47results about How to "Thermal resistance minimization" patented technology

A broadband power combining device includes an input port, an input waveguide section, a center waveguide section formed by stacked wedge-shaped trays, an output waveguide section, and an output port. Each tray is formed of a wedge-shaped metal carrier, an input antipodal finline structure, one or more active elements, an output antipodal finline structure, and attendant biasing circuitry. The wedge-shaped metal carriers have a predetermined wedge angle and predetermined cavities. The inside and outside surfaces of the metal carriers and surfaces of the cavity all have cylindrical curvatures. When the trays are assembled together, a cylinder is formed defining a coaxial waveguide opening inside. The antipodal finline structures form input and output arrays. An incident EM wave is passed through the input port and the input waveguide section, distributed by the input antipodal finline array to the active elements, combined again by the output antipodal finlines array, then passed to the output waveguide section and output port. A hermetic sealing scheme, a scheme for improving the power combining efficiency and thermal management scheme are also disclosed. The broadband power combining device operates with multi-octave bandwidth and is easy to manufacture, well-managed thermally, and highly efficient in power combining.

The present invention relates to an LED module for illumination, and more particularly, to an LED module for illumination capable of enhancing light emitting efficiency by having a light emitting structure, in which the thickness of an insulation substrate with an electrode pattern formed on a top portion thereof is minimized, a heat radiation substrate is formed by integrally attaching a radiator to a bottom surface of the insulation substrate, and LED elements are attached to the electrode pattern of the heat radiation substrate through silver epoxy with excellent heat conductivity as an adhesive agent, so that heat generated from the LED elements can effectively radiate through the radiator, white light is effectively generated from the light emitted from the LED elements, and the white light can be emitted to the outside maximally.

A method of manufacturing a device based on LEDs includes the growth of semiconducting nanowires on a first electrode produced on an insulating face, and encapsulation thereof in planarising material; the formation, on the planarising material, of a second electrode with contact take-up areas. LEDs are formed by releasing a band of the first electrode around each take-up area, including forming a mask defining the bands on the second electrode, chemically etching the planarising material, stopped so as to preserve planarising material, chemically etching the portion of nanowires thus released, and then chemically etching the remaining planarising material. A trench is formed along each of the bands as far as the insulating face and the LEDs are placed in series by connecting the take-up areas and bands of the first electrode.

A light emitting module comprises a light emitting device (LED) mounted on a high thermal dissipation sub-mount, which performs the traditionally function of heat spread and the first part of the heat sinking. The sub-mount is a grown metal that is formed by an electroplating, electroforming, electrodeposition or electroless plating process, thereby minimising thermal resistance at this stage. An electrically insulating and thermally conducting layer is at least partially disposed across the interface between the grown semiconductor layers of the light emitting device and the formed metal layers of the sub-mount to further improve the electrical isolation of the light emitting device from the grown sub-mount. The top surface of the LED is protected from electroplating or electroforming by a wax or polymer or other removable material on a temporary substrate, mould or mandrel, which can be removed after plating, thereby releasing the LED module for subsequent processing.

A light emitting module comprises a light emitting device (LED) mounted on a high thermal dissipation sub-mount, which performs the traditionally function of heat spread and the first part of the heat sinking. The sub-mount is a grown metal that is formed by an electroplating, electroforming, electrodeposition or electroless plating process, thereby minimizing thermal resistance at this stage. An electrically insulating and thermally conducting layer is at least partially disposed across the interface between the grown semiconductor layers of the light emitting device and the formed metal layers of the sub-mount to further improve the electrical isolation of the light emitting device from the grown sub-mount. The top surface of the LED is protected from electroplating or electroforming by a wax or polymer or other removable material on a temporary substrate, mold or mandrel, which can be removed after plating, thereby releasing the LED module for subsequent processing.

Thermal interface compositions contain filler particles possessing a maximum particle size less than 25 microns in diameter blended with a polymer matrix. Such compositions enable lower attainable bond line thickness, which decreases in-situ thermal resistances that exist between thermal interface materials and the corresponding mating surfaces.

A lighting device comprising a solid state light emitter and a fan, the fan blowing fluid toward the emitter. A lighting device comprising a solid state light emitter and a baffle, the solid state light emitter being movable. A lighting device comprising a solid state light emitter, a substrate and a diaphragm, the diaphragm defining a chamber having a valve and being movable. A lighting device comprising a housing and a solid state light emitter within the housing, the solid state light emitter being movable. Also, methods of cooling a lighting device.

A wearable thermometer patch for continuous wearing by a user includes a circuit substrate that includes an electric circuit, a battery holder mounted in the circuit substrate, and a detachable cover layer on the battery holder. The battery holder can hold a replaceable battery to supply power to the electric circuit. A temperature probe unit in connection with the electric circuit includes one or more temperature sensors in electric connection with the electric circuit in the circuit substrate. The one or more temperature sensors each can measure temperatures near the user's skin to produce one or more temperature values.

