2929 results about "Maleimide" patented technology

The present invention concerns a delivery system comprising a polymer-based nanoparticle; and a linker comprising a first portion non-covalently anchored to said nanoparticle, wherein at least part of said first portion comprises a hydrophobic/lipophilic segment embedded in said nanoparticle; and a second portion comprising a maleimide compound exposed at the outer surface of said nanoparticle. In accordance with one embodiment, the delivery system comprises one or more targeting agents, each covalently bound to said maleimide compound. In accordance with yet another embodiment, the delivery system comprises a drug. A specific example for a linker in accordance with the invention is octadecyl-4-(maleimideomethyl)cyclohexane-carboxylic amide (OMCCA).

The instant invention teaches a method for enabling the formation of a high damping, soft polymer gel. The method includes: reacting a poly(disubstituted ethylene-co-maleimide) polymer with a maleated polyalkylene and an alkyl diamine under substantially dry conditions sufficient to form a polyalkylene grafted poly(disubstituted ethylene-co-maleimide) polymer product; and, dispersing the polyalkylene grafted poly(disubstituted ethylene-co-maleimide) polymer product with an extender oil sufficient to form the gel. The instant invention also contemplates a polymer gel composition, a polymer composition and an article manufactured from the polymer gel composition.

The invention is based on the discovery that compositions containing certain maleimide compounds and aromatic diene compounds are useful as thermosetting resins for the electronic packaging industry. The invention compositions described herein can be cured in a variety of ways, with or without a catalyst. In some embodiments, the well-known “ene” reaction can be used to cure the compositions described herein, and therefore no catalyst is required.

The present invention teaches a method for enabling the formation of a high damping, soft polymer gel. The method includes: reacting a poly(alkyl vinylether-co-maleimide) polymer with a maleated polyalkylene and an alkyl diamine under substantially dry conditions sufficient to form a polyalkylene grafted poly(alkyl vinylether-co-maleimide) polymer product; and, dispersing the polyalkylene grafted poly(alkyl vinylether-co-maleimide) polymer product with an extender oil sufficient to form the gel. The present invention also contemplates a polymer gel composition, a polymer composition and an article manufactured from the polymer gel composition.

A compound of a general structure:wherein:B is selected from the group consisting of derivatives of naturally occurring nitrogenous bases having a C-H group at positions 5 or 8, and derivatives of nitrogenous base-analogs having a C-H group at positions 5 or 8;D is at least one derivatizing group, including hydrogen; andM is a maleimide derivative.

The present invention is based on the discovery that maleimide-substituted polyhedralsilsesquioxane compounds are useful as components in photosensistive resin compositions. These compounds can be readily prepared from available precursors, and are easily incorporated into resin compositions by appropriate formulating conditions. The incorporation of a variety of polyhedralsilsesquioxane frameworks into a photosensitive resin composition is readily accomplished via the crosslinkable maleimide moiety, which crosslinks under a variety of conditions (e.g., chemically and radiatively). Indeed, the compounds described herein contain at least one maleimide moiety attached to a polyhedralsilsesquioxane framework.

The invention is based on the discovery that a remarkable improvement in the performance of maleimide thermosets can be achieved through the incorporation of imide-extended mono-, bis-, or polymaleimide compounds. These imide-extended maleimide compounds are readily prepared by the condensation of appropriate anhydrides with appropriate diamines to give amine terminated compounds. These compounds are then condensed with excess maleic anhydride to yield imide-extended maleimide compounds.

Compositions are disclosed which comprise mixtures of at least one compound selected from silicone elastomers, bis-, tri- or higher polymaleimides and/or bis-, tri- or higher polycitraconimides, and at least one compound selected from p-phenylene-diamine based antiozonants, sulfur compounds capable of accelerating sulfur vulcanization of polymers capable of being crosslinked by sulfur and polysulfide polymers which when compounded into polymers curable by free radical initiators in the presence of free radical initiators permit substantially tack free surface cure of the polymers by decomposition of the free radical initiator in the presence of molecular oxygen. Compositions containing the above ingredients and at least one free radical initiator, curable compositions containing the combination and processes for making and using the compositions are also disclosed.

