Epoxy adhesive for electron component integrated molding technology and preparation method of epoxy adhesive
A technology of epoxy adhesives and electronic components, applied in the direction of online phenolic epoxy resin adhesives, epoxy resin adhesives, adhesives, etc., can solve problems such as the inability to meet the production process requirements of integrated inductors, reliability issues, etc. , to achieve high reliability, high bonding strength, high Tg effect
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Embodiment 1
[0046] Bisphenol A epoxy resin 30 parts
[0047] Biphenyl type epoxy resin 20 parts
[0048] Dicyandiamide 5 parts
[0049] imidazole 2 parts
[0050] 40 parts of N,N-dimethylformamide
[0051] Stabilizer 0.5 parts
[0052] Release agent 2.5 parts
[0053] Preparation:
[0054] Accurately weigh various raw materials according to the proportion of the formula, first add bisphenol A epoxy resin, biphenyl type epoxy resin, N,N-dimethylformamide, stabilizer, and mold release agent into the reaction kettle in turn and stir, wait until After stirring evenly, add dicyandiamide and imidazole, disperse evenly and discharge.
Embodiment 2
[0056] Bisphenol F epoxy resin 35 parts
[0057] Dicyclopentadiene type epoxy resin 15 parts
[0058] DDS 10 copies
[0059] imidazole 2 parts
[0060] 35 parts of N,N-dimethylformamide
[0061] Stabilizer 0.5 parts
[0062] Release agent 2.5 parts
[0063] Preparation:
[0064] Accurately weigh various raw materials according to the proportion of the formula, first add bisphenol F epoxy resin, dicyclopentadiene epoxy resin, N,N-dimethylformamide, stabilizer, and mold release agent into the reaction kettle and stir , after stirring evenly, add DDS and imidazole, disperse evenly and discharge.
[0065] Examples listed in Table 1 and performance test results after curing thereof. The test results show that the epoxy adhesive of the present invention has high body strength, high modulus, high Tg, and high bonding strength, fully meets the requirements of the integral molding process, and has high reliability.
[0066] Table 1
[0067]
[0068]The present invention dev...
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