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Epoxy resin composition for printed circuit copper-clad plate

An epoxy resin, printed circuit technology, applied in printed circuit parts, circuit substrate materials, layered products, etc., can solve the problems of harsh resin Tg and heat resistance, large thermal expansion coefficient, and large performance drop, and achieve excellent Heat resistance, high glass transition temperature, small effect of Z-axis thermal expansion coefficient

Active Publication Date: 2010-10-20
EPOXY BASE ELECTRONICS MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The Tg of ordinary FR-4 sheet is 130-140°C. It has the disadvantages of large thermal expansion coefficient in the Z-axis direction, low heat resistance, easy to produce resin greasy stains during drilling, large shrinkage during processing, and unfavorable alignment. However, based on the resin structure, the properties of the board will drop greatly at high temperatures exceeding Tg, which limits its use in high temperature environments; coupled with the change of lead-free tin furnace, the Tg and heat resistance of the resin will be more severe. harsh

Method used

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  • Epoxy resin composition for printed circuit copper-clad plate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] (1) Preparation of butanone solution containing modified epoxy resin:

[0043] Add 230 parts of bisphenol A epoxy resin, 64 parts of brominated bisphenol epoxy resin, 82 parts of novolac epoxy resin and 0.7 part of 30% tetramethylammonium chloride methanol solution into the reaction tank and mix well and heated. When the temperature was 90°C, 38 parts of isocyanate were added at one time, and reacted at 165°C for 3 hours. Cool down to 130°C again, add 129 parts of o-cresol novolac epoxy resin and 219 parts of brominated bisphenol type epoxy resin to mix, add methyl ethyl ketone to dissolve into a modified epoxy resin containing 75% solid content butanone solution. The above-mentioned consumptions are all parts by weight.

[0044] The epoxy resin mixture in the butanone solution containing modified epoxy resin has the following physical parameters:

[0045] epoxy equivalent

(g / eq)

viscosity

(cps / 25℃)

Hydrolyzable Chlorine

(ppm)

bro...

Embodiment 2

[0052] (1) Preparation of butanone solution containing modified epoxy resin:

[0053] 230 parts of bisphenol A epoxy resin, 55 parts of brominated bisphenol type epoxy resin, 85 parts of novolac epoxy resin and 0.6 part of 30% tetramethylammonium chloride methanol solution are added to the reaction tank and mixed. heating. When the temperature was 90°C, 35 parts of isocyanate was added at one time, and reacted at 165°C for 3 hours. Cool down to 130°C again, add 132 parts of o-cresol novolac epoxy resin and 220 parts of brominated bisphenol type epoxy resin to mix, add methyl ethyl ketone to dissolve into a butylated solution of modified epoxy resin with a solid content of 75%. Ketone solution. The above-mentioned consumptions are all parts by weight.

[0054] The physical parameters of the epoxy resin mixture in the butanone solution containing the modified epoxy resin are the same as in Example 1.

[0055] (2) Preparation of epoxy resin composition:

[0056] Add inorgani...

Embodiment 3

[0062] (1) Preparation of butanone solution containing modified epoxy resin:

[0063] Add 40 parts of bisphenol A epoxy resin, 15 parts of brominated bisphenol type epoxy resin and 0.8 part of 30% methanol solution of tetramethylammonium chloride into the reaction tank, mix uniformly and heat. When the temperature was 90°C, 19 parts of tetrabromobisphenol A were added at one time, and reacted at 165°C for 3 hours. Then lower the temperature to 130° C., add 25 parts of o-cresol novolac epoxy resin for mixing, add methyl ethyl ketone to dissolve into a methyl ethyl ketone solution with a solid content of 75% of the modified epoxy resin. The above-mentioned consumptions are all parts by weight.

[0064] The physical parameters of the epoxy resin mixture in the butanone solution containing the modified epoxy resin are the same as in Example 1.

[0065] (2) Preparation of epoxy resin composition:

[0066] With embodiment 2.

[0067] (3) Curing of resin composition and preparati...

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Abstract

The invention discloses an epoxy resin composition for a printed circuit copper-clad plate, which consists of the following components in part by weight: 130 to 140 parts of butane solution containing modified epoxy resin, 60 to 70 parts of composite phenolic aldehyde curing agent or 4.5 to 6.5 parts of dicyandiamide curing agent, 0.02 to 0.04 part of curing catalyst, 30 to 40 parts of solvent and 25 to 30 parts of filler, wherein the butane solution containing the modified epoxy resin is prepared by modifying bis-functional epoxy resin, brominated bisphenol epoxy resin, multi-functional novolac epoxy resin and linear novolac epoxy resin. The epoxy resin composition has the characteristics of low viscosity, easy impregnation, convenient operation, good reactivity and high Tg; and the printed circuit copper-clad plate made of the epoxy resin composition has good reliability and workability, excellent heat resistance and Z-axis thermal expansion coefficient and other comprehensive performance.

Description

technical field [0001] The invention relates to an epoxy resin composition, in particular to an epoxy resin composition for printed circuit copper clad boards. Background technique [0002] With the rapid development of printed circuit technology, it provides a huge development space for the progress of packaging and interconnection technology of electronic products, and also poses unprecedented challenges for the substrate, so the glass transition temperature is increased, the thermal expansion coefficient is reduced, and the market benefits , has become the most frequently encountered keywords in the industry of printed circuits and their substrates in recent years. [0003] Printed circuit technology is not only developing in the direction of short size and high performance. In the process of printing circuit processing, when processing tiny holes, in order to achieve good hole wall quality, faster drilling speed is used, which brings the hole wall Overheating and drilli...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L63/02C08L63/04C08G59/62C08G59/50C08K3/36C08K3/22B32B15/092H05K1/03
Inventor 黄活阳林仁宗吴永光
Owner EPOXY BASE ELECTRONICS MATERIAL
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