68results about How to "Prevent moisture intrusion" patented technology

An optical lens assembly containing a plural number of lens elements for an optical system to be incorporated into a tip end portion of an endoscopic insertion instrument. Of a plural number of lenses which constitute an optical system, a metal film layer is formed on confronting outer peripheral surface portions of at least two adjacently located lenses, outside respective effective lens areas, and the two adjacently located lenses are assembled and fixedly bonded together by applying solder to the outer peripheral surface portions with a metal film layer.

A film interactive touchpad for control of home systems. A touchscreen defined by a glass panel and polyester film defines active areas responsive to contact. Multiple, customizable and interchangeable templates correspond with multiple levels of functionality and define input and control buttons corresponding to active areas of the touchpad. A display such as an organic light emitting diode (OLED) provides interactive, color feedback. The touchscreen has a hinged connection to the touchpad and is pivotable to an open position to permit insertion and removal of the overlay templates, and is surrounded by a trim ring dam to prevent moisture intrusion. A light sensor is provided for detecting the ambient light level and adjusting the intensity of a backlight for faceplates of any color.

A semiconductor device includes a semiconductor substrate, an electrode pad electrically connected to a circuit element formed on the semiconductor substrate, a connection wiring electrically connected to the electrode pad and extending on the semiconductor substrate, and a post electrode formed on the connection wiring. The semiconductor device further includes an adhesion film formed on the side surface of the post electrode, and a sealing layer that has light-shielding property and seals the surface of the adhesion film and the connection wiring.

A metal solder layer is formed on a sealing substrate through patterning. A pixel substrate is overlapped to the sealing substrate and the solder layer is irradiated with laser so that the sealing substrate and the pixel substrate are connected. Because the joining is achieved by the metal solder layer, intrusion of moisture into the inside space can be reduced. In addition, the solder layer can be very precisely formed through patterning.

Provided is an organic light-emitting apparatus in which a crack or the like produced when removing a passivation layer on an external connection terminal is prevented from developing with the elapse of time and the moisture resistance of a light-emitting area is not impaired. The organic light-emitting apparatus includes a substrate; an organic planarization layer for planarizing unevenness of the substrate; an organic light-emitting device including a lower electrode, an organic compound layer, and an upper electrode; and a passivation layer for covering the organic light-emitting device, in which the organic planarization layer has formed therein a recessed or protruding discontinuous portion for dividing a region including a light-emitting area and a region including an external connection terminal, and the discontinuous portion is covered with the passivation layer.

A laminated electronic component is configured to include substrate plating films disposed on outer surfaces of an electronic component main body through direct plating such that external terminal electrodes are connected to exposed portions of internal conductors (internal electrodes), and the average particle diameter of metal particles defining the substrate plating film is at least about 1.0 μm. The external terminal electrode includes at least one layer of an upper plating film disposed on the substrate plating film. The metal particles defining the substrate plating film are Cu particles.

In a laminated ceramic electronic component in which, by directly carrying out a plating process on an outer surface of a component main body, an external electrode is formed thereon, an attempt is made to improve the adhesion strength between a plated film forming the external electrode and the component main body. A brazing material containing Ti is applied to at least one portion of a surface on which external electrodes of a component main body is formed, and by baking this brazing material, a metal layer containing Ti is formed. Moreover, the external electrodes are formed by a plating process so as to coat at least the metal layer, and a heating process is then carried out so as to cause counter diffusion between the metal layer and the plated film that is to form the external electrodes.

A first moisture blocking layer formed of a silicon type nitride film such as SiNx or the like is formed over the entire surface so as to cover a drain electrode and a source electrode of a TFT. On the first moisture blocking layer, a first planarization film formed of an organic material is provided. On the first planarization film, a second moisture blocking layer formed of SiNx or the like is provided. In the peripheral region, the second moisture blocking layer extends down on the first moisture blocking layer and is connected with the first moisture blocking layer. Also, a sealing glass is bonded to the second moisture blocking layer using the sealing member. By enclosing the first planarization film by the first moisture blocking layer and the second moisture blocking layer, intrusion of external moisture can be effectively prevented.

A piezoelectric element and an injector using the same piezoelectric element are disclosed, which are so high in reliability as not to be shorted even in a high humidity environment, are small in size, are low in cost and are high in heat radiation capability. The piezoelectric element comprises a ceramic laminate (10) including a plurality of ceramic layers of a piezoelectric ceramic (11) and a plurality of internal electrode layers (21, 22), stacked alternately. At least an organic insulating layer (41) of an organic material is formed on at least a part of the surface of the ceramic laminate (10), and at least an inorganic insulating layer (42) of an inorganic material is formed on the organic insulating layer (41).

To effectively prevent intrusion of moisture into a space above an organic EL element, a moisture blocking layer made of a silicon-based nitride film such as SiNx or a TEOS film formed to cover a drain electrode and source electrode of a TFT is formed on the entire surface of the element. A sealing glass is attached to the moisture blocking layer by a sealing material on the peripheral region of the substrate. The intrusion of moisture from the outside is effectively prevented by the moisture blocking layer.

In a radiation detecting device, a groove portion is provided in a sealing region on a photoelectric conversion substrate. The groove portion is provided in the vicinity of a phosphor layer formed on the photoelectric conversion substrate or along an outer peripheral side thereof. A moisture-proof protective layer is provided to cover the phosphor layer and the sealing region through an adhesive layer. The adhesive layer is cured when in a flowable state to function as an adhesive. In a case where the moisture-proof protective layer is adhered, the adhesive layer enters a flowable state, and thus, the adhesive layer flows into the groove portion and fills at least a part of the inside of the groove portion.

A method of manufacturing a semiconductor device includes: forming a transistor with first and second ends 3a and 3b of a main current path, and a control electrode 5, covering the transistor with a first insulating film 6, forming first through third openings that expose the first and second ends 3a and 3b and the control electrode 5, and burying or filling first to third conductive materials 7a-7c in the first to third openings respectively, forming the ferroelectric capacitor by laminating the first electrode 8, the ferroelectric film 9, and the second electrode 10, laminating the second insulating film 11 and the moisture diffusion protective film 12, forming the fourth opening 13c to expose the third conductive material 7c through the second insulating film 11 and the moisture diffusion protective film 12, and forming a first wiring layer 14c, which has electrical connection with the control electrode 5.

Heat sealing a connector assembly can be performed by providing connector assembly in component accessible state, overlaying sealing tape on electrical contacts and housing, sealing tape being impregnated with heat sensitive adhesive, the overlaying leaving the dimples exposed, and sealing the connector assembly by applying heat to heat sensitive sealing tape.