Canate-bimaleimide resin adhesive and preparation method
A technology of bismaleimide resin and maleimide resin, applied in the direction of adhesives, etc., can solve the problems of low dielectric performance, insufficient bonding performance, poor heat resistance, etc., and achieve low dielectric constant, Ease of handling and good heat resistance
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specific Embodiment approach 1
[0023] Specific embodiment one: In this embodiment, the cyanate-bismaleimide resin adhesive consists of 100 parts by weight of cyanate resin, 40-80 parts of bismaleimide resin, 20-60 parts It is made of internal toughening phenolic resin, 10-40 parts of epoxy resin and 0.5-3 parts of catalyst.
specific Embodiment approach 2
[0024] Specific embodiment two: In this embodiment, the cyanate-bismaleimide resin adhesive is composed of 100 parts by weight of cyanate resin, 50-70 parts of bismaleimide resin, 30-50 parts It is made of internal toughening phenolic resin, 20-30 parts of epoxy resin and 1-2 parts of catalyst.
specific Embodiment approach 3
[0025] Specific embodiment three: in this embodiment, the cyanate ester-bismaleimide resin adhesive is made of 100 parts of cyanate ester resin, 60 parts of bismaleimide resin, 40 parts of internal toughened phenolic resin resin, 25 parts epoxy resin, and 1.5 parts catalyst.
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