2784results about "Printed circuit board receptacles" patented technology

A removable cartridge containing circuit components to be used with a distributed DC power harvesting system. Various components of the circuits, such as capacitors or transistors, may be included in removable cartridges that may be plugged into the overall circuit.

The metallic case of a power conversion apparatus includes a casing having a side wall, as well as an upper case and a lower case, a first area being formed between a cooling jacket provided at the inner periphery of the side wall and the lower case, the metal base plate dividing the first area between the cooling jacket and the upper case into a lower side second area and an upper side third area, first and second power modules being fastened to a top surface and a capacitor module being provided in the first area, driving circuits that drive inverter circuits of the power modules respectively being provided in the second area, and a control circuit that controls the driver circuits being provided in the third area.

A servomotor controller provides nut runner and other functions in a set of stackable modules. Extended-function modules can be added into and removed from the stack as needed. Destacking of closely spaced, wall-mounted controllers can be performed without demounting. Module assemblies are dripproof. Multiple sizes of nutrunner driver electronics and multiple keyboard and display options can be selected. A reprogrammable central processor can identify newly installed or removed features within a controller and reconfigure itself F accordingly. Stackable modules include Ethernet(®, multiple-bit I/O, and proprietary interfaces for many industries. The other modules communicate with the processor module via a backplaneless bus architecture. The central processor supports master/satellite group operation, whereby one controller unit can command multiple others, and whereby a higher-level system can command multiple controllers or multiple master/satellite controller groups.

According to an embodiment of the present disclosure, an electronic device may comprise a first housing including a first surface and a second surface facing in a direction opposite the first surface, a second housing including a third surface and a fourth surface facing in a direction opposite the third surface, a hinge disposed between the first housing and the second housing configured to provide rotational motion between the first housing and the second housing, and a flexible display disposed from the first surface of the first housing across the hinge to the third surface of the second housing, at least part of the flexible display configured to form a curved surface as the hinge structure is folded, wherein the hinge may include dual-axis hinges configured to provide a first rotational axis allowing the first housing to rotate about the second housing and a second rotational axis allowing the second housing to rotate about the first housing and slides coupled with the first housing and the second housing and configured to provide sliding motion perpendicular to a lengthwise direction of the first housing and the second housing.

A very small computer memory card is densely packed with a large number of flash EEPROM integrated circuit chips. A computer memory system provides for the ability to removably connect one or more of such cards with a common controller circuit that interfaces between the memory cards and a standard computer system bus. Alternately, each card can be provided with the necessary controller circuitry and thus is connectable directly to the computer system bus. An electronic system is described for a memory system and its controller within a single memory card. In a preferred physical arrangement, the cards utilize a main circuit board with a plurality of sub-boards attached thereto on both sides, each sub-board carrying several integrated circuit chips.

A multiphase inverter has two card shaped arm modules facing each other along a stacking direction. Each module has semiconductor switching elements disposed along an element arranging direction substantially perpendicular to the stacking direction, a common heat sink plate connecting direct current electrodes of the elements with one of terminals of the power source, and phase heat sink plates connecting respective alternating current electrodes of the elements with respective multiphase terminals of a motor. The elements of each module correspond to all phases of an alternating current. Each common heat sink plate forms a principal surface of the corresponding module, and the phase heat sink plates of each module forms another principal surface. The principal surfaces of each module face each other along the stacking direction.

A power module constructs a pressurizing tool by laminating an elastic member as well as a DC positive-side wiring member and DC negative-side wiring member in which currents flow in opposite directions. The pressurizing tool presses a first fixing tool, and then the first fixing tool presses semiconductor equipment. The semiconductor equipment is fixed to a heat dissipating member with its heat dissipating surface brought into surface contact with side wall surfaces of the heat dissipating member. The power module can enhance heat dissipation between a heat dissipating member and semiconductor equipment, and enables the semiconductor equipment to be fixed to the heat dissipating member without adding other components to the power module.

