693 results about "Silicone adhesive" patented technology

A transdermal patch for administering a volatile liquid drug, such as nicotine, transdermally to a patient comprising a four-layer laminated composite of: a top drug impermeable backing layer; a pressure sensitive silicone adhesive layer containing the drug; a pressure sensitive acrylic adhesive layer also containing the drug; and a removable siliconized release liner layer. Also disclosed is a method for treating a person for nicotine dependence and particularly for treating a woman for nicotine dependence.

A thermally-conductive, electrically insulative interface for conductively cooling a heat-generating source, such as an electronic component, having an associated thermal dissipation member such as a heat sink. The interface is provided as a cured sheet of a curable material formulated as a blend of a curable silicone binder, and a particulate alumina, i.e., aluminum oxide (Al2O3), filler. The interface is observed to exhibit a thermal conductivity of at least about 0.8 W / m-K and a wet dielectric breakdown strength of at least about 475 Vac / mil.

Oral care compositions comprising: (a) a peroxide complex comprising a peroxide component and an N-vinyl heterocyclic polymer (e.g., poly-N-vinyl polylactam, or poly-N-vinyl-polyimide); (b) a whitening agent (e.g., hydrogen peroxide); and (c) an orally acceptable carrier. In one embodiment, the carrier comprises a film forming material. Methods are also provided for making an oral care composition comprising: (a) mixing a whitening agent, silicone adhesive and carrier fluid to form a homogenous mixture; (b) adding a peroxide complex to said homogenous mixture, wherein said complex comprises hydrogen peroxide and an N-vinyl heterocyclic polymer; and (c) mixing under vacuum.

A semiconductor chip module uses a silicone adhesive between the semiconductor chip and a cap, said adhesive having sufficient bond strength to secure said cap to said chip without additional mechanical constraint while providing a direct thermally conductive path and permitting sufficient heat flow from said chip to said cap to maintain steady state operation of said semiconductor chip. The preferred silicone adhesive comprises a primerless, two-part polysiloxane-based adhesive made by reacting polydimethyl siloxane, an organosilicon compound, a polysiloxane, and a silane, in the presence of a catalyst.

Thermal interface compositions contain filler particles possessing a maximum particle size less than 25 microns in diameter blended with a polymer matrix. Such compositions enable lower attainable bond line thickness, which decreases in-situ thermal resistances that exist between thermal interface materials and the corresponding mating surfaces.

An airbag is provided which securely prevents gas leakage through seams between panels and has excellent productivity. The airbag 10 has panels 1, 2. Peripheral portions of the panels 1, 2 are bonded with silicone adhesive 5 and also sewn together by sewing yarns 6A, 6B. Seams of the sewing yarns 6A, 6B may be coated by silicone sealant. The sewing yarn 6A composing an inner seam is thinner than the sewing yarn 6B composing an outer seam so that the sewing yarn 6A is broken during the inflation of the airbag 10, thereby absorbing energy.

An addition curable adhesive silicone composition containing a phosphor dispersed uniformly therein is provided. The dispersive state of the phosphor remains stable over time. The composition, in an uncured state at room temperature, is either a solid or a semisolid, and is therefore easy to handle, and is suited to an adhesive silicone composition sheet which is able to be formed easily on an LED chip using a conventional assembly apparatus.

A silicone adhesive composition including an ionic silicone and useful for healthcare applications such as wound care and drug delivery.

Compositions and methods for controlling transdermal drug delivery, particularly of amine-functional and basic drugs, comprising a blend of a first silicone-based polymer having a reduced silanol concentration and a second silicone-based polymer have a substantial or high silanol concentration. The blend of such silicone-based polymers, particularly pressure-sensitive silicone adhesives, provides sufficient drug solubility and reduced initial drug delivery onset to permit a prolonged delivery duration at a substantially zero-order rate of delivery.

A thermal interface material composition including a blend of a polymer matrix and a thermally conductive filler having particles having a maximum particle diameter no greater than about 25 microns, wherein the polymer matrix includes an organopolysiloxane having at least two silicon-bonded alkenyl groups per molecule, an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms per molecule and a hydrosilyation catalyst comprising a transition metal, wherein the transition metal is present in an amount of from about 10 to about 20 ppm by weight based on the weight of the non-filler components and the molar ratio of the silicon-bonded hydrogen atoms to the silicon-bonded alkenyl groups ranges from about 1 to about 2. A method is also provided.

A green product for use in fabricating a ceramic article comprises a ceramic powder immobilized within a silicone matrix, wherein the silicone matrix comprises one or more cross linked or polymerized silicone monomers and / or oligomers, wherein the one or more cross linked or polymerized silicone monomers and / or oligomers have a alkenyl reactive functional group and a hydride reactive functional group. Processes for forming a green product and a ceramic core with the silicone monomers and / or oligomers are also disclosed.

