3361results about How to "Excellent dielectric properties" patented technology

Abstract of Disclosure Process for producing silicon oxide containing thin films on a growth substrate by the ALCVD method. In the process, a vaporisable silicon compound is bonded to the growth substrate, and the bonded silicon compound is converted to silicon dioxide. The invention comprises using a silicon compound which contains at least one organic ligand and the bonded silicon compound is converted to silicon dioxide by contacting it with a vaporised, reactive oxygen source, in particular with ozone. The present invention provides a controlled process for growing controlling thin films containing SiO2, with sufficiently short reaction times.

A thermosetting composition comprises a capped poly(arylene ether), an alkenyl aromatic monomer, and an acryloyl monomer. The composition provides good flow properties and fast curing rates. After curing, the composition exhibits good stiffness, toughness, heat resistance, and dielectric properties.

A thermosetting composition comprises a capped poly(arylene ether), an alkenyl aromatic monomer, and an alkoxylated acryloyl monomer. The composition provides good flow properties and fast curing rates. After curing, the composition exhibits good stiffness, toughness, and heat resistance.

Process for producing silicon oxide containing thin films on a growth substrate by the ALCVD method. In the process, a vaporisable silicon compound is bonded to the growth substrate, and the bonded silicon compound is converted to silicon dioxide. The invention comprises using a silicon compound which contains at least one organic ligand and the bonded silicon compound is converted to silicon dioxide by contacting it with a vaporised, reactive oxygen source, in particular with ozone. The present invention provides a controlled process for growing controlling thin films containing SiO2, with sufficiently short reaction times.

A method for enhancing the dielectric properties of an electrical cable segment having a central stranded conductor encased in a polymeric insulation jacket and an interstitial void volume in the region of the conductor, including filling the interstitial void volume with a dielectric property-enhancing fluid at a pressure below the elastic limit of the polymeric insulation jacket, and confining the fluid within the interstitial void volume at a residual pressure greater than about 50 psig, with the pressure being imposed along the entire length of the segment but below the elastic limit of the polymeric insulation jacket. Preferably, the residual pressure is sufficient to expand the interstitial void volume along the entire length of the cable segment by at least 5%.

A method for preparing meta- PPTA paper includes forming a sizing material by adding 5-95 wt. % of meta- PPTA staple fiber into water and forming another sizing material by adding 5-95 wt. % of meta- PPTA precipitated fiber in water, mixing two said sizing materials, laying prepared sizing material on screen for forming, pressing and drying, pressing and polishing in high temperature for forming.

A method for enhancing the dielectric properties of an electrical cable segment having a central stranded conductor encased in a polymeric insulation jacket and an interstitial void volume in the region of the conductor, including filling the interstitial void volume with a dielectric property-enhancing fluid at a pressure below the elastic limit of the polymeric insulation jacket, and confining the fluid within the interstitial void volume at a residual pressure greater than about 50 psig, with the pressure being imposed along the entire length of the segment but below the elastic limit of the polymeric insulation jacket. Preferably, the residual pressure is sufficient to expand the interstitial void volume along the entire length of the cable segment by at least 5%.

The invention discloses a thermosetting resin composition for an integrated circuit. The thermosetting resin composition comprises (a) 10-60 parts of an allyl modified bismaleimide resin prepolymer, (b) 10-40 parts of an anhydride compound, (c) 10-50 parts of benzoxazine resin, (d) 5-50 parts of epoxy resin, (e) 5-50 parts of a fire retardant, (f) 0-5 parts of a curing accelerator and (g) 0-35 parts of inorganic stuffing, wherein the number-average molecular weight of the allyl modified bismaleimide resin prepolymer is 1500-8000 g / mol. The resin composition provided by the invention keeps high heat resistance and high Tg characteristic of the allyl modified bismaleimide resin prepolymer, and achieves UL94V-0 level in halogen-free flame retardant aspect on the basis of low phosphorus content, and simultaneously, has low dielectric constant of the anhydride; and therefore, the resin composition is capable of meeting the requirements of the production process of high-performance printed circuit boards such as a high-density interconnected integrated circuit package.

The invention discloses a low-dielectric constant glass fiber, which comprises the following parts: 50- 60% SiO2, 6.0-9.5% Al2O3, 30.5-35% B2O3, 0-1.5% Na2O, 0-1.5% K2O, 0-1.5% Li2O, 0-5% CaO, 0-5% MgO, 0.5-2.5% ZnO, 0.5-5% TiO2. When the frequency is 1MHz under indoor temperature, the dielectric constant is 3.9-4.4, which is fit for high-density wiring circuit board.

