The invention belongs to the technical field of
polymer composite materials, and particularly relates to a resin composition for a
copper foil-clad base plate in the high-frequency and high-speed field and application thereof. The resin composition is prepared from 55 to 70 weight percent of active ingredients and 30 to 45 weight percent of solvents, wherein the active ingredients comprise the following raw materials in parts by weight: 15 to 45 parts of modified
polyphenyl ether resin, 10 to 50 parts of cross-linking agents, 5 to 30 parts of TAIC, 5 to 20 parts of
hydrocarbon resin, 10 to 15 parts of fire retardants, 0.5 to 2 parts of initiators and 15 to 30 parts of inorganic fillers. The obtained
resin composite with various excellent properties can be applied to the preparation of high-performance
copper-clad plates; and the
copper-clad plates have the excellent
dielectric property and high temperature-resistant performance,
soldering-
tin-resistant performance, heat-resistant performance and high
glass transition temperature.