The present invention relates to an LED module for illumination, and more particularly, to an LED module for illumination capable of enhancing light emitting efficiency by having a light emitting structure, in which the thickness of an insulation substrate with an electrode pattern formed on a top portion thereof is minimized, a heat radiation substrate is formed by integrally attaching a radiator to a bottom surface of the insulation substrate, and LED elements are attached to the electrode pattern of the heat radiation substrate through silver epoxy with excellent heat conductivity as an adhesive agent, so that heat generated from the LED elements can effectively radiate through the radiator, white light is effectively generated from the light emitted from the LED elements, and the white light can be emitted to the outside maximally.

A compact, inexpensive self-regulating heater for heating a surface to a prescribed temperature. A first embodiment comprises a PTC ceramic heating element which is conductively bonded directly to heavy copper (or brass) electrodes, which conduct both heat and electricity with low resistance and present a smooth, extended heat transfer surface. At least one of the electrodes (on at least one side of the PTC element) is configured for maximum surface area in contact with the article being heated. The preferred methods of manufacture of this invention result in the electrodes being prestressed in tension while the ceramic element is prestressed in compression at room temperature. Upon heating, during use, these stresses tend to disappear as the electrodes expand. A second embodiment comprises a heater tape constructed of multiple modules which are electrically and mechanically connected with bus wires having a bend therein to facilitate the wires being bent in the side to side direction as well as in the up and down direction so that the heater tape can follow an irregular path. The modules are mounted in a flexible rubber skeleton which is sharply necked down between the modules to allow ease of bending in the side-to-side direction as well as in the up and down direction.

A forward converter comprises a magnetic component with a transformer and a filter output inductor. Also disclosed is a method for assembly of a forward converter. A first and a second U / UR core are arranged to form an O-core. Windings of the transformer are arranged on the O-core. A bobbin-less U / UR core is arranged to abut the O-core, and windings of a filter output inductor are arranged directly on a body section of the bobbin-less U / UR core. Alternatively, windings of the transformer are arranged on a first section of an E / ER core, and windings of the filter output inductor are arranged directly on a second, bobbin-less section of the E / ER core.

A multi-layer diffusion medium substrate having improved mechanical properties is disclosed. The diffusion medium substrate includes at least one stiff layer and at least one compressible layer. The at least one stiff layer has a greater stiffness in the x-y direction as compared to the at least one compressible layer. The at least one compressible layer has a greater compressibility in the z direction. A method of fabricating a multi-layer diffusion medium substrate is also disclosed.

A wearable thermometer patch includes a flexible circuit substrate comprising an electric circuit and an opening, a thermally conductive cup having a bottom portion plugged into the opening and fixed to the flexible circuit substrate, and a temperature sensor inside the thermally conductive cup. The temperature sensor is in thermal conduction with the thermally conductive cup. The temperature sensor is electrically connected to the electric circuit in the flexible circuit substrate.

A defrosting device for use in a household or commercial environment to effectively defrost frozen food packages is described. The device consists of three major parts; a top shell, a bottom shell and a hinge mechanism connecting the top shell and the bottom shell to allow the top shell to rotate around the hinge to open and close relative to the bottom shell. To defrost a frozen food package, the defrosting device rests on a flat surface, such as on a countertop, and the frozen food package is sandwiched between the top shell and the bottom shell. Since resistance to heat transfer from the ambient, air and from the flat surface to the frozen food package is minimized through the paths along the top shell as well as the bottom shell, the defrosting device is able to effectively defrost frozen food packages.

A wearable thermometer patch includes a substrate and a temperature probe unit mounted in the substrate and configured to measure temperature of a user's skin. The temperature probe unit includes a force sensor configured to measure contact force between the temperature probe unit and the user' skin, a plate, a first temperature sensor attached to a lower surface of the plate, and a second temperature sensor attached to an upper surface of the plate.

A thermal flux steering device and method for steering thermal flux into a concentrated area is provided. The thermal flux steering device includes a matrix impregnated with a plurality of thermally conductive inclusions. The thermally conductive inclusions are angled so as to steer thermal flux into a concentrated area such as a thermal energy sink in communication with the matrix. The thermally conductive inclusions may be filler fibers or thermally conductive particles impregnated within the matrix. Orientation of the thermally conductive inclusions may be determined by detecting the thermal flux of the thermal energy source, the thermodynamic properties of the matrix and the thermally conductive inclusions, and the location of the flux concentration area.

In an anesthesia vaporizer for vaporizing an anesthetic agent liquid and a method of vaporizing an anesthetic agent liquid in an vaporizer, an evaporation unit evaporates the anesthetic agent, a delivery unit intermittently adds a volume of said liquid to the evaporation unit in order to evaporate at least a portion of the volume of the liquid from the evaporation unit. A heat energy storage unit includes a phase change material (PCM) and is thermally coupled to at least a portion of the evaporation unit. The PCM has a phase shift temperature that is higher than the evaporation temperature of the anesthetic agent. The PCM in the heat energy storage unit is preferably at least partly liquid at an operative temperature of the vaporizer.

