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Epoxy resin encapsulating material as well as preparation method and application thereof

A technology of epoxy resin and potting material, applied in the direction of epoxy resin glue, adhesive type, adhesive additive, etc., can solve the problems of capacitance drop, affecting the service life, etc., achieve low shrinkage and hygroscopicity, improve resistance Heat and moisture resistance, effect of good compatibility

Active Publication Date: 2015-04-22
GUANGZHOU POCHELY NEW MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In capacitors, epoxy resin is often used for potting, but in actual use, there will be a significant drop in capacitance after the potted capacitor is stored for several months under normal conditions, which will affect the service life

Method used

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  • Epoxy resin encapsulating material as well as preparation method and application thereof
  • Epoxy resin encapsulating material as well as preparation method and application thereof
  • Epoxy resin encapsulating material as well as preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] An epoxy resin potting material is prepared from the following raw materials in parts by weight:

[0043] Resin part:

[0044]

[0045] Curing agent part:

[0046] Methyl nadic anhydride 90 parts

[0047] Cycloaliphatic epoxy resin 7 parts

[0048]Accelerator: 2,4,6-tris(dimethylaminomethyl)phenol 3 parts

[0049] The resin part and the curing agent part are mixed in parts by weight of 100:40.

[0050] The above-mentioned epoxy resin potting material is prepared by the following method:

[0051] In the preparation of the resin part, after adding the multifunctional diluent, silane coupling agent, and bisphenol A epoxy resin with a predetermined addition amount of 60% into the reaction vessel, the temperature was raised to 115° C., while stirring at a stirring speed of 400 rpm Add filler, then vacuumize while stirring, react for 3.5 hours, the vacuum degree is 730mmHg, then after cooling down to 45°C, add additives (commercially available BYK-066N defoamer) and t...

Embodiment 2

[0056] An epoxy resin potting material is prepared from the following raw materials in parts by weight:

[0057] Resin part:

[0058]

[0059] Curing agent part:

[0060] Methyltetrahydrophthalic anhydride 89 parts

[0061] Cycloaliphatic epoxy resin 5 parts

[0062] Accelerator: 2 parts of dimethylimidazole

[0063] The resin part and the curing agent part are mixed in parts by weight of 100:35.

[0064] The above-mentioned epoxy resin potting material is prepared by the following method:

[0065] In the preparation of the resin part, after adding multifunctional diluent, silane coupling agent, bisphenol A type epoxy resin and dicyclopentadiene phenol type epoxy resin in predetermined addition amount of 50%, the temperature is raised to 110 ℃, add filler while stirring at a stirring speed of 350rpm, then vacuumize while stirring, react for 4.5h, the vacuum degree is 700mmHg, then cool down to 40℃, add additives and the remaining bisphenol A epoxy Resin and dicyclopen...

Embodiment 3

[0070] An epoxy resin potting material is prepared from the following raw materials in parts by weight:

[0071] Resin part:

[0072]

[0073]

[0074] Curing agent part:

[0075]

[0076] The resin part and the curing agent part are mixed in parts by weight of 100:45.

[0077] The above-mentioned epoxy resin potting material is prepared by the following method:

[0078] In the preparation of the resin part, after adding the multifunctional diluent, silane coupling agent, and bisphenol A epoxy resin with a predetermined amount of 70% into the reaction vessel, the temperature was raised to 130°C and stirred at a stirring speed of 450rpm Add filler at the same time, then vacuumize while stirring, react for 2 hours, the vacuum degree is 760mmHg, then after cooling down to 60°C, add additives and the remaining bisphenol A type epoxy resin and dicyclopentadiene phenol type epoxy Resin, discharged, ready to use.

[0079] In the preparation of the curing agent part, afte...

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Abstract

The invention discloses an epoxy resin encapsulating material as well as a preparation method and application thereof, and belongs to the technical field of electronic materials. The epoxy resin encapsulating material is prepared from the following raw materials: a resin part, namely a bisphenol A epoxy resin, a dicyclopentadiene phenol-type epoxy resin, a multifunctional diluent, a filler, a silane coupling agent and auxiliaries, and a curing agent part, namely methyl nadic anhydride and / or methyl tetrahydrophthalic anhydride, a cycloaliphatic epoxy resin and an accelerant; the resin part is mixed with the curing part to obtain the epoxy resin encapsulating material. According to the encapsulating material, the dicyclopentadiene phenol-type epoxy resin is added to the resin part, the silane coupling agent is applied to activating the filler in combination with the multifunctional diluent, and the cycloaliphatic epoxy resin is added to the curing part, and therefore, the finally obtained encapsulating material has the characteristics of high temperature resistance and high humidity resistance. The encapsulating material is used for preparing a capacitor, and consequently, the capacitor is enabled to be stable in capacity, small in change tolerance and longer in service life under the conditions of a high temperature, high humidity, and running with load after being powered on.

Description

technical field [0001] The invention relates to the technical field of electronic materials, in particular to an epoxy resin potting material and its preparation method and application. Background technique [0002] In capacitors, epoxy resin is often used for potting, but in actual use, there will be a significant drop in capacitance after the potted capacitor is stored for several months under normal conditions, which will affect the service life. This phenomenon is not only related to the manufacturing process and material selection of the capacitor core, but also directly related to the epoxy resin potted in it, especially in small-sized capacitors. [0003] Therefore, in order to ensure that the capacitors prepared by potting have better stability, capacitor manufacturers often use the double 85 test to evaluate the magnitude of the capacity drop of the product during use. The specific method of the test is: add 1.1 times the rated voltage to the capacitor obtained by ...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J11/06C09J11/04
Inventor 李长莲
Owner GUANGZHOU POCHELY NEW MATERIAL TECH CO LTD
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