Provided is a method for manufacturing a lamination type semiconductor integrated device that can simultaneously attain grinding force resistance during back side grinding of a semiconductor wafer, heat resistance during anisotropic dry etching and the like, chemical resistance during plating and etching, smooth debonding of a support substrate for processing at the end, and low adherend staining; the method comprises at least a step of back side grinding of a first semiconductor wafer having a device formed on its surface and a step of laminating by electrical bonding the first semiconductor wafer with a second semiconductor wafer having a device formed on its surface, wherein, at the time of back side grinding of the first semiconductor wafer, back of the first semiconductor wafer is ground after surface of formed device on the first semiconductor wafer is bonded to a support substrate for processing by using a pressure-sensitive silicone adhesive.

This invention relates to a method of enhancing the adhesion of a silicone containing adhesive formulation. The method comprises mixing 1 to 99.9 wt. % of a silicone-containing adhesive formulation and 0.1 to 50 wt. % antiperspirant compound to form a composition. The composition is then applied onto a surface and allowed to cure. The invention also relates to a composition comprising 1 to 99.9 wt. % of a silicone-containing adhesive formulation and 0.1 to 50 wt. % antiperspirant salt. The resultant adhesive films are especially useful in healthcare and cosmetic applications where they inhibit perspiration and, thus, retain the adhesive strength of the adhesive.

A silicone adhesive for a semiconductor element that is suitable as a die bonding material for fixing a light emitting diode chip to a substrate. The adhesive includes (a) an addition reaction-curable silicone resin composition having a viscosity at 25° C. of not more than 100 Pa·s, and yielding a cured product upon heating at 150° C. for 3 hours that has a type D hardness prescribed in JIS K6253 of at least 30, (b) a white pigment powder having an average particle size of less than 1 μm, and (c) a white or colorless and transparent powder having an average particle size of at least 1 μm but less than 10 μm. The adhesive exhibits high levels of concealment, effectively reflects light emitted from the LED chip, and also exhibits favorable chip positioning properties, superior adhesive strength, and excellent durability.

A green product for use in fabricating a ceramic article comprises a ceramic powder immobilized within a silicone matrix, wherein the silicone matrix comprises one or more cross linked or polymerized silicone monomers and / or oligomers, wherein the one or more cross linked or polymerized silicone monomers and / or oligomers have a alkenyl reactive functional group and a hydride reactive functional group. Processes for forming a green product and a ceramic core with the silicone monomers and / or oligomers are also disclosed.

A photovoltaic / thermal solar panel is presented which contains no glazing above the photovoltaic array. The absence of glazing allows the photovoltaic cells to operate at a lower temperature and therefore at a higher efficiency. In addition, the absence of glazing allows the present invention PV / T panel to be used to provide nighttime cooling for a building. The panel is constructed by adhering an aluminum heat transfer plate to the rear of the PV array in the panel using a silicone adhesive. PEX tubing is inserted into channels integrally formed into the back of the heat transfer plate again using silicone or other heat-conductive compound.

The invention discloses a practical method for preparing high-thixotropy surface treatment nano calcium carbonate, which comprises the following steps: firstly, calcining and digesting preferable limestone, and then controlling carbonization of the limestone in a special reactor to obtain nano calcium carbonate primary slurry; secondly, carrying out surface treatment on the nano calcium carbonate according to practical and special control technology; and finally dehydrating, drying, crushing and grading the coated slurry. The shape of the obtained calcium carbonate is cubic, the particle diameter is 50 to 100 nanometers, and the specific surface area is 20 to 40 m / g. The obtained powder has good dispersion effect and thixotropy, is suitable for occasions needing high thixotropy, such as high-performance silicone adhesive, epoxy adhesive, polysulfide adhesive, polyurethane adhesive, automotive primary coat, floor coating and the like, and has wide market prospect. The method has simple raw materials and process requirement, stabalizes the production and reduces the cost.

Thermal interface compositions contain filler particles possessing a maximum particle size less than 25 microns in diameter blended with a polymer matrix. Such compositions enable lower attainable bond line thickness, which decreases in-situ thermal resistances that exist between thermal interface materials and the corresponding mating surfaces.

The instant invention provides for an electrically and thermally conductive silicone adhesive composition comprising an alkenyl siloxane, a hydrido-siloxane, an electrically and thermally conductive filler, an optional thermally conductive filler, an adhesion promoter that does not deactivate the hydrosilylation catalyst, and a hydrosilylation catalyst and a hydrosilylation catalyst inhibitor.

Provided is a laminated body comprising a substrate to be ground and a support, where the substrate may be ground to a very small (thin) thickness and can then be separated from the support without damaging the substrate. One embodiment is a laminated body comprising a substrate to be ground, a curable silicone adhesive layer in contact with the substrate to be ground, a photothermal conversion layer comprising a light absorbing agent and a heat decomposable resin, and a light transmitting support. After grinding the substrate surface which is opposite that in contact with the adhesive layer, the laminated body is irradiated through the light transmitting layer and the photothermal conversion layer decomposes to separate the substrate and the light transmitting support.