The present invention is directed to stable protein derivatives, e.g., antibodies, antibody fragments or peptides, with at least one free thiol group coupled to N-acetyl-L-cysteine, N-ethyl-maleimide, or cysteine and the methods of making such derivatives. In addition, stable liquid pharmaceutical formulations comprising such proteins or their derivatives and stable lyophilized pharmaceutical formulations comprising such proteins are provided. The present invention is also directed to a method of making a stable Fab′ fragment of an antibody and a method of controlling vascularization in injured or cancerous tissue comprising applying to the injured tissue one or more doses of the pharmaceutical formulations.

The invention relates to a high weather-proof thermosetting resin composite and prepreg and copper-clad laminate prepared thereby. The high weather-proof thermosetting resin composite comprises the following components in parts by weight: 10-40 parts of allyl compound, 8-80 parts of bismaleimide compound, 0-30 parts of epoxy resin and 0.05-5 parts of catalyst, wherein the molar ratio of allyl compound to bismaleimide compound is 1:2-4. The high weather-proof thermosetting resin composite provided by the invention has higher heat resistance, and the coefficient of thermal expansion (CTE) can be lowered to be below 2.0% to satisfy the requirements of manufacturing high multi-layer PCB. The prepreg prepared by the high weather-proof thermosetting resin composite has simple manufacture, better heat-resistant effect and high heat conductivity. The copper-clad laminate of the invention can be applied to heat-resisting and high multi-layer circuits and has simple manufacturing technology and low cost.

In accordance with the present invention, there are provided novel thermosetting resin compositions which do not require solvent to provide a system having suitable viscosity for convenient handling. Invention compositions have the benefit of undergoing rapid cure. The resulting thermosets are stable to elevated temperatures, are highly flexible, have low moisture uptake and are consequently useful in a variety of applications, e.g., in adhesive applications since they display good adhesion to both the substrate and the device attached thereto.

The invention discloses a thermosetting resin composition, which is characterized by comprising the following components in part by weight: 8 to 80 parts of allyl modified bismaleimide resin prepolymer, 15 to 60 parts of cyanate resin and 5 to 40 parts of halogen-free epoxy resin, wherein the allyl modified bismaleimide resin prepolymer is prepared by reacting bismaleimide resin with an allylcompound at the temperature of between 110 and 160DEG C for 20 to 100 minutes, and a weight ratio of the bismaleimide resin to the allylcompound is 100:(30-120). The composition can be used for preparing a prepreg and a laminated board. The composition and the laminated board have excellent humidity resistance, high heat resistance, low water absorption rate, high modulus, lower dielectric constant and dielectric loss, and good processing toughness, and can realize halogen-free flame retardancy.

In accordance with the present invention, there are provided novel thermosetting resin compositions which do not require solvent to provide a system having suitable viscosity for convenient handling. Invention compositions have the benefit of undergoing rapid cure. The resulting thermosets are stable to elevated temperatures, are highly flexible, have low moisture uptake and are consequently useful in a variety of applictions, e.g., in adhesive applications since they display good adhesion to both the substrate and the device attached thereto.

The present invention is based on the discovery that certain electron poor olefins combined with nucleophiles and a base catalyst are useful as adhesive compositions for the electronic packaging industry. In particular, the adhesive formulations set forth herein are useful as low temperature curing formulations with high adhesion to a variety of substrates. Invention formulations typically cure at about 80° C. and have a potlife of about 24 hours. The formulations cure by the well-known Michael addition reaction.

The present invention provides a polymer/metal nano-composite. The nano-composite includes at least one copolymer chain having alkenyl monomer units and maleimide monomer units, and a nano-sized metal or inorganic crystal. It also provides a method of producing nano-sized metal/inorganic crystals in pure form. These nano-composites and nano-crystals can be useful as polymer fillers, tire rubber compounds, semiconductors, nano-magnets, catalysts, and quantum dots etc.

Treatment fluids comprising: an aqueous base fluid; and a stimuli-degradable gel formed by a reaction comprising a gelling agent; and a stimuli-degradable cross linking agent described by the following formula:

R¹-[A]-[R³—[B]—R²

wherein R¹ and R² may be the same or different, and are selected from the group consisting of: substituted or unsubstituted ethylenically unsaturated groups, N-acryl, O-acryl, acrylol, vinyl, allyl, maleimide, and derivatives or combinations thereof; A and B are optional bridging units; and R³ is a degradable group or polymer.