The invention discloses a modified hot setting resin and a preparation method thereof. In parts by weight, the modified hot setting resin is obtained by evenly mixing 100 parts of hot setting resin, 0-100 parts of curing agent, 0-1 part of curing catalyzer, and 1-100 parts of hyperbranched silicon resin containing active functional groups at the temperature of 30-200 DEG C. The modified hot setting resin has high storage stability, processability and reactiveness and sufficiently integrates the performance advantages of hyperbranched polymer and polysiloxane, and thereby the obtained modified hot setting resin has high tenacity, more prominent thermostability and excellent dielectrical property as well as damp heat resistance. The preparation method of the modified hot setting resin has wide applicability, simple operating process and easy molding.

The invention relates to an epoxy resin composition as well as a prepreg and a copper-foil-clad laminated board prepared by using the same. The epoxy resin composition comprises the following essential components: (A) epoxy resin containing a naphthol structure, (B) an active ester serving as a curing agent, and (C) a curing accelerant. Because epoxy resin at least contains the naphthol structure in the molecular structure, the epoxy resin composition provided by the invention has higher functionality degree and high glass transition temperature; at the same time, the naphthol group structure is introduced to the molecular structure, thus the cured product has low water absorptivity and low expansion coefficient; due to the active ester serving as the curing agent, the advantages that the a polar group is not generated during the reaction between the active ester and epoxy, thus the dielectric properties are excellent and moisture and heat resistance are good are fully exerted; and in addition, because of the epoxy resin containing the special naphthol structure, the hydroscopicity of the resin cured product is further reduced and the dielectric loss value of the cured product is lowered. The prepreg and the copper-foil-clad laminated board provided by the invention have excellent dielectric properties, moisture and heat resistance and high glass transition temperature.

The invention relates to a fluororesin mixture, a copper-clad plate prepared therefrom and a manufacturing method thereof. The fluororesin mixture contains the following two substances as necessary components in 100 parts by weight of an organic solid substance: 90-99 parts of polytetrafluoroethylene (PTFE) emulsions and 1-10 parts of polytetrafluoroethylene perfluoroalkyl vinyl ether (PFA) emulsions. The copper-clad plate prepared from the fluororesin mixture comprises a plurality of superimposed varnished cloths and copper foil coating one or two surfaces of the varnished cloths, and each varnished cloth comprises a glass fiber cloth and the fluororesin mixture attached to the dipped and dried glass fiber cloth. The fluororesin mixture is prepared by using the PTFE emulsions as main resins and can dip the glass fiber cloths many times under the condition that the PTFE sintering temperature is330 DEG C to prepare the vanished cloths, and the vanished cloths prepared from the fluororesin mixture has the advantages of good gum dipping quality, level surface, flexibility and easy operation; and besides, the copper-clad plate made from the fluororesin mixture has excellent dielectric performance which meets the dielectric performance requirement of the high-frequency communication field for a base plate material, and has simple making method and process and is beneficial to industrial continuous production.

An apparatus and method for the treatment of chronic wounds using electromagnetic energy. The apparatus includes a generator and at least one applicator. The generator can produce electromagnetic energy and the applicator can apply the electromagnetic energy produced by the generator. A detector is disposed on the applicator that can measure the field strength of the electromagnetic energy applied.

The invention relates to a halogen-free Tg resin composite and a presoaked material and a laminated board made by adopting the composite. Counted by part by weight of organic solid matters, the halogen-free high-Tg resin composite contains the following components according to part by weight: (A) 10 to 50 parts by weight of cyanate resin; (B) 10 to 50 parts by weight of at least one compound withdihydro-benzoxazine ring; (C) 10 to 50 parts by weight of at least one kind of bismaleimides resin; (D) 10 to 50 parts by weight of at least one kind of poly-epoxy compound; and (E) 5 to 30 parts by weight of at least one kind phosphonium flame retardant. The halogen-free high-Tg resin composite has the performances of low water absorption, low CTE (coefficient of thermal expansion), high Tg, good dielectric property and the like, and the presoaked material and laminated board made by adopting the composite has the characteristics of high vitrification transition temperature, low CTE, low dielectric constant, low water absorption, high thermal resistance and the like, thus being application to multi-layer circuit boards.

There is provided a multilayer ceramic capacitor including a ceramic body having first and second side surfaces facing each other, and third and fourth end surfaces connecting the first and second side surfaces, a plurality of internal electrodes formed in the ceramic body and having one ends thereof exposed to the third end surface or the fourth end surface, and first and second side margin parts formed from the first and second side surfaces to edges of the internal electrodes, wherein in a width direction of the ceramic body, both edges of the internal electrodes include oxide regions, the oxidation regions of an internal electrode contributing to capacitance formation except for uppermost and lowermost internal electrodes among the internal electrodes have a maximum length Lmax of 3 μm or less, and a standard deviation in length is 1 μm or less.