High-transparency high-deep-layer-curing-speed double-component condensed organic silicon potting adhesive
A technology of silicone potting glue and deep curing, applied in adhesives, electrical components, circuits, etc., can solve the problems of affecting the appearance of components, poor compatibility, troublesome reinforcing agent synthesis process, etc., and achieve high assembly efficiency and compatibility Good performance, simple and feasible production process
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Embodiment 1
[0042] Mix 5000cps hydroxyl-terminated polydimethylsiloxane and hydroxyl silicone oil with a hydroxyl content of 6% in a weight ratio of 100:2, stir for 1 hour, seal and let it stand for later use, which is component A;
[0043] Mix ethyl polysilicate, dimethyldiethoxysilane, γ-aminopropyltriethoxysilane, and dibutyltin dilaurate in a weight ratio of 25:40:10:15, and stir for 1 hour , sealed, let it stand for at least 1 hour, and set aside, that is, component B.
[0044] Put 100g of component A and 10g of component B into a plastic cup, stir with smooth and clean iron chopsticks for 2 minutes, then vacuum defoam for 3 minutes, and quickly fill it into a LED light bar and a LED module, and place the sample In a constant temperature and humidity room at 25±3°C, RH55±5%, it will be fully cured after 3 hours, with a light transmittance of 95%.
Embodiment 2
[0046] Mix 1500cps hydroxyl-terminated polydimethylsiloxane and hydroxyl silicone oil with a hydroxyl content of 8% in a weight ratio of 100:3, stir for 1 hour, seal it and let it stand for later use, which is component A;
[0047]Mix ethyl silicate, dimethyldimethoxysilane, N-β-aminoethyl-γ-aminopropyltrimethoxysilane, and dibutyltin diacetate in a weight ratio of 30:50:5:2 , after stirring for 1 hour, seal it, let it stand for at least 1 hour, and set it aside, that is, component B.
[0048] Put 100g of component A and 10g of component B into a plastic cup, stir with smooth and clean iron chopsticks for 2 minutes, then vacuum defoam for 3 minutes, and quickly fill it into a LED light bar and a LED module, and place the sample In a constant temperature and humidity room at 25±3°C, RH55±5%, it will be fully cured after 6 hours, with a light transmittance of 94%.
Embodiment 3
[0050] Mix 500cps hydroxyl-terminated polydimethylsiloxane, 6000cps hydroxyl-terminated polydimethylsiloxane, and hydroxyl silicone oil with a hydroxyl content of 10% in a weight ratio of 20:80:8, stir for 1 hour, and seal Let it stand for later use, which is the A component;
[0051] Mix methyltrimethoxysilane, dimethyldiethoxysilane, γ-chloropropyltriethoxysilane and dibutyltin diacetate in a weight ratio of 10:80:15:6, and stir for 1 hour , sealed, let it stand for at least 1 hour, and set aside, that is, component B.
[0052] Put 100g of component A and 10g of component B into a plastic cup, stir with smooth and clean iron chopsticks for 2 minutes, then vacuum defoam for 3 minutes, and quickly fill it into a LED light bar and a LED module, and place the sample In a constant temperature and humidity room at 25±3°C, RH55±5%, it will be fully cured after 5 hours, with a light transmittance of 96%.
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