The invention discloses a thermosetting resin composition for an
integrated circuit. The thermosetting resin composition comprises (a) 10-60 parts of an allyl modified bismaleimide resin
prepolymer, (b) 10-40 parts of an anhydride compound, (c) 10-50 parts of benzoxazine resin, (d) 5-50 parts of
epoxy resin, (e) 5-50 parts of a
fire retardant, (f) 0-5 parts of a curing accelerator and (g) 0-35 parts of inorganic stuffing, wherein the number-average molecular weight of the allyl modified bismaleimide resin
prepolymer is 1500-8000 g / mol. The resin composition provided by the invention keeps
high heat resistance and high Tg characteristic of the allyl modified bismaleimide resin
prepolymer, and achieves UL94V-0 level in
halogen-free
flame retardant aspect on the basis of low
phosphorus content, and simultaneously, has low
dielectric constant of the anhydride; and therefore, the resin composition is capable of meeting the requirements of the production process of high-performance printed circuit boards such as a high-density interconnected
integrated circuit package.