The invention is based on the discovery that certain polyether oligomers bearing curable moieties are useful as adhesives for the microelectonic packaging industry. Specifically, certain thermoset adhesive compositions containing polyether oligomers of the invention have good adhesion with lower viscosity, lower resistivity, higher conductivity and higher thixotropy when compared to acrylate- and maleimide-based thermoset adhesives.

The invention relates to a thermosetting polyimide resin and a preparation method thereof. A homogeneous transparent sticky maleimide-based polyimide resin solution is taken as a component A, and a 4-maleimide-based bisphenol solution A is taken as a component B. The preparation method of the thermosetting polyimide resin comprises the following steps: (1) preparing the maleimide-based polyimide resin solution as the component A; (2) preparing the 4-maleimide-based bisphenol solution A as the component B; and (3) uniformly mixing the component A and the component B at room temperature to obtain the thermosetting polyimide resin. The thermosetting polyimide resin of the invention not only can be applied to the matrix resin of high temperature resistant adhesives and glass fiber reinforced composite materials but also can be applied to the matrix resin of high-performance fiber (carbon fiber, aramid fiber and the like) reinforced advanced composite materials, thus the thermosetting polyimide resin has wide application prospects; and the invention has simple preparation technology, low cost and environmental protection, can finish preparation processes in the general equipment, and is suitable for industrial production.

The invention provides novel siloxane monomers useful in a variety of adhesive applications. In one aspect, the siloxane compounds described herein can be used as Diels-Alder type curatives for bismaleimide or poly-maleimide monomers. The unsaturated resins shown here are attractive for use as maleimide curatives due to their poly-functionality. Each substituted styrenyl reside can react with two maleimide functional groups. Thus, an invention adhesive composition typically contains an excess of bismaleimide monomers.

The invention relates to a halogen-free phosphorus-containing flame retardant polyimide resin composite, which is characterized by comprising the following components in part by weight: 150 to 180 parts of bismaleimide, 90 to 110 parts of allyl compound, 10 to 20 parts of bisphenol A epoxy resin and 10 to 50 parts of phosphorus-containing compound. The invention also relates to a preparation method for the halogen-free phosphorus-containing flame retardant polyimide resin composite. The method comprises the following steps of: adding the bismaleimide, the allyl compound, the bisphenol A epoxyresin and the phosphorus-containing compound into a reaction kettle, and reacting at the temperature of between 120 and 140 DEG C for 3 to 5 hours to obtain the halogen-free phosphorus-containing flame retardant polyimide resin composite. The halogen-free phosphorus-containing flame retardant polyimide resin composite is synthesized in one step and does not contain halogens and has high flame retardant performance; according to UL94 V0 flame retardant grade tests, the toughness of the cured composite is improved; and the moist heat resistant performance of the composite is high, and the composite meets the requirements of flame retardance and processing in the process of processing copper-clad plates and has high the storage stability.

The invention provides a halogen-free resin composition which comprises (A) 100 parts of cyanate ester resin, (B) 5-50 parts of styrene maleic anhydride, (C), 5-100 parts of polyphenyl ether resin, (D) 5-100 parts of maleimide resin, (E) 10-150 parts of nitrogenous compound, and (F) 10-1000 parts of inorganic filler. As the composition comprises components in special proportion, the halogen-free resin composition is low in dielectric constant, low in dielectric loss, high in heat resistance and high in flame resistance. The halogen-free resin composition can be prepared as a semi-cured film or a resin film, so that the composition can be applied to a copper foil substrate and a printed circuit board.

The invention relates to a thermosetting resin composition with high heat conductivity, a prepreg manufactured by adopting the same and a copper-clad laminate. The thermosetting resin composition with high heat conductivity comprises the following components in parts by mass: 5 parts of allyl phenolic compound, 5-40 parts of bismaleimide compound, 0-30 parts of modified resin, 25-85 parts of filler and 1-8 parts of catalyst. The thermosetting resin composition with high heat conductivity, which is provided by the invention, has the superior properties of high heat conductivity, high glass transition temperature, low CTE, high heat decomposition temperature, favorable process deformability and the like; the prepreg is simple to manufacture and has better heat resisting effect and high heat conductivity; and the copper-clad laminate can be applied to the manufacture of a high multi-layer circuit with high-temperature resistance and has simple manufacture process and lower cost.