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Canate-bimaleimide resin adhesive and preparation method

A technology of bismaleimide resin and maleimide resin, applied in the direction of adhesives, etc., can solve the problems of low dielectric performance, insufficient bonding performance, poor heat resistance, etc., and achieve low dielectric constant, Ease of handling and good heat resistance

Inactive Publication Date: 2009-09-16
INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
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  • Summary
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  • Description
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Problems solved by technology

[0007] The purpose of the present invention is to provide cyanate ester-bismaleimide resin adhesive and its preparation method in order to solve the problems of poor heat resistance, low dielectric performance and insufficient bonding performance in existing high temperature resistant adhesives

Method used

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  • Canate-bimaleimide resin adhesive and preparation method

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specific Embodiment approach 1

[0023] Specific embodiment one: In this embodiment, the cyanate-bismaleimide resin adhesive consists of 100 parts by weight of cyanate resin, 40-80 parts of bismaleimide resin, 20-60 parts It is made of internal toughening phenolic resin, 10-40 parts of epoxy resin and 0.5-3 parts of catalyst.

specific Embodiment approach 2

[0024] Specific embodiment two: In this embodiment, the cyanate-bismaleimide resin adhesive is composed of 100 parts by weight of cyanate resin, 50-70 parts of bismaleimide resin, 30-50 parts It is made of internal toughening phenolic resin, 20-30 parts of epoxy resin and 1-2 parts of catalyst.

specific Embodiment approach 3

[0025] Specific embodiment three: in this embodiment, the cyanate ester-bismaleimide resin adhesive is made of 100 parts of cyanate ester resin, 60 parts of bismaleimide resin, 40 parts of internal toughened phenolic resin resin, 25 parts epoxy resin, and 1.5 parts catalyst.

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Abstract

A cyanate-bimaleimide resin adhesive and a preparation method belong to the adhesive field, solving the problems of poor heat resistance, low dielectric property and poor adhesive property of current high-temperature adhesives. The adhesive of the invention is prepared by a cyanate ester resin, a bismaleimide resin, an internally toughened phenolic resin, an epoxy resin and a catalyst. The preparation method is as follows: 1. carrying out pre-reaction on the epoxy resin and the internally toughened phenolic resin to obtain a prepolymer resin B; 2. carrying out pre-reaction on the cyanate, the bimaleimide and the catalyst to obtain a prepolymer C; 3. carrying out pre-reaction on the prepolymer C and the prepolymer B to prepare the adhesive of the invention. The prepared adhesive has reasonable formulation, good heat resistance, dielectric property, adhesive property and curing process property, can be used for adhesion of high-temperature resistance composite materials with high dielectric property and used as a matrix resin, and is simple in method and easy operation.

Description

technical field [0001] The invention belongs to the field of adhesives; in particular, it relates to a cyanate-bismaleimide resin adhesive and a preparation method thereof. Background technique [0002] Bismaleimide-triazine resin (bismaleimide triazine, referred to as BT resin) system combines the advantages of cyanate resin and bismaleimide resin, with high dielectric properties, excellent heat resistance and broadband dielectric properties It has become a resin system that is developing rapidly at present. At present, it has been successfully applied in the manufacture of radar radomes, aircraft fuselage structural materials, high-frequency circuit boards, and microwave devices abroad. At present, it has been used in the manufacture of high-performance composite materials in China, but there is a lack of adhesives for bonding these high-performance composite materials. Most of the adhesives used are epoxy resin and phenolic resin systems. The electrical properties can n...

Claims

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Application Information

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IPC IPC(8): C09J179/04
Inventor 赵颖刘晓辉张大勇朱金华王刚李欣
Owner INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
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