221 results about "Potting" patented technology

Components for use in a temperature controlled heatable object are provided in which a temperature sensor is connected to a transmitter such as a Radio Frequency Identification (RFID) tag. The RFID tag is encased in a protective overmolding and connected to the temperature sensor via a mineral insulated cable. An end cap containing a potting material (such as silicone or ceramic) is placed over the temperature sensor and laser welded to a sheathing of the mineral insulated cable. A potting material for use in a heatable object is also provided comprising a silicone-based material that is modified by adding bauxite to increase thermal conductivity.

A robust optoelectronic transceiver module which is quick, easy, and inexpensive to manufacture. The transceiver module has a main housing which consists of a potting box with potting material inserted therein. In addition, a circuit board is encased by the potting material. The circuit board has an optical subassembly mounted thereon. The optical subassembly extends outside of the potting box through a recess. Correspondingly, a recess cover is provided for forming a liquid fight seal between the recess cover, the potting box, and the optical subassembly.

The invention relates to a high-transparency high-deep-layer-curing-speed double-component condensed organic silicon potting adhesive which comprises a component A and a component B, wherein the component A comprises hydroxyl-terminated polydimethylsiloxane and low-viscosity hydroxy silicon oil; and the component B comprises a crosslinking agent, a chain extender, a coupling agent and a catalyst. Compared with the existing condensed technique, no water or water-containing substance is added into the two components, the low-viscosity hydroxy silicon oil is condensed and dehydrated under the action of the catalyst when the components A and B are mixed, and the water participates into the reaction between the crosslinking agent and hydroxyl-terminated polydimethylsiloxane, thereby finally forming the crosslinked body; and therefore, the potting adhesive provided by the invention avoids transparency decrease due to the addition of the water or water-containing substance, the light transmittance is up to 90% above, and meanwhile, the water molecules which are generated and uniformly released in the A and B reaction process can enable the quick deep layer curing of the whole system. The potting adhesive provided by the invention is applicable to potting electronic components, is especially suitable for integral potting of LED (light-emitting diode) lamp bars, and has higher assembly efficiency.

A double encapsulated semiconductor package and manufacturing methods of forming the same are provided. Embodiments of the semiconductor package include a complex chip having normal and random pads formed on its active surface, the complex chip being attached to a first surface of a wiring substrate. First and second windows are formed in the wiring substrate to respectively expose the normal and random pads, and to allow bonding wires to be connected to the normal and random pads with the wiring substrate. A first resin encapsulation portion is formed by a molding method in the first window and a second resin encapsulation portion is formed by a potting method in the second window.

Addition-crosslinking silicone resin compositions containing selected high functionality addition curable organosilicon compounds can be cured at relatively low temperatures and can produce highly transparent, hard polymers which are suitable for many uses, in particular for the potting or embedding of electrical componts such as LEDs.

Method and apparatus for potting an electronic device. The apparatus comprises an enclosure having a first inner volume with the electronic device disposed therein; a fill control element disposed within the first inner volume, wherein a second inner volume of the fill control element is fluidly coupled to the first inner volume; and a sealant disposed within a remaining portion of the first inner volume, the remaining portion not occupied by the electronic device or the fill control element, wherein air is trapped within at least a first portion of the second inner volume.

Method and apparatus for potting an electronic device. The apparatus comprises an enclosure having a first inner volume with the electronic device disposed therein; a fill control element disposed within the first inner volume, wherein a second inner volume of the fill control element is fluidly coupled to the first inner volume; and a sealant disposed within a remaining portion of the first inner volume, the remaining portion not occupied by the electronic device or the fill control element, wherein air is trapped within at least a first portion of the second inner volume.

An enhanced multiobject potting fixture for exposure to a curing modality that sets an adhesive includes a fixture housing supporting a plurality of objects, the fixture housing having a wall defining a plurality of bonding wells with each the bonding well receiving a first portion of one of the objects, each the bonding well including an aperture in the wall proximate the first portion wherein each bonding well includes a target zone for selective cure of the adhesive to inhibit the adhesive from exiting the aperture; and a fixture enhancement structure integrated into the wall concentrating the curing modality in each the target zone.

