Single-component under-filler with favorable repairing property and preparation method thereof

Abstract

The invention discloses a single-component under-filler with the favorable repairing property, which is prepared by the following raw materials in percentage by weight: 11.8-69 percent of liquid-state epoxy resin, 2-10 percent of epoxy polybutadiene, 11.8-69 percent of polyurethane-modified epoxy resin, 0.5-14.8 percent of alicyclic epoxy resin, 1.5 to 18.5 percent of epoxy diluting agent, 0.5-14.8 percent of latency curing agent, 1.1-30.8 percent of accelerating agent, 0-39 percent of spherical silica micropowder and 0-6 percent of pigment. The invention also discloses a preparation method of the single-component under-filler with the favorable repairing property. The invention has the advantages of low viscosity, rapid curing for 40 seconds at 150 DEG C, high adhesive force, favorable heat-resistant impact-resistant performance and simple manufacture process, and can keep favorable adhesion reliability and solidifiability during heat circulation treatment, can improve the repairing performance of the single-component under-filler at the same time, and can be widely applied to the technical field of backbonded chip package.

Description

technical field [0001] The invention relates to a one-component surface mounting adhesive, in particular to a one-component bottom filling adhesive capable of rapid curing and good rework performance and a preparation method thereof. Background technique [0002] In the current world, due to the demand for wireless communications, portable computers, broadband Internet products and car navigation electronic products, the integration of electronic components is getting higher and higher, the chip area is expanding, and the number of integrated circuit pins is increasing. The package size is further miniaturized and miniaturized, and integrated circuits are developing in a lighter, thinner, and smaller direction, so many new packaging technologies and packaging forms have emerged. Flip chip (flip chip) interconnection technology is one of the most important packaging technologies. The specific content of flip chip technology is to interconnect the chip face down with the subst...

AI Technical Summary

Problems solved by technology

[0004] In order to solve the technical problems of low glass transition temperature (Tg), low reliability, poor reworkability of the existing underfill glue, and affect its quality when applied to electronic products, the present invention provides an excellent cold and heat cycle shock resistance, high One-component underfill adhesive with Tg, high reliability and good reworkability and preparation method thereof