Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Film adhesives containing maleimide compounds and methods for use thereof

a technology of maleimide compounds and film adhesives, applied in the field of film adhesive compositions, can solve the problems of unreliable component performance, multiple challenges in the production of reliable electronic components containing stacked die packages,

Inactive Publication Date: 2005-05-19
HENKEL CORP
View PDF9 Cites 51 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0007] In a still further aspect of the invention, there are provided assemblies comprising a first article adhered to a second article by invention film adhesive compositions.

Problems solved by technology

Several challenges exist with respect to producing reliable electronic components containing stacked die packages.
In addition, it is known that adhesive fillet and resin bleed associated with many adhesive formulations contribute to unreliable component performance.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Film adhesives containing maleimide compounds and methods for use thereof
  • Film adhesives containing maleimide compounds and methods for use thereof
  • Film adhesives containing maleimide compounds and methods for use thereof

Examples

Experimental program
Comparison scheme
Effect test

example

[0101] An adhesive composition according to the present invention was prepared as follows. Invention Formulation 1 was prepared using the styrene-butadiene block copolymer KRATON™ D-1102 as the thermoplastic elastomeric component. Octadecylmaleimide and X-BMI (X-BMI is the 1,20-bismaleimido derivative of 10,11-dioctyl-eicosane) were employed as macromonomers. The maleimides used in the following invention formulations were prepared according to the procedure set forth in U.S. Pat. No. 5,973,166, the entire contents of which are incorporated by reference herein.

Invention Formulation 11.Octadecylmaleimide 1.0 g2.KRATON ™ D-1102 2.5 g3.X-BMI 1.5 g4.Ricon 1301 0.2 g5.Silane coupling agent2 0.2 g6.Dicumyl peroxide0.05 g7.Xylene 5.0 g8.TEFLON ™ filler 6.9 g

1Polybutadiene 20% grafted with maleic anhydride (Sartomer)

2Proprietary silane-containing coupling agent.

[0102] Preparation of Formulation 1 began by dissolving octadecylmaleimide in xylene. KRATON was added to this solution and all...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
temperatureaaaaaaaaaa
temperatureaaaaaaaaaa
temperaturesaaaaaaaaaa
Login to View More

Abstract

In accordance with the present invention, there are provided film adhesive compositions comprising at least one macromonomer having at least one unit of ethylenic unsaturation, at least one thermoplastic elastomer co-curable with the macromonomer, and at least one cure initiator, and methods for use thereof. Invention compositions are useful as adhesives in the microelectronics industry. In particular, invention film adhesives may be used to produce microelectronic assemblies with very thin bond lines without compromising adhesive strength.

Description

FIELD OF THE INVENTION [0001] The present invention relates to film adhesive compositions, and more particularly to the use of film adhesive compositions in stacked die microelectronic packaging applications. BACKGROUND OF THE INVENTION [0002] In response to an increasing demand for semiconductor packages that are smaller, yet more functional, the microelectronic packaging industry has recently begun producing packages containing at least two stacked semiconductor dice. Indeed, it is often advantageous to stack multiple dice into the same package in order to increase circuit density without increasing the area occupied on a circuit board by the integrated circuit package. [0003] Several challenges exist with respect to producing reliable electronic components containing stacked die packages. For example, stacked die packages typically require very thin bond lines between die (e.g., <15 microns). In addition, it is known that adhesive fillet and resin bleed associated with many ad...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(United States)
IPC IPC(8): C09J179/08C08F2/00C08F8/30C08F290/02C08L79/08C09J9/02C09J11/00C09J109/00C09J123/00C09J153/00C09J157/00C09J157/10C09J167/00C09J171/00C09J175/04C09J183/04C09J201/00H01L21/58H01L25/065
CPCC08F8/30C08F290/02H01L2924/10253H01L2924/0665H01L2924/01024H01L2924/01023H01L2924/01019H01L2924/01006H01L2224/2919H01L2924/19043H01L2924/19041H01L2924/14C08L79/085C09J179/085H01L24/28H01L24/83H01L25/0657H01L2224/8319H01L2224/8388H01L2924/01004H01L2924/01005H01L2924/01012H01L2924/01013H01L2924/01015H01L2924/01018H01L2924/01027H01L2924/01029H01L2924/01033H01L2924/01039H01L2924/01047H01L2924/01074H01L2924/01079H01L2924/01082H01L2924/07802C08L2666/24H01L2924/00C09J179/04
Inventor LIU, PUWEIDERSHEM, STEPHEN M.YANG, KANGALBINO, CAROLYN C.
Owner HENKEL CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com