1322results about How to "Low curing temperature" patented technology

The invention is based on the use of polyisobutylmethacrylate instead of PMMA as an adhesive or spinal fill material for treating diseases of the spine. Polyisobutylmethacrylate has several advantages over PMMA, mainly less heat is developed during the in situ polymerization process. When using any spinal adhesive of fill material that is light activated, a tube can be used to transmit activating light to the light-activated adhesive or spinal polymerizable fill material at the surgical site. In addition, a mesh bag comprising optical fibers or similar light transmitting material can be employed to receive the injected light-activated fill, with the mesh bag, irradiated externally, for directing the light via the bag to the polymerizable fill.

Heat-curable silicone compositions employing a reactive silicone, a silicone hydride crosslinker and a catalyst system which includes a rhodium-based catalyst, a stabilizing system are disclosed. A combination of rhodium and platinum-based catalysts are employed as well. The compositions are low temperature curing and are capable of providing low coefficient of thermal expansion compositions. A stabilizer system which includes in combination a peroxide and an acetylenic compound is also disclosed.

The invention is based on the use of polyisobutylmethacrylate instead of PMMA as an adhesive or spinal fill material for treating diseases of the spine. Polyisobutylmethacrylate has several advantages over PMMA, mainly less heat is developed during the in situ polymerization process. When using any spinal adhesive of fill material that is light activated, a tube can be used to transmit activating light to the light-activated adhesive or spinal polymerizable fill material at the surgical site. In addition, a mesh bag comprising optical fibers or similar light transmitting material can be employed to receive the injected light-activated fill, with the mesh bag, irradiated externally, for directing the light via the bag to the polymerizable fill.

Disclosed is a photo-curable conductive adhesive and method for preparation, which is prepared from light-sensitive high molecular polymer, reactive dilution monomer, conducting particles, light-summing heat initiating agent and anti-oxidant through mixing and grinding, wherein the light-sensitive high molecular polymer is epoxy acrylic resin or / and polyurethane-acrylate, the reactive dilution monomer is the single, double and multiple functional monomers of acrylic acid, the conducting particle is silver powder, copper powder or silver-plated copper powder, the light initiating agent is alpha-amine alkyl methyl ketone, benzoin (or substituted benzoin) ether or acyl phosphines, the heat initiating agent is azocompound or peralcohol, the antioxidant is hydroquinone, p-hydroxybenzene methyl ether, 2,6-ditertiary-butyl-4-methylphenol.

The invention discloses a method for preparing an environmentally-friendly adhesive for a lignin-based timber. The method comprises the following steps of: 1) adding phenol, formaldehyde solution, lignin, first alkali liquor and diluting water into a reactor, heating to the temperature of between 75 and 85 DEG C and reacting for 2.5 to 3.5 hours, wherein the molar ratio of formaldehyde to the phenol is 2.20:1-2.40:1; the formaldehyde solution is added for three times in a mass ratio of 1.5 to 1.0 to 1.0; and the reaction time ratio of the added formaldehyde solution is 1.2 to 1.0 to 1.0; 2) cooling to 70 DEG C, adding a formaldehyde collector and second alkali liquor, and reacting at the temperature of between 65 and 70 DEG C for 20 to 50 minutes; and 3) cooling to the temperature of between 30 and 40 DEG C, adding an intensifier, stirring for 10 to 30 minutes, cooling and discharging. In the method, a 50 to 60 percent petroleum-based phenol raw material can be substituted; the methodis stable in reaction, easy to control and easy for industrial production; formaldehyde emission of a plywood reaches E0 level; adhesive strength meets the requirements of national class I plates; and a new approach is provided for the development of an environmentally-friendly biomass-based timber adhesive and recycling of wastes.

The invention provides a conductive graphene printing ink. The conductive graphene printing ink is composed of 0.001-80wt% of graphene, 1-60wt% of a linking material, 0.1-30wt% of an assistant, and the balance solvent. The invention also provides a preparation method of the conductive graphene printing ink. The conductive graphene printing ink has the advantages of good toughness, good die molding performance, good adhesion and good impact resistance; chemically doped graphene and chemically modified graphene in the graphene have good conductive, mechanical and thermal performances. The molecules of the chemically doped graphene comprise one or more of polyaniline, polyacetylene, polythiophene, polyparaphenylene and polypyrrole, and the functional groups of the chemically modified graphene comprise one or more of an anilino group, a pyrryl group, an imidazolyl group, a benzenesulfonic acid group, a thienyl group, a furyl group, a phenyl group, a hydroxy group, an ester group and derivative groups thereof, so the conductive performance, the mechanical performances and the dispersion stability of graphene in the printing ink are improved.

