Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Epoxy adhesive for integral molding technology of electronic components and preparation method thereof

A technology for epoxy adhesives and electronic components, applied in the direction of in-line phenolic epoxy resin adhesives, epoxy resin adhesives, adhesives, etc., can solve the problems of reliability and the inability to meet the production process requirements of integrated inductors. , to achieve the effect of high bonding strength, high reliability and high Tg

Inactive Publication Date: 2016-08-17
TONSAN ADHESIVES INC
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Compared with traditional inductors, integrated inductors have the advantages of smaller size, low noise, low interference, and stable quality. It can be seen that integrated inductors will become the general trend, and its technology is completely different from that of traditional inductors. Traditional inductors are used for The assembled adhesive cannot meet the production process requirements of integrated inductors
[0007] 2. Reliability issues

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Epoxy adhesive for integral molding technology of electronic components and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0046] Bisphenol A epoxy resin 30 parts

[0047] Biphenyl type epoxy resin 20 parts

[0048] Dicyandiamide 5 parts

[0049] imidazole 2 parts

[0050] 40 parts of N,N-dimethylformamide

[0051] Stabilizer 0.5 parts

[0052] Release agent 2.5 parts

[0053] Preparation:

[0054] Accurately weigh various raw materials according to the proportion of the formula, first add bisphenol A epoxy resin, biphenyl type epoxy resin, N,N-dimethylformamide, stabilizer, and mold release agent into the reaction kettle in turn and stir, wait until After stirring evenly, add dicyandiamide and imidazole, disperse evenly and discharge.

Embodiment 2

[0056] Bisphenol F epoxy resin 35 parts

[0057] Dicyclopentadiene type epoxy resin 15 parts

[0058] DDS 10 copies

[0059] imidazole 2 parts

[0060] 35 parts of N,N-dimethylformamide

[0061] Stabilizer 0.5 parts

[0062] Release agent 2.5 parts

[0063] Preparation:

[0064] Accurately weigh various raw materials according to the proportion of the formula, first add bisphenol F epoxy resin, dicyclopentadiene epoxy resin, N,N-dimethylformamide, stabilizer, and mold release agent into the reaction kettle and stir , after stirring evenly, add DDS and imidazole, disperse evenly and discharge.

[0065] Examples listed in Table 1 and performance test results after curing thereof. The test results show that the epoxy adhesive of the present invention has high body strength, high modulus, high Tg, and high bonding strength, fully meets the requirements of the integral molding process, and has high reliability.

[0066] Table 1

[0067]

[0068] The present invention de...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention is an epoxy adhesive used in the integrated molding technology of electronic components and a preparation method thereof. The epoxy adhesive is composed of the following components in parts by weight: 30-70 parts of epoxy resin; 1-70 parts of curing agent 10 parts; accelerator 1-10 parts; solvent 20-40 parts; auxiliary agent 0.1-5.0 parts. Compared with the previous technology, the present invention can meet the requirements of the integral molding process, and better adapt to the different requirements of the new process than traditional adhesives; the adhesive has high body strength, high modulus, high Tg, and high adhesion Strength, with higher reliability. The epoxy adhesive can meet the production process requirements of the integral molding process of electronic components, and has higher reliability.

Description

technical field [0001] The invention relates to an epoxy adhesive and a preparation method thereof. The epoxy adhesive is mainly used in an integral molding process of components represented by integrally formed inductors to improve the production efficiency and stability of the components. Background technique [0002] The emergence of integrally formed electronic components represented by integrally formed inductors is attributed to the development of computer motherboard technology and the development of power supply technology. The main frequency of the CPU is getting higher and higher, so there are high requirements for stable power supply and filtering. The integrated inductor can work for a long time under the condition of high current, and can provide stable power supply for the CPU. As electronic products become smaller and more powerful, electronic components are also developing towards smaller size and higher power. Good material properties and special design mak...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/02C09J163/04C09J163/00C09J11/06
Inventor 王晓颖史伟同李守平
Owner TONSAN ADHESIVES INC
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com