56 results about "Methyl phenyl polysiloxane" patented technology

The invention relates to an organic silicon potting adhesive containing a POSS (polysilsesquioxane) group and a preparation method of the organic silicon potting adhesive. The organic silicon potting adhesive comprises a component A and a component B and is characterized in that the component A is formed by a POSS-phenyl organosilicon polymer and excessive hydrogen-terminated methyl phenyl polysiloxane which is not involved in the reaction, wherein the POSS-phenyl organosilicon polymer is formed by hydrosilylation to graft hydrogen-terminated methyl phenyl polysiloxane by taking polysiloxane cage octavinyl polysilsesquioxane as a main chain; the component B is methyl phenyl vinyl polysiloxane. By virtue of the phenyl of phenyl vinyl polysiloxane in the component A of the potting adhesive, the high refractive index of the material is ensured; by virtue of an introduced organic polysiloxane system, the heat resistance of the material is improved, the number of cross-linking points is increased and the refractive index of the material is increased; meanwhile, by virtue of phenyl polysiloxane matrix, the high refractive index of the material is ensured; the transparent organic silicon material with high heat resistance and high refractive index can be applied to encapsulation of HB-LED.

The invention relates to an organic silicon rubber for LED packaging. In order to solve the problems that during direct physical blending of POSS (polyhedral oligomeric silsesquioxane) with vinyl silicone oil and hydrogen containing silicone oil, POSS has poor compatibility with vinyl silicone oil and hydrogen containing silicone oil and is very easy to precipitate, so that the light transmittance and mechanical properties of the product can be affected, the invention provides a preparation method of a POSS skeleton containing vinyl silicone oil. The method includes: mixing POSS with one or two of dimethyl polysiloxane and methylphenyl polysiloxane at any proportion to obtain a mixture, in the presence of a catalyst, carrying out end-capping with a vinyl end-capping reagent, and performing a polymerization reaction to obtain the POSS skeleton containing vinyl silicone oil. The preparation method is simple. The invention also provides application of the POSS skeleton containing vinyl silicone oil in LED packaging materials.

The invention relates to a preparation method of methyl phyenyl cyclosiloxane, aiming at solving the technical problem that the invention provides the preparation method of the methyl phenyl polysiloxane containing SiPhO1.5, namely TP under catalysis of alkali through thermal cracking. The particular steps are that: 1) polymethylphenyl sioxane containing TP is mixed evenly with catalysts (lithium hydroxide, potassium carbonate or sodium carbonate), and catalyst dosage is 0.1 to 10 percent of the polymethylphenyl sioxane dosage; 2) a low-boiling material condensed by the polymethylphenyl sioxane containing TP is removed under the vacuum and heating-up temperature of 200 to 250 DEG C; 3) the polymethylphenyl sioxane containing TP is cracked under high vacuum and highly heating-up temperature of 300 to 350 DEG C, thereby obtaining the product by collecting 250 to 290 DEG C/2mmHg distillations.

A non-skid coating described herein attempts to overcome the deficiencies of the conventional coatings with improved external durability and color retention, a reduced level of VOCs, and direct-to-metal (DTM) adhesion using organo-siloxane chemistry. The non-skid coating has a first component having an amino-functional siloxane resin; a second component having a non-aromatic epoxy resin; a spherical filler for lowering viscosity; a pigment; a coarse aggregate; and a thixotropic agent. The amino-functional siloxane resin can be an amino-functional methyl phenyl polysiloxane, diphenyl polysiloxane or silsesquioxane-based resin. The non-aromatic epoxy resin can be cycloaliphatic or aliphatic. The first component is about 5% to 20% weight of the coating, and the second component is about 80% to 95% weight of the coating.

The invention relates to an isocyanate-terminated polysiloxane material that can preferably be used as a curing agent, hardener or co-reactant in coatings. The invention further relates to a method of manufacturing the isocyanate-terminated polysiloxane material by partially hydrolyzing a methoxy-functional polysiloxane such as a methyl phenyl polysiloxane, and reacting it with a polyisocyanate to yield the isocyanate-terminated polysiloxane hardener. The hardener can preferably be used with any isocyanate-reactive functional group of another component to form coating systems, including acrylics, polyesters, epoxies and urethanes.

The invention discloses a high-temperature resistance methyl phenyl polysiloxane resin powder coating and a preparation method thereof. The coating comprises following components, in parts by weight: 47 to 53 parts of methyl phenyl polysiloxane resin, 0.3 to 0.8 part of tert-butyl peroxide, 8 to 12 parts of methyltris(methylethylketoxime)silane, 1.1 to 1.3 parts of organic silicon levelling agent, 2.5 to 3.0 parts of polysiloxanes, 3.3 to 3.8 parts of triglycidyl isocyanurate, 9 to 10 parts of aluminium nitride powder, 5.5 to 7.5 parts of nano brick slag powder, 1.3 to 1.8 parts of 1-methyl amyl alcohol and 2 to 3 parts of propylene glycol methyl ether acetate. The methyl phenyl polysiloxane resin has the advantages of excellent damp-resistance, waterproofness, stainlessness, cold-resistance, ozone-resistance and weatherability. The methyl phenyl polysiloxane resin has a good high-temperature resistance performance, and the heat-resistance temperature arrives at 550 DEG C or more.

An inelastic collision and rolling viscous resistance particle coupling energy dissipation cutter rod relates to a cutting tool. The cutter rod comprises a cutter rod body, a cutter rod connection piece, a cutting head and coupling energy dissipation plates. A groove array is formed in each coupling energy dissipation plate. A surface low recovery coefficient particle and at least two high surface viscous resistance macromolecule particles are arranged in each groove, a high polymer film wraps the surface of each high surface viscous resistance macromolecule particle, and a fixed groove for installing the coupling energy dissipation plate is formed in each coupling energy dissipation plate. After multiple layers of coupling energy dissipation plates are installed in the cutter rod, vibration energy generated by cutting force can be dissipated quickly and gradually, energy dissipation factors are high, the vibration restraining effect is obvious, and boring stability and accuracy of parts with deep holes are effectively improved. The cutter rod is low in cost and easy to implement. The surface low recovery coefficient particles utilize a metal material as the base material, methyl phenyl polysiloxane and acrylate interpenetration polymer wraps the base material, and the surface low recovery coefficient particles are high in strength, not prone to corrosion, long in service life and capable of being used in a long term.

The invention relates to phenyl polysiloxane containing hydrogen and a preparation method thereof, the phenyl polysiloxane containing hydrogen is prepared by using 60 to 80 parts of methyl phenyl polysiloxane, 20 to 35 parts of methylhydracyclosiloxane, 5 to 8 parts of end-capping reagent tetramethyl dihydro disiloxane, and taking cation exchange resin as a catalyst. The process route is simple and convenient, economic and environment friendly and raw materials are easy to obtain. The prepared phenyl polysiloxane containing hydrogen by utilizing the technology has the usability of high phenyl content, good transparency, high refraction coefficient and excellent usability.

The invention discloses a hot-melt OCA optical adhesive film and a preparation method thereof. The hot-melt OCA optical adhesive film is a novel optical-grade material taking hot-melt resin and organic silicon resin as the main body, wherein the hot-melt resin comprises thermosetting resin and thermoplastic resin, and the organic silicon resin comprises: reactive methyl phenyl polysiloxane, methylphenyl T resin, methyl phenyl silicon resin, a phenyl cross-linking agent, a phenyl chain extender and an additive. Compared with the traditional OCA, the OCA provided by the invention has the advantages of excellent light transmission, bonding strength, cold and hot impact resistance and weather resistance.