The invention discloses a method for synthesizing organic silicon, in particular provides a method for preparing methyl phenyl silicone resin which has low curing temperature by self and is not sticky repeatedly. The invention uses the monomers of methyl trichlorosilane, dimethyldichlorosilance, phenyl trichlorosilane, dichloromethylphenylsilane, diphenyl dichlorosilane and the like to obtain a methyl phenyl silicone resin with low curing temperature and a paint film which is not sticky repeatedly after being cured by the processes of adjusting the proportion of raw materials, controlling proper reaction temperature and polymerization time, carrying out hydrolysis reaction and polycondensation reaction, etc. The invention has the advantages that the methyl phenyl silicone resin prepared by the method has the characteristics of low curing temperature, being not sticky repeatedly, being clear and transparent, high and low temperature resistance, weather resistance, being insulating and the like; the methyl phenyl silicone resin is in particular fit for dip varnish higher than grade H; and the methyl phenyl silicone resin is used for confecting insulated paint, weather-resistant paint and heat resistant paint higher than grade H, is used for heat resistant parting agent and also can be used in the fields with rigorous using requirements, such as heat resistant water blocking and sand prevention for oil drilling, etc.

The invention relates to a composite material plate. The composite material plate comprises a sandwich layer, two covering layers coating the outer surface of the sandwich layer, and a polydicyclopentadiene layer arranged on the outer surface of at least one of the covering layers. The invention also relates to a preparation method and a use of the composite material plate. According to the composite material plate, outside of a fiber reinforced material is coated by the polydicyclopentadiene layer, so that the problem that a conventional fiber reinforced resin-based composite material is easily suffered from layering failure and is poor in abrasive resistance when being subjected to an impact load is solved. The composite material plate can be widely applied to loading or load-bearing components on mine, railway and road transportation heavy vehicles and goods hoppers. The composite material plate material can be obtained through a reaction injection molding process combined with a vacuum auxiliary molding process, and is suitable for industrial production.

A thermal interface material composition including a blend of a polymer matrix and a thermally conductive filler having particles having a maximum particle diameter no greater than about 25 microns, wherein the polymer matrix includes an organopolysiloxane having at least two silicon-bonded alkenyl groups per molecule, an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms per molecule and a hydrosilyation catalyst comprising a transition metal, wherein the transition metal is present in an amount of from about 10 to about 20 ppm by weight based on the weight of the non-filler components and the molar ratio of the silicon- bonded hydrogen atoms to the silicon-bonded alkenyl groups ranges from about 1 to about 2. A method is also provided.

The invention discloses a vegetable oleic acid modified epoxy resin. The invention also discloses a preparation method for the vegetable oleic acid modified epoxy resin, a polymer containing the vegetable oleic acid modified epoxy resin, and a preparation method and application of the polymer. According to the invention, since vegetable oleic acid with an unsaturated double bond is introduced into the epoxy resin, post-curing of the unsaturated double bond improves comprehensive properties of a paint film. The polymer of the invention is applied in a cathodic electrophoretic coating material, and a formed coating has the characteristics of good flexibility, good leveling property, high gloss, low curing temperature, good corrosion resistance, etc., can be cured at 140 to 160 DEG C and is low in cost; and products using the coating has good storage stability.

A curable resin composition containing a specific vinyl compound obtained by vinylation of a terminal of a bifunctional phenylene ether oligomer having a polyphenylene ether structure in a molecule and a specific bismaleimide compound having at least two maleimide groups in a molecule, a curable film comprising the above composition, a cured product obtained by curing the above composition, and a film obtained by curing the curable film. The above resin composition is excellent in curability even in the presence of oxygen, is curable at a low temperature and is capable of giving a cured product having a low dielectric constant, a low dielectric loss tangent, high heat resistance, excellent mechanical properties, excellent chemical resistance and excellent flame retardancy.