A thermal flux steering device and method for steering thermal flux into a concentrated area is provided. The thermal flux steering device includes a matrix impregnated with a plurality of thermally conductive inclusions. The thermally conductive inclusions are angled so as to steer thermal flux into a concentrated area such as a thermal energy sink in communication with the matrix. The thermally conductive inclusions may be filler fibers or thermally conductive particles impregnated within the matrix. Orientation of the thermally conductive inclusions may be determined by detecting the thermal flux of the thermal energy source, the thermodynamic properties of the matrix and the thermally conductive inclusions, and the location of the flux concentration area.

A broadband power amplifier using a novel high power feedback structure is disclosed in this patent. Feedback is widely used in amplifier design to broaden the bandwidth of the amplifier. Traditionally, the feedback resistor is either an axial resistor placed over the top of the transistor or a surface mount resistor with a long PCB trace making up the rest of the feedback path. However, each of these methods has it's limitations. The axial resistor doesn't have good heat sinking capability and therefore cannot handle high power. The feedback on PCB makes the feedback path long and becomes positive feedback at high frequency, thus limiting the high end frequency of operation of the amplifier in a stable region. The feedback structure disclosed in this patent has a good heat sinking path, has very short feedback path; allowing for higher frequency operation. We successfully applied the feedback structures to a Gallium Nitride (GaN) transistor, which is a new type of power transistor that has low parasitic capacitance and high optimum load impedance, and demonstrated an amplifier with very high output power over extraordinarily broad bandwidth. Matching networks have been optimized to improve performance and stability. We have demonstrated that unconditional stability is achievable while operating over a broad bandwidth using this feedback structure.

A wearable thermometer patch includes a substrate and a temperature probe unit mounted in the substrate and configured to measure temperature of a user's skin. The temperature probe unit includes a force sensor configured to measure contact force between the temperature probe unit and the user' skin, a plate, a first temperature sensor attached to a lower surface of the plate, and a second temperature sensor attached to an upper surface of the plate.

The present disclosure relates to an electric motor that may include a housing provided therein with an accommodating space; a stator having a stator core and provided in the accommodating space of the housing; a rotor having a rotor core and rotatably mounted inside the stator with an air gap therebetween; a rotating shaft provided therein with a hollow portion and having a plurality of rotating shaft injection holes formed at a central portion thereof, so that a cooling fluid introduced into the hollow portion is sprayed through the plurality of rotating shaft injection holes into the rotor core; and a plurality of cooling passages provided in the rotor core, and having one side thereof communicating with each of the plurality of rotating shaft injection holes and another side thereof communicating with the accommodating space, so that the cooling fluid is sprayed in different directions toward opposite ends to a central portion of the rotor core.

An integrated SAW device features an electronic assembly, a SAW device mounted to the electronic assembly, and a heater element on the SAW device to minimize thermal resistance between the SAW device and the heater element.

The invention relates to an LED (Light Emitting Diode) light emitting module, which is provided with a bottom plate (1) with at least one groove (2) and at least one printed circuit board (3) with an LED chip (4) array, wherein the at least one printed circuit board (3) is arranged in the groove (2) respectively; the LED light emitting module is characterized in that each LED chip (4) is directly arranged on the printed circuit board (3) by using a COB (Chip On Board) process; and a reflector (5) which is positioned on a side wall of the groove (2) is also arranged to reflect light from the LED chip (4). In addition, the invention also relates to a manufacturing method of the LED light emitting module. According to the LED light emitting module, a polarization effect can be produced, so that the LED light emitting module is particularly suitable for roadway lighting; and the LED light emitting module also has the advantages of simple structure, low cost and small heat resistance.

A system for clamping a heat sink that prevents excessive clamping force is provided. The system may include a heat sink, a semiconductor device, a printed circuit board, and a cover. The semiconductor device may be mounted onto the circuit board and attached to the cover. The heat sink may be designed to interface with the semiconductor device to transfer heat away from the semiconductor device and dissipate the heat into the environment. Accordingly, the heat sink may be clamped into a tight mechanical connection with the semiconductor device to minimize thermal resistance between the semiconductor device and the heat sink. To prevent excessive clamping force from damaging the semiconductor device, loading columns may extend between the cover and the heat sink.

A modular power supply and a method for manufacturing the same are disclosed. The modular power supply comprises a printed circuit board, power components, and a heat sink. The power components are mounted on the printed circuit board and disposed at a side opposite to the heat sink, a lower surface of the printed circuit board is engaged with an upper surface of the heat sink which is planar, and an insulating layer is disposed between the upper surface of the heat sink and the lower surface of the printed circuit board. A method for manufacturing the modular power supply is also disclosed. The modular power supply has excellent heat dissipation effect, and the production and assembly process thereof is simplified, so that the production efficiency is improved and the quality is guaranteed.

Disclosed herein is an LED lamp apparatus for a vehicle, which includes a heat sink, a printed circuit board including an electric circuit and disposed on the heat sink, an LED disposed between the heat sink and the printed circuit board, the LED being in contact with the heat sink, and an electrode binder extending to the LED through the printed circuit board and electrically connecting the printed circuit board and the LED.