A silicone adhesive sheet for bonding a semiconductor chip to a chip attachment component comprising a crosslinkable silicone composition containing a silatrane derivative, and a method for manufacturing a silicone adhesive sheet by subjecting a crosslinkable silicone composition containing a silatrane derivative to a crosslinking reaction between backing materials that do not stick to the crosslinked product of said composition, where at least one of the backing materials has a larger dielectric constant than that of the crosslinked product. The present silicone adhesive sheet allows a semiconductor chip and a chip attachment component to be bonded in a short time at a relatively low temperature.

The invention discloses a flexible substrate used for optoelectronic devices and comprises a flexible substrate; the invention is characterized in that a bonding layer and a conductive thin film are arranged on the surface of the flexible substrate; the conductive thin film is deposited on the surface of the bonding layer; the bonding layer is made of UV-curable silicone adhesive; and the raw material of the adhesive comprises photosensitive polysiloxane, photoinitiator and reactive diluents. The substrate solves the problem of poor adhesion between the deposited conductive thin film and the substrate due to low surface energy of the flexible substrate and improves the barrier properties of the substrate on water and oxygen, and also achieves good smoothing effect on the surface of the substrate; besides, the preparation method is simple and effective, which can significantly reduce the substrate production cost and process difficulty and increase the substrate yield rate in the etching process.

The invention relates to a long-acting antibacterial and mildew-proof silicone adhesive and a preparation method thereof. The preparation method comprises the steps: grinding an efficient and environment-friendly organic sterilizing and mildew-proof agent and an inorganic zinc loaded zeolite antibacterial agent with a porous structure at high speed in high-speed grinding equipment and thus organically combining the organic sterilizing and mildew-proof agent and the inorganic zinc loaded zeolite antibacterial agent by using a coupling agent on the basis of comprehensively researching and analyzing the characteristics of all antibacterial and mildew-proof agent systems to obtain a novel composite antibacterial and mildew-proof agent; then, adding the obtained composite antibacterial and mildew-proof agent into a silicone adhesive material by using the traditional silicone adhesive production equipment and a conventional adhesive preparation process to finish the preparation of the long-acting antibacterial and mildew-proof silicone adhesive. The antibacterial and mildew-proof silicone adhesive provided by the invention is low in raw material cost, simple in production process, free of three wastes and capable of meeting the requirement for environment friendliness. The long-acting antibacterial and mildew-proof silicone adhesive prepared by the invention is efficient and durable in antibacterial and mildew-proof performances and capable of meeting the technical requirement for use in fields such as buildings, electronic appliances, automobiles, boats and the like.

An epoxy mortar material for a bridge expansion joint structure and a construction method thereof are provided. The epoxy mortar material includes a liquid A, a liquid B and a filler, wherein diamines D2000 and D230 are mixed to act as the epoxy resin curing agent. The curing agent has low viscosity, good compatibility with epoxy resin, long usable life, high bonding strength, and good flexible and heat shock resistance, so that it is suitable for the epoxy mortar material capable of absorbing the stress. Furthermore, the silicone adhesive is made into the sealing waterstop band, so that the present invention has good water resistant performance; the color of the expansion joint structure is the same as that of the adjacent concrete or asphalt, so that the bridge has beautiful appearance; the expansion joint structure has no tremors while vehicles passing through, noise generated by vehicle driving is lower.

A semiconductor chip module uses a silicone adhesive between the semiconductor chip and a cap, said adhesive having sufficient bond strength to secure said cap to said chip without additional mechanical constraint while providing a direct thermally conductive path and permitting sufficient heat flow from said chip to said cap to maintain steady state operation of said semiconductor chip. The preferred silicone adhesive comprises a primerless, two-part polysiloxane-based adhesive made by reacting polydimethyl siloxane, an organosilicon compound, a polysiloxane, and a silane, in the presence of a catalyst.

Disclosed are a curable silicone resin composition, a cured product thereof, and the opaque silicone adhesive sheet formed from the conposition. The curable silicone resin composition is solid at roomtemperature, the composition including: (A) an organopolysiloxane having a resin structure consisting of specific siloxane units, (B) an organohydrogenpolysiloxane having a resin structure consistingof specific siloxane units, (C) a platinum group metal-based catalyst, (D) either one or both of an opaque pigment and an opaque dye, and (E) a reaction retarder, in which a layer of thickness 100 [mu]m formed from a cured product of the composition exhibits a light transmittance of not more than 5% across the entire visible light range. The composition is solid at room temperature and thereforeeasy to handle. Further, the composition is useful for producing an opaque silicone adhesive sheet. A cured product obtained by curing the composition can be used to protect a liquid crystal electrodeand shield the electrode from light, thereby preventing malfunction of the driver IC, and also exhibits excellent mechanical properties and flexibility, and displays minimal surface tack.

Prepare a laminated assembly by providing an insulating member comprising a polymeric foam having opposing surfaces and a structural member by positioning the structural member so as to extend over at least one of the opposing surfaces of the insulating member and providing a moisture-curable hot-melt polyurethane or silicone adhesive having an open time and an application temperature range and disposing the adhesive between the insulating and structural members at a coating weight of 16 grams per square meter or less and three grams per square meter or more while at an application temperature and then pressing the structural and insulating members together during the open time of the adhesive.