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Encapsulated power supply

A technology of glue filling and power supply, which is applied in the direction of sealed casings, can solve problems such as changes, poor component properties, and fracture distances, and achieve the effects of avoiding damage and enhancing stability and reliability

Active Publication Date: 2015-07-29
DELTA ELECTRONICS (SHANGHAI) CO LTD
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The potting power supply will have a large temperature change during the preparation process and the use process. Due to the different thermal expansion coefficients of the potting material and the components, the thermal expansion of the potting material after curing will cause the solder feet of the components to break or the distance between the components Changes and other conditions, which lead to poor properties or failure of components

Method used

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Embodiment Construction

[0036] Typical embodiments embodying the features and advantages of the present invention will be described in detail in the following description. It should be understood that the present invention is capable of various changes in different embodiments without departing from the scope of the present invention, and that the description and drawings therein are illustrative in nature and not limiting. this invention.

[0037] A glue potting power supply provided by the present invention includes a casing and a main circuit board accommodated in the casing. At least one component is arranged on the main circuit board, and there is an installation gap between the component and the main circuit board. The glue filling power supply also includes a sealing material and a glue filling material, wherein the sealing material fills the gap between the surface of the main circuit board and the side surface of the component to form a sealing layer, and the sealing layer is connected to t...

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Abstract

The invention discloses an encapsulated power supply comprising a main circuit board and a shell, wherein the main circuit board is accommodated in the shell. At least one component is arranged on the main circuit board. An installation gap is reserved between the components and the main circuit board. The encapsulated power supply further comprises a sealing material and a potting material. The sealing material fills a gap between the surface of the main circuit board and the side surfaces of the components or covers exposed electrical units of the components to form a sealing layer provided with a sealed space. The shell is provided with a first glue pouring hole. The potting material fills the shell through the first glue pouring hole and covers the main circuit board and the sealing material. The sealing material adopted in the encapsulated power supply of the invention can stop the potting material from flowing or penetrating into the components, so that the electrical characteristic of the components is ensured, and the stability and reliability of the encapsulated power supply are improved.

Description

technical field [0001] The invention relates to a glue-filling power supply, in particular to a glue-filling power supply free from the influence of temperature changes. Background technique [0002] Currently used power modules need to be dust-proof and moisture-proof so as not to affect their functions. In order to effectively protect the power module from dust and moisture, it needs to be sealed with a casing and filled with glue to isolate the internal circuit from the external environment, thereby avoiding direct contact between the circuit and the external environment. The power modules prepared by the above glue filling process are collectively referred to as glue filling power supplies. Its structure is as figure 1 and figure 2 shown, where figure 1 It is an exploded view of the structure of the glue filling power supply, figure 2 It is the encapsulation diagram of the potting power supply. Such as figure 1 and figure 2 As shown, the glue filling power sup...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K5/06
Inventor 陈绍军
Owner DELTA ELECTRONICS (SHANGHAI) CO LTD
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