A liquid organopolysiloxane composition is provided. This composition can readily form a cured article having a matted surface without requiring separate step such as mechanical surface roughening, and this composition is well adapted for use as a potting material or a coating material in electric and electronic components such as LED. An article having a matted surface produced by curing such composition is also provided. The liquid organopolysiloxane composition for matting comprises (A) 100 parts by weight of a thermosetting liquid organopolysiloxane composition, and (B) 0.1 to 100 parts by weight of a hollow filler having a melting point of at least 150° C., a specific weight of 0.01 to 0.8, and a particle size of up to 200 μm. The composition has a viscosity at room temperature of 100 to 100,000 mPa·s. The resulting cured article has a surface glossiness of up to 40.

Addition-crosslinking silicone resin compositions containing selected high functionality addition curable organosilicon compounds can be cured at relatively low temperatures and can produce highly transparent, hard polymers which are suitable for many uses, in particular for the potting or embedding of electrical componts such as LEDs.

A method to construct a high current electronic device such as an inductor or a transformer with a single or multi-layer PCB with split traces and / or laminated bus bars and a high current electronic device built according to these methods. Traces are set-up with cross-overs to ensure the length of all traces is equal to maintain good current sharing. Then, PCBs or bus bars are stacked to provide the turns required for the inductor. Cooling plates are provided to cool the structure which is in turn encapsulated in a potting material.

Method and apparatus using a retention arrangement with a potting enclosure for holding a plurality of probes by their retention portions, the probes being of the type having contacting tips for establishing electrical contact with pads or bumps of a device under test (DUT) to perform an electrical test. The retention arrangement has a top plate with top openings for the probes, a bottom plate with bottom openings for the probes, the plates being preferably made of ceramic with laser-machined openings, and a potting enclosure between the plates for admitting a potting agent that upon curing pots the retaining portions of the probes. In some embodiments a spacer is positioned between the top and bottom plates for defining the potting enclosure. Alternatively, the retention arrangement has intermediate plates located in the potting enclosure and having probe guiding openings to guide the probes.

Electrical circuit assemblies flood coated with polymeric flood coat compositions as described or exemplified herein are provided. The flood coat composition is characterized as having a sufficient gel time and thixotropic index as to substantially cover or encapsulate the electrical circuit assembly as a fixed mass upon cure such that the thickness of the polymeric coating on surfaces horizontal to the assembly is from 20 mils to 75 mils, and the thickness on surfaces vertical to the assembly is from 4 mils to 20 mils. Such flood coated assemblies and devices containing same are advantageous over conventional potting materials or conformal coatings because they require less material thereby reducing weight and cost, and they are able to withstand extreme environmental stresses such as from temperature and / or vibrations.

The invention relates to a bonding and potting technology method for an aerial integrated motor, wherein the method covers a bonding method, preparation of a potting material for an elastic film, a potting die and a potting method. According to the invention, an elastic film is employed as a carrier and a characteristic of shape expansion by squeezing is utilized, so that an end commutator is isolated from an adhesive and a potting material and it can be ensured that there is no superfluity at the surface of the commutator after the bonding and potting processing; meanwhile, an axiality after the potting processing can also be ensured. Besides, the elastic film comprises the following components according to mass percentage: 100% of GN 521 raw material; 100% of a GN 521 vulcanizing agent; and 10% to 50% of a filler. According to the invention, bonding and potting production and processing problems of an aerial integrated motor are solved and a purpose that a circularity of a commutator meets a requirement after the bonding and potting processing of the aerial integrated motor can be achieved; meanwhile, an effect that the surface of the commutator on the winding is free of gel after the bonding and potting processing is realized; and a defect of a circularity deviation of an inserted motor can be overcome.

A housing (60) has two side walls (67) and a covering wall (66) that define a U-shaped channel for covering terminal fittings (20). The housing (60) is mounted on a printed-circuit board (90) so that the U-shaped channel and the circuit board (90) define a bag-shaped space (70). The U-shaped channel of the housing (60) and the circuit board (90) are accommodated in a case (30) so that the bag-shaped space (70) faces down. A potting material (40) then is introduced into the case (30). Air vents (73) are formed through the covering wall (66) and provide communication between the bag-shaped space (70) and an outer surface of the covering wall (66). Thus, air trapped in the bag-shaped space (70) is discharged to the outside through the air vents (73).