Disclosed herein is a capacitor mounting type inverter unit having a cooling block, an inverter including a plurality of phases of switching circuits provided on the cooling block, and a smoothing capacitor. The inverter unit includes a cover having a first recess for accommodating the inverter and a second recess for accommodating the smoothing capacitor. The second recess has a depth larger than that of the first recess. The second recess is filled with resin in the condition where the smoothing capacitor is accommodated in the second recess.

The present invention relates to a heat dissipation structure board and a module using this heat dissipation structure used for purpose required of high reliability such as a hybrid vehicle or an electric vehicle and to a method of manufacturing the heat dissipation structure. A resin structure is disposed on a lead frame constituting a heat dissipation board and an odd-shaped electronic component or the like mounted on this lead frame or the like to cover up the lead frame and the odd-shaped electronic component or the like, and this resin structure is fixed to a metal plate, a chassis of a device and the like to constitute the heat dissipation structure board as a whole, whereby fixing strengths of fixing the lead frame and the odd-shaped electronic component or the like, a bonding strength at an interface between the lead frame and the heat transfer layer and the like can be reinforced.

A power converter which can attain a reliable electric connection with electrodes of a power module by facilitating positioning of conductors connected to the electrodes of the power module. The power converter includes the power module having the plurality of electrodes in the form of plate-shaped conductors within a casing having a lid, and also includes a plurality of plate-shaped conductors connected to the electrodes of the power module. Male screws are embedded in ones of the electrodes of the power module provided at least on the side of the lid to be projected therefrom, the plate-shaped conductors connected to the electrodes having the male screws are formed therein with holes at locations corresponding to the male screws, the male screws being inserted in the corresponding holes, and electrically connected with the electrodes with nuts fastened to the male screws.

It is an object of the present invention to provide a retention module, a heat sink and electronic apparatus for effectively the heat from a chip set. The retention module for a CPU is provided with a heat sink for the chip set.

A capacitor bank includes a laminated bus bar having a high potential conductive layer and a low potential conductive layer disposed in close proximity at opposing surfaces of an intervening insulation layer. The bank also includes a plurality of bus capacitors electrically connected to the laminated bus bar. The laminated bus bar and the bus capacitors having a combined inductance sufficiently low such that the bus capacitors are electrically connected effectively in parallel with the laminated bus bar.

An avionics equipment carrier system for slide-in modules with data processing, data transmitting, data storage or data displaying devices, such as for example electronics printed circuit boards, network components, storage devices, display devices and the like, or power supply devices, includes a housing, at least one module rack for accommodating the slide-in modules and at least one backplane board with Ethernet connection architecture. When the dimensions of the housing comply with ARINC standards, and the housing is arranged for installation in an avionics module rack as a quick-mount housing, and any desired circuit boards of a specific standard format can be used in the slide-in modules which are designed as quick-mount modules.

In a power drive unit having power modules (three-phase inverter circuits) connected to a control circuit board, bus bars extending from the power modules and a current sensor each installed near the bus bars and including a sensing element that detects currents outputted from the bus bars, there are provided a sensor board on which the sensing element is mounted, and lead pins each connecting the sensor board to the control circuit board and having a bowed shape whose one end is connected to the sensor board and other end once extends away from the circuit board and then turns back toward the circuit board. With this, the circuit board and current sensors can be connected through the lead pins without increasing the distance therebetween and stress produced in the lead pins can be alleviated, thereby enabling the unit to be minimized in size and utilized in a harsh service environment.

A power converter for an engine generator includes an insulative support that receives and supports circuit components for converting incoming AC power to desired power, such as power suitable for a welding application. One or more rectifier modules are provided that are received and supported by the support. Three such modules may be provided for receiving three phase power from a generator. DC power from the rectifier module is applied to DC bus plates. The plates may be coupled to capacitors. A power conversion circuit, such as a buck converter, is coupled to the DC bus plates to convert the DC power to output power.