296results about How to "High Tg" patented technology

A thermosetting composition comprises a capped poly(arylene ether), an alkenyl aromatic monomer, and an acryloyl monomer. The composition provides good flow properties and fast curing rates. After curing, the composition exhibits good stiffness, toughness, heat resistance, and dielectric properties.

A heat-expandable microcapsule comprising a polymer shell formed by polymerizing (I) acrylonitrile, a main monomer component, (II) a monomer having carboxyl and (III) a monomer having groups reactive with the carboxyl of the monomer (II) and of a liquid having a boiling point lower than the softening point of the polymer and being encapsulated in the polymer shell. The heat-expandable microcapsules expand within high temperature range, 240° C. or above, and have heat-resistance.

A thermosetting composition comprises a capped poly(arylene ether), an alkenyl aromatic monomer, and an alkoxylated acryloyl monomer. The composition provides good flow properties and fast curing rates. After curing, the composition exhibits good stiffness, toughness, and heat resistance.

Encapsulation compositions in which an encapsulate (A) is encapsulated in a matrix (B) may be prepared by:(i) mixing matrix (B) with a liquid plasticizer and encapsulate (A) in an extruder, to obtain a melted mixture of encapsulate (A) and matrix (B); and(ii) extruding the melted mixture, to obtain an extruded mixture.

An amino compound for an organic light-emitting device of general formula [1]:wherein X1 is bonded to the pair of fluorenyl groups at meta-positions to each other and is substituted or unsubstituted aromatic ring, fused polycyclic ring, or heterocyclic ring; Y1 and Y2 are each substituted or unsubstituted alkyl, aryl, or heterocyclic and are the same or different; Z1 to Z4 are each hydrogen, halogen, or substituted or unsubstituted alkyl, aralkyl, alkenyl, alkynyl, alkoxy, aryl, or heterocyclic and are the same or different; R1 to R4 are each hydrogen, halogen, or substituted or unsubstituted alkyl, aryl, or heterocyclic and are the same or different; a and d are each 1 to 4; and b and c are each 1 to 3.

The present invention discloses a thermosetting resin composition which comprises (A) 35 to 75 parts by weight of a thermosetting resin comprising a compound having a hydrobenzoxazine ring as a main component, (B) 10 to 25 parts by weight of a polycondensation product of a phenol, a compound having a triazine ring and an aldehyde, and (C) 10 to 45 parts by weight of an epoxy resin, based on 100 parts by weight of the total amount of organic solid components of Components (A), (B) and (C), and (i) a bisphenol F epoxy resin having a weight-average molecular weight of 1,000 to 3,000, or (ii) a mixed epoxy resin of bisphenol F epoxy resin and bisphenol A epoxy resin having a weight average molecular weight of 1,000 to 3,000, is contained in Component (C) in an amount of 0 to 100% by weight of Component (C); and a prepreg, a laminated board for a wiring board and a wiring board using the same.

The present invention provides a phenol resin having, as a unit in its main-chain skeleton, a structure represented by the following general formula (I), as well as a resin composition using the same. According to the phenol resin of the invention, epoxylation thereof, chemical modification thereof, reaction thereof with an epoxy resin, and the like are facilitated. Phenol resins ranging from low-molecular-weight resins rich in fluidity to high-melting resins can be synthesized, and these phenol resins are industrially useful. When the phenol resin of the present invention is used as a hardening agent for epoxy resin etc., its resin composition can give a cured product of high Tg without deteriorating adhesiveness.

The invention discloses a pipe hot medium internal pressure forming method based on molten glass, and relates to a metal pipe forming method. The problems that according to existing hot medium internal high pressure forming methods, the heating speed is low, heat conducting coefficients are low, sealing is difficult, and forming pressure only can reach about 0-50MPa are solved. The method comprises the steps that 1, a pipe internal high pressure forming temperature interval is determined according to the pipe variety; 2, according to the pipe internal high pressure forming temperature, glass materials are selected; 3, a pipe to be formed is preheated; 4, a pipe blank is vertically placed into a forming die, and die closing and sealing are carried out; 5, the glass materials are heated to obtain molten glass; 6, the glass media are injected into the sealed pipe blank; 7, the pipe blank is heated to internal high pressure forming temperature under high-temperature filling; and 8, material supplementing is carried out; and 9, pressure maintaining is carried out, the molten glass flows out through an overflow valve, die opening is carried out, and the formed deformed-section pipe partis obtained. The pipe hot medium internal pressure forming method is used in the field of internal high pressure forming.

Polymers and copolymers containing 1H-benzo[d]imidazol-2(3H)-one units have been synthesized under conditions generally used for the synthesis of poly(aryl ether)s. 1H-benzo[d]imidazol-2(3H)-one behaves like a biphenol in the polymerization reaction.The soluble homopolymer has a very high glass transition temperature (348° C.), good thermal stability, and forms flexible transparent films. Because of the low molecular weight (134.14) of the benzoimidazolone monomer in the copolymer formed with 4,4′-biphenol that contains 30 mole % of the benzimidazolone unit, only 8.9 weight % is required to raise the Tg of the poly(arlyl ether)sulfone from 220° C. to 269° C.

The invention discloses an epoxy adhesive for an electron component integrated molding technology and a preparation method of the epoxy adhesive. The epoxy adhesive comprises the following components in parts by weight: 30-70 parts of epoxy resin, 1-10 parts of curing agent, 1-10 parts of accelerator, 20-40 parts of solvent, and 0.1-5.0 parts of additive. Compared with the prior art, the epoxy adhesive is capable of satisfying the demand of an integrated molding process, and well adapting to different requirements of a new process in comparison with the traditional adhesive; the adhesive has high body strength, high modulus, high Tg, and high bonding strength, and is high in reliability. The epoxy adhesive is capable of satisfying the production process demand of the integrated molding process of the electron element and has higher reliability.