The invention provides a vacuum potting process. The vacuum potting process includes following steps: performing demoulding processing on a clamp; assembling the clamp; preheating a to-be-potted device; performing multi-segment potting in a vacuum environment; performing curing processing on the potted device; and performing demoulding on the device after completion of potting. According to the vacuum potting process, the device is fully preheated, the viscosity of glue potted into the device can be rapidly reduced, infiltration is guaranteed, and the influence of moisture on the potting effect is avoided; and the multi-segment potting process is performed in the vacuum environment, air in gaps between components in the device can be completely eliminated, the infiltration of the glue intothe gaps can be guaranteed, and bubbles or gaps can be avoided.

The invention discloses an internal temperature on-line testing method of a zinc oxide lightning protector with 6-35 KV high-voltage capacitors connected in parallel, which uses a thermistor PTC embedded into the lightning protector to measure the heating condition of a valve plate inside the zinc oxide lightning protector, thereby judging the running condition of the zinc oxide valve plate. The method comprises the improvement on the structure of a sleeve inside the zinc oxide lightning protector and comprises the following steps: making a groove on one side of the sleeve; after installing the valve plate, pouring heat-conducting potting adhesive into the groove, embedding a PTC resistor into the surface of the adhesive, leading the wire of the resistor out from the bottommost part of thelightning protector, and meanwhile, connecting high-voltage capacitors in parallel on the exterior of the sleeve and the zinc oxide valve plate to improve the performance of the zinc oxide lightningprotector; and after the potting adhesive is dried, carrying out die casting. For the leading-out wire of each PTC resistor, a 5V / 5V isolation transformer, a rectification circuit and a light emittingdiode constitute a loop; when the PTC resistor senses a temperature change, the resistance value changes, thus, the current flowing through the loop changes, and the light intensity of the light emitting diode changes; the light signal is transmitted to a central processor through an optical cable and restored into an electric signal through a photosensitive tube to complete the photoelectric isolation and collect the heating condition inside the lightning protector.

The invention relates to a structure of a high-thermal-reliability multi-unit power integration module (PIM) and a processing technology thereof. The structure comprises a silicon-based IGBT chip, a silicon carbide Schottky barrier diode chip, a silicon-based diode chip, a copper / graphene nanosheet (Cu / GN) heterogeneous thin film, graphene-based packaging resin, a copper-clad ceramic lining plate, a solder layer, a nano-silver conductive adhesive, a bonding wire, a copper gasket, a plastic packaging shell, an aluminum silicon carbide substrate, heat-conducting silicone grease and a radiator. The Cu / GN heterogeneous thin film is adopted to replace a local bonding wire, local heat of a chopper circuit IGBT chip in a high-power PIM is dissipated through an upper heat conduction path and a lower heat conduction path, and the local hot spot temperature on the chip is reduced; and meanwhile, the graphene is uniformly added into the epoxy resin to serve as a potting material so that the overall thermal resistance of the high-power PIM from a chip to the environment is reduced, and the heat dissipation efficiency is improved.

The invention discloses an encapsulated power supply comprising a main circuit board and a shell, wherein the main circuit board is accommodated in the shell. At least one component is arranged on the main circuit board. An installation gap is reserved between the components and the main circuit board. The encapsulated power supply further comprises a sealing material and a potting material. The sealing material fills a gap between the surface of the main circuit board and the side surfaces of the components or covers exposed electrical units of the components to form a sealing layer provided with a sealed space. The shell is provided with a first glue pouring hole. The potting material fills the shell through the first glue pouring hole and covers the main circuit board and the sealing material. The sealing material adopted in the encapsulated power supply of the invention can stop the potting material from flowing or penetrating into the components, so that the electrical characteristic of the components is ensured, and the stability and reliability of the encapsulated power supply are improved.

