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631 results about "Bond line" patented technology

Multilayered structure with water-impermeable substrate

In accordance with the present invention, there is provided a multi-layered structure includes:a) a water-impermeable substrate;b) a first layer on at least one surface of the substrate comprising a water-based tie-layer composition;c) a second layer formed over the first layer, wherein the second layer is a water-based ink-receptive composition includes:i) a multivalent metal salt; andii) a hydrophilic binder polymer;d) a third layer including at least one water-based ink composition deposited in a single pass by an inkjet printing process, wherein the water-based ink composition includes an anionically stabilized, water-dispersible pigment; ande) additional layers deposited over the one or more ink layers and exposed second layer, the additional layers selected from one or more of the following compositions:i) an opaque white layer;ii) a protective layer; andiii) an adhesive layer, further includes a continuous protective plastic or paper layer adhered thereto.
Owner:EASTMAN KODAK CO
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