in-hole flows and flows immediately below the injection holes into substantially liquid film flows. Directions of jets from the injection holes are not necessarily brought into coincidence with a center axis direction of the injection holes and are not necessarily crossed with one another in a downstream part, and after the jets turned into mists at a position downstream of a break length position, the mists are allowed to come close or gather by the Coanda effect so as to appear substantially as one solid mist, and allowed to keep gathering until catching of ambient air and a resulting air flow along a downstream flow direction in a predetermined in-mist portion attenuate.
Owner:MITSUBISHI ELECTRIC CORP
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