A method of manufacturing an electronic component assembly is disclosed comprising disposing an electronic component in a housing such that there is at least one void space between the component and the housing, disposing non-conductive microspheres in the void space to substantially fill the void space, and disposing a fluid potting material in the housing and hardening or curing the potting material to pot the component in the housing. An assembly is also disclosed comprising a housing, an electronic component disposed in the housing such that there is at least one space between the component and the housing and the space is substantially filled with non-conductive microspheres, and a material that potting the first electronic component in the housing. The invention enables an electronic component in a housing with a space left between the housing to be potted with reduced formation of bubbles in the hardened potting material.

The invention discloses a miniaturized MEMS capacitive composite resonance type vector hydrophone, and belongs to the technical field of underwater acoustic signal detection. The vector hydrophone comprises an MEMS capacitive accelerometer, a fixed core, a vertical suspension rod, a piezoelectric ceramic ring, an acoustic transmission sealing shell, and a conical spiral spring. The MEMS capacitiveacceleration sensor is orthogonally arranged in the fixed core; the vertical suspension rod penetrates through the whole fixed core; the piezoelectric ceramic ring sleeves the outside of the fixed core; and the acoustic transmission sealing shell covers the piezoelectric ceramic ring through a potting process. The conical spiral spring is connected with the vertical suspension rod, and the hydrophone is hung on a fixing support for use. The size of the hydrophone is reduced, sound pressure signals and vibration velocity signals at the same underwater position can be detected, the accuracy ofsignal detection is improved, and the hydrophone is simple in structure, good in consistency and high in reliability.

The invention relates to a device, which includes a substrate for carrying an electrical circuit, a housing for enclosing the substrate, and a potting compound accommodated in the housing, which potting compound at least partially encloses the substrate. The potting compound can adhere to the housing. Furthermore, the device has a wall, from which the potting compound can detach.

The invention discloses a light-emitting diode (LED) drive power supply which comprises a shell body, a PCBA component arranged in the shell body and a wire which is led out from the shell body to the outside of the shell body. Two ends of the shell body form openings and respectively provided with a first end cover and a second end cover. Potting adhesive is poured into two ends in the shell body. A hollow interlayer without potting adhesive is reserved between the potting adhesive at two ends. The invention further discloses a pouring method of the LED drive power supply. The pouring method of the LED drive power supply includes the following steps. Firstly, a first end of the shell body is sealed, secondly, the potting adhesive is poured for the first time and thirdly, after the potting adhesive poured for the first time is solidified, second pouring is performed and a second end of the shell body is sealed. Fourthly, the shell body is inverted. The potting adhesive is poured into the two ends in the shell body for two times and the hollow interlayer is reserved in the middle of the shell body, production technology is simple, good airtight performance is achieved, potting adhesive consumption is reduced, the whole weight of the drive power supply is reduced, manufacturing cost is reduced and meanwhile, tensile strength of the wire is improved and forced detachment is prevented.

The invention relates to the field of design and manufacturing techniques of LED power sources and particularly discloses an LED power source. The LED power source comprises a power source shell, end covers, a power source assembly and filling glue. The two ends of the power source shell are covered with the end covers respectively. The power source assembly is arranged inside the power source shell, and the power source shell is filled with the filling glue. By the adoption of the technical scheme, the power source shell can be filled with the filling glue with a low expansion coefficient, the combined portion of the power source shell is prevented from being squeezed, and the waterproof performance is maintained; meanwhile, the power source assembly is protected against squeeze damage, the service life is prolonged, the filling glue is equivalent to diluted heat conductive potting adhesive, and the production cost is reduced.

A method of encapsulating a printed circuit board of a motor controller with a potting material includes inserting the printed circuit board into a recess formed in a base portion of an encapsulation assembly such that a bottom surface of the printed circuit board is spaced from a surface of the recess. The method also includes coupling a cover portion of the encapsulation assembly to the base portion to define a cavity therebetween. The method further includes injecting the potting material into the cavity through at least one injection port defined in at least one of the base portion and the cover portion such that the printed circuit board is at least partially coated in the potting material.

The invention relates to a silicon rubber for room-temperature quick-curing potting and a preparation method thereof, belonging to the technical field of organosilicon sealants. The silicon rubber comprises 71-80 parts of 107 liquid silicon rubber, 25-35 parts of methyl triacetoxime silane, 8-12 parts of ethyl orthosilicate, 4-6 parts of butyl tin dilaurate, 0.3-2 parts of additive KH-550 and 10-15 parts of fumed silica. The silicon rubber can keep elasticity for a long time within a wide temperature range, and has excellent chemical stability and water resistance. The silicon rubber is especially suitable for application occasions with requirements for deep curing, has higher curing speed at room temperature, and is suitable for potting electronic products.

The invention provides a potting battery pack module and a potting method. The potting battery pack module comprises two battery cell supports which have a same structure and are connected in an involution manner. The battery cell supports comprise a first battery cell support and a second battery cell support. The first battery cell support and the second battery cell support are connected in theinvolution manner along a length direction of a battery cell. A convex edge extending towards an inner side is arranged on an edge of each battery cell support. A plurality of battery cell cavities and a plurality of aluminum tube cavities are arranged on the first battery cell support, and the aluminum tube cavities are arranged between the adjacent battery cell cavities. Problems of a complex battery pack packaging process and battery pack thermal runaway prevention are effectively solved. A glue is poured into the module so that the battery cell is fullly contacted except for a positive electrode and a negative electrode, the battery cell is axially wrapped in an insulating glue, and the axial direction of the battery cell is in full contact with the insulating glue to form heat insulation and insulation layers.

Addition-crosslinkable silicone resin compositions containing a branched organopolysiloxane bearing each of Si—H groups, alkenyl groups, and aryl groups, and also containing blocks of linear organopolysiloxane free of Si—H and alkenyl groups with a chain length of at least three siloxy groups, and further bearing at least one aryl group, serve as excellent potting compositions for electronic devices, particularly LEDs, with high refractive index and optical transmittance, and wide processing latitude.

The invention discloses a storage device for resisting large overload impact and a preparation method thereof, a memory device include a memory board, an inner housing, a first potting glue, second potting glue, outer shell, inner cover plate and outer cover plate, The inner shell is a hollow shell, which forms a first hollow cavity after being covered by the inner cover plate, the storage plate is accommodated in the first hollow cavity, and the first potting colloid is filled in the first hollow cavity and filled with the remaining voids of the first hollow cavity, so as to wrap the storageplate tightly; The outer shell is a hollow shell, which is sealed by the outer cover plate to form a second hollow cavity, the inner shell and the inner cover plate covering the storage plate are integrally accommodated in the second hollow cavity, as that second potting glue is filled in the second hollow cavity and filled with the remaining voids of the second hollow cavity, the inn shell and the inner cover plate are integrally wrapped tightly, the impact resistance of the storage device is greatly improved, and the reliability of the storage device can still be guaranteed in a high overload impact environment. The second potting glue is arranged in the second hollow cavity and filled with the remaining voids of the second hollow cavity, so that the inner shell and the inner cover plateare integrally wrapped tightly.

The invention discloses a stator potting type hydrogen circulating pump and a manufacturing method thereof. The stator potting type hydrogen circulating pump comprises a motor part, wherein the motor part comprises a shell, a partition plate is arranged in the shell, the shell is divided into a motor cavity and a controller cavity by the partition plate, and the outer side of a stator and the outer side of a temperature sensor are coated with potting glue; a controller part, wherein the controller part comprises a circuit board mounted in a controller cavity, an end cover is mounted on the side, away from the partition plate, of the controller cavity, a communicating hole is formed in the partition plate, a threading base is mounted in the communicating hole, and a three-phase line of the stator penetrates through the threading base to be connected with the circuit board; and a pressurizer part, wherein the pressurizer part comprises an impeller mounted on an output shaft of the rotor on the outer side of a second bearing seat, and a flow channel cover plate is mounted on the outer side of the impeller. It is convenient and fast to wire, and the assembling efficiency is improved; the sealing performance is better, hydrogen leakage points are reduced, the problem of hydrogen leakage is basically and thoroughly solved, the overall size is reduced, the space is saved, and the